Ryszard Kisiel
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- General Materials Science top 2%
- Condensed Matter Physics
- Materials Chemistry
- Topics
- Electronic Packaging and Soldering Technologies (38 papers)Silicon Carbide Semiconductor Technologies (21 papers)3D IC and TSV technologies (20 papers)
In The Last Decade
Ryszard Kisiel
59 papers receiving 438 citations
Peers
Comparison fields: 5 of 36
- Electrical and Electronic Engineering 404
- Mechanical Engineering 221
- General Materials Science 49
- Condensed Matter Physics 42
- Materials Chemistry 42
Countries citing papers authored by Ryszard Kisiel
This map shows the geographic impact of Ryszard Kisiel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ryszard Kisiel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ryszard Kisiel more than expected).
Fields of papers citing papers by Ryszard Kisiel
This network shows the impact of papers produced by Ryszard Kisiel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ryszard Kisiel. The network helps show where Ryszard Kisiel may publish in the future.
Co-authorship network of co-authors of Ryszard Kisiel
This figure shows the co-authorship network connecting the top 25 collaborators of Ryszard Kisiel. A scholar is included among the top collaborators of Ryszard Kisiel based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ryszard Kisiel. Ryszard Kisiel is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 3 | |
| 3 | 4 | |
| 4 | 11 | |
| 5 | 16 | |
| 6 | 9 | |
| 7 | 2 | |
| 8 | 9 | |
| 9 | Mechanical and thermal properties of SiC : ceramics substrate interface | 2 |
| 10 | 9 | |
| 11 | Problemy montażu struktur SiC stosowanych w elektronice wysokich temperatur i dużych mocy | 0 |
| 12 | 1 | |
| 13 | lead-free solder joints in microelectronic thick film technology | 1 |
| 14 | 4 | |
| 15 | Problemy technologiczne i materiałowe zamiany technologii ołowiowych na bezołowiowe w montażu elektronicznym | 1 |
| 16 | Electrical and mechanical studies of the Sn-Ag-Cu-Bi and Sn-Ag-Cu-Bi-Sb lead free soldering materials | 1 |
| 17 | 7 | |
| 18 | Wpływ temperatury lutowania na rozpływność lutów SnAg i SnAgCu na różnych podłożach | 0 |
| 19 | 14 | |
| 20 | Czy i jak stosować montaż bezołowiowy | 0 |
About Ryszard Kisiel
Ryszard Kisiel is a scholar working on General Materials Science, Electrical and Electronic Engineering and Mechanical Engineering, having authored 67 papers that have together received 456 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (38 papers), Silicon Carbide Semiconductor Technologies (21 papers) and 3D IC and TSV technologies (20 papers). The work is most often cited by research in General Materials Science (49 citations), Electrical and Electronic Engineering (404 citations) and Mechanical Engineering (221 citations). Ryszard Kisiel has collaborated with scholars based in Poland, Japan and China. Frequent co-authors include Z Szczepański, Z. Moser, K. Bukat, J. Pstruś, J. Sitek, W. Gąsior, M. Guziewicz, Krzysztof Górecki, Paweł Górecki and Ikuo Ohnuma. Their work appears in journals such as IEEE Transactions on Electron Devices, Materials and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.