J. Read

762 total citations
21 papers, 668 citations indexed

About

J. Read is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, J. Read has authored 21 papers receiving a total of 668 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Electrical and Electronic Engineering, 20 papers in Mechanical Engineering and 8 papers in Aerospace Engineering. Recurrent topics in J. Read's work include Electronic Packaging and Soldering Technologies (21 papers), Aluminum Alloy Microstructure Properties (8 papers) and Intermetallics and Advanced Alloy Properties (8 papers). J. Read is often cited by papers focused on Electronic Packaging and Soldering Technologies (21 papers), Aluminum Alloy Microstructure Properties (8 papers) and Intermetallics and Advanced Alloy Properties (8 papers). J. Read collaborates with scholars based in Australia, United Kingdom and Japan. J. Read's co-authors include Kazuhiro Nogita, Stuart D. McDonald, Dekui Mu, C.M. Gourlay, Yueqin Wu, A. K. Dahle, Han Huang, Qinfen Gu, Tetsuro Nishimura and Guang Zeng and has published in prestigious journals such as Acta Materialia, Materials Science and Engineering A and Scripta Materialia.

In The Last Decade

J. Read

20 papers receiving 658 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
J. Read Australia	14	630	478	147	74	60	21	668
L. Zavalij United States	12	492 0.8×	351 0.7×	129 0.9×	45 0.6×	22 0.4×	14	523
N. Kurokawa Japan	9	425 0.7×	455 1.0×	148 1.0×	82 1.1×	89 1.5×	10	560
J. K. Lin United States	6	606 1.0×	428 0.9×	115 0.8×	41 0.6×	20 0.3×	8	616
A. M. El-Taher Egypt	13	664 1.1×	556 1.2×	146 1.0×	40 0.5×	25 0.4×	26	723
H. K. Kim United States	7	502 0.8×	364 0.8×	67 0.5×	47 0.6×	17 0.3×	9	526
M. Li Singapore	9	535 0.8×	404 0.8×	57 0.4×	46 0.6×	30 0.5×	10	557
Moon Gi Cho South Korea	15	520 0.8×	381 0.8×	123 0.8×	53 0.7×	9 0.1×	26	554
Zhixian Min China	14	440 0.7×	439 0.9×	102 0.7×	36 0.5×	15 0.3×	29	554
K. N. Tu United States	9	813 1.3×	398 0.8×	109 0.7×	56 0.8×	54 0.9×	12	848
Masanori Kajihara Japan	13	217 0.3×	533 1.1×	172 1.2×	117 1.6×	23 0.4×	43	597

Countries citing papers authored by J. Read

Since Specialization

Citations

This map shows the geographic impact of J. Read's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Read with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Read more than expected).

Fields of papers citing papers by J. Read

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Read. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Read. The network helps show where J. Read may publish in the future.

Co-authorship network of co-authors of J. Read

This figure shows the co-authorship network connecting the top 25 collaborators of J. Read. A scholar is included among the top collaborators of J. Read based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Read. J. Read is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Nogita, Kazuhiro, et al.. (2016). Effects of Trace Phosphorus in Sn-Cu-Ni Wave Solder Dross. Materials science forum. 857. 49–52. 6 indexed citations

Zeng, Guang, et al.. (2016). Peritectic Reactions and Phase Transformations of Sn-30wt%Cu for High Temperature Pb-Free Soldering Applications. Materials science forum. 857. 58–62. 5 indexed citations

Nogita, Kazuhiro, et al.. (2016). Suppression of Cu<sub>3</sub>Sn with Ni in High Cu Containing Sn-Cu Solder Alloys. Materials science forum. 857. 53–57. 3 indexed citations

Mu, Dekui, Stuart D. McDonald, J. Read, Hui Huang, & Kazuhiro Nogita. (2016). ChemInform Abstract: Critical Properties of Cu₆Sn₅ in Electronic Devices: Recent Progress and a Review. ChemInform. 47(19). 1 indexed citations

Zeng, Guang, Stuart D. McDonald, J. Read, Qinfen Gu, & Kazuhiro Nogita. (2014). Kinetics of the polymorphic phase transformation of Cu6Sn5. Acta Materialia. 69. 135–148. 46 indexed citations

Nogita, Kazuhiro, C.M. Gourlay, Stuart D. McDonald, et al.. (2013). XRD study of the kinetics of β ↔ α transformations in tin. The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics. 93(27). 3627–3647. 29 indexed citations

Mu, Dekui, Han Huang, Stuart D. McDonald, J. Read, & Kazuhiro Nogita. (2013). Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on diverse crystal planes. Materials Science and Engineering A. 566. 126–133. 37 indexed citations

Nogita, Kazuhiro, Dekui Mu, Stuart D. McDonald, J. Read, & Yueqin Wu. (2012). Effect of Ni on phase stability and thermal expansion of Cu6−xNixSn5 (X = 0, 0.5, 1, 1.5 and 2). Intermetallics. 26. 78–85. 71 indexed citations

Wu, Yueqin, Stuart D. McDonald, J. Read, Han Huang, & Kazuhiro Nogita. (2012). Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5. Scripta Materialia. 68(8). 595–598. 29 indexed citations

10.

McDonald, Stuart D., et al.. (2012). Influence of Composition on the Morphology of Primary Cu6Sn5 in Sn-4Cu Alloys. Journal of Electronic Materials. 42(2). 256–262. 29 indexed citations

11.

Mu, Dekui, J. Read, Yafeng Yang, & Kazuhiro Nogita. (2011). Thermal expansion of Cu₆Sn₅ and (Cu,Ni)₆Sn₅. Journal of materials research/Pratt's guide to venture capital sources. 26(20). 2660–2664. 52 indexed citations

12.

Sweatman, Keith, et al.. (2011). The Effect Of Microalloy Additions On The Morphology And Growth Of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders. Queensland's institutional digital repository (The University of Queensland). 13(1). 703–708.

13.

Nogita, Kazuhiro, C.M. Gourlay, Stuart D. McDonald, et al.. (2011). Kinetics of the η–η′ transformation in Cu6Sn5. Scripta Materialia. 65(10). 922–925. 70 indexed citations

14.

Nogita, Kazuhiro, et al.. (2009). Inhibition of cracking in Cu6Sn5 intermetallic compounds at Sn-Cu lead-free solders and Cu substrate interfaces. Queensland's institutional digital repository (The University of Queensland). 1–6. 5 indexed citations

15.

Gourlay, C.M., Kazuhiro Nogita, J. Read, & A. K. Dahle. (2009). Intermetallic Formation and Fluidity in Sn-Rich Sn-Cu-Ni Alloys. Journal of Electronic Materials. 39(1). 56–69. 48 indexed citations

16.

Tsukamoto, Hideaki, et al.. (2009). Impact strength of Sn-Cu (-Ni) lead-free solder ball grid arrays placed on Cu substrates. Queensland's institutional digital repository (The University of Queensland). 2 indexed citations

17.

Nogita, Kazuhiro, et al.. (2009). Inhibiting Cracking of Interfacial Cu6Sn5 by Ni Additions to Sn-based Lead-free Solders. 2(1). 46–54. 42 indexed citations

18.

Nogita, Kazuhiro, et al.. (2008). Effects of Phosphorus on Microstructure and Fluidity of Sn-0.7Cu-0.05Ni Lead-Free Solder. MATERIALS TRANSACTIONS. 49(3). 443–448. 23 indexed citations

19.

Gourlay, C.M., J. Read, Kazuhiro Nogita, & A. K. Dahle. (2007). The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys. Journal of Electronic Materials. 37(1). 51–60. 37 indexed citations

20.

Nogita, Kazuhiro, et al.. (2005). Microstructure Control in Sn–0.7 mass%Cu Alloys. MATERIALS TRANSACTIONS. 46(11). 2419–2425. 39 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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