J. Pstruś

2.0k total citations
81 papers, 1.7k citations indexed

About

J. Pstruś is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and General Materials Science. According to data from OpenAlex, J. Pstruś has authored 81 papers receiving a total of 1.7k indexed citations (citations by other indexed papers that have themselves been cited), including 66 papers in Electrical and Electronic Engineering, 53 papers in Mechanical Engineering and 32 papers in General Materials Science. Recurrent topics in J. Pstruś's work include Electronic Packaging and Soldering Technologies (66 papers), Metallurgical and Alloy Processes (31 papers) and 3D IC and TSV technologies (20 papers). J. Pstruś is often cited by papers focused on Electronic Packaging and Soldering Technologies (66 papers), Metallurgical and Alloy Processes (31 papers) and 3D IC and TSV technologies (20 papers). J. Pstruś collaborates with scholars based in Poland, Japan and Slovakia. J. Pstruś's co-authors include W. Gąsior, Z. Moser, Tomasz Gancarz, Przemysław Fima, Ikuo Ohnuma, J. Sitek, K. Bukat, K. Ishida, H. Henein and Piotr Bobrowski and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Applied Surface Science.

In The Last Decade

J. Pstruś

78 papers receiving 1.6k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
J. Pstruś Poland 25 1.2k 1.1k 442 429 270 81 1.7k
Z.P. Jin China 22 897 0.8× 400 0.4× 517 1.2× 287 0.7× 190 0.7× 72 1.3k
Tomasz Gancarz Poland 21 824 0.7× 646 0.6× 453 1.0× 137 0.3× 284 1.1× 71 1.2k
Donatella Giuranno Italy 21 955 0.8× 320 0.3× 472 1.1× 237 0.6× 230 0.9× 74 1.3k
Maria Luigia Muolo Italy 24 1.2k 1.0× 263 0.2× 612 1.4× 92 0.2× 214 0.8× 57 1.6k
Yee‐Wen Yen Taiwan 22 825 0.7× 984 0.9× 246 0.6× 132 0.3× 161 0.6× 106 1.3k
Paul T. Vianco United States 23 1.6k 1.4× 2.1k 2.0× 270 0.6× 241 0.6× 460 1.7× 133 2.4k
М. А. Турчанин Ukraine 20 1.0k 0.9× 100 0.1× 579 1.3× 328 0.8× 132 0.5× 95 1.2k
Kil-Won Moon United States 14 851 0.7× 868 0.8× 224 0.5× 108 0.3× 325 1.2× 32 1.3k
Chin C. Lee United States 21 450 0.4× 975 0.9× 245 0.6× 74 0.2× 65 0.2× 94 1.3k
Olivier Dezellus France 24 1.0k 0.9× 299 0.3× 593 1.3× 48 0.1× 291 1.1× 53 1.4k

Countries citing papers authored by J. Pstruś

Since Specialization
Citations

This map shows the geographic impact of J. Pstruś's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Pstruś with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Pstruś more than expected).

Fields of papers citing papers by J. Pstruś

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Pstruś. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Pstruś. The network helps show where J. Pstruś may publish in the future.

Co-authorship network of co-authors of J. Pstruś

This figure shows the co-authorship network connecting the top 25 collaborators of J. Pstruś. A scholar is included among the top collaborators of J. Pstruś based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Pstruś. J. Pstruś is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Gancarz, Tomasz, Piotr Ozga, J. Pstruś, et al.. (2023). The Interfacial Phenomena Between Graphene on Cu Substrate Covered by Ni, Cu, or W Layer, with Liquid Ga-Sn-Zn Alloy. Journal of Materials Engineering and Performance. 32(13). 5703–5709. 1 indexed citations
3.
Pstruś, J., et al.. (2023). New Solder Based on the Sn-Zn Eutectic with Addition of Ag, Al, and Li. Journal of Materials Engineering and Performance. 32(13). 5710–5722. 6 indexed citations
4.
Czaja, Paweł, et al.. (2023). Phase Evolution at the Interface between Liquid Solder Sn-Zn-Ag and Cu Substrate Studied by In Situ Heating Scanning Transmission Electron Microscopy. Journal of Materials Engineering and Performance. 32(13). 5749–5755. 1 indexed citations
5.
Czaja, Paweł, et al.. (2023). Wetting and Interfacial Chemistry of New Pb-Free Sn-Zn-Ag-Al-Li (SZAAL) Solder with Cu, Ni, and Al Substrates. Journal of Materials Engineering and Performance. 32(13). 5723–5730. 4 indexed citations
6.
7.
Gancarz, Tomasz, J. Pstruś, & Katarzyna Berent. (2016). Interfacial Reactions of Zn-Al Alloys with Na Addition on Cu Substrate During Spreading Test and After Aging Treatments. Journal of Materials Engineering and Performance. 25(8). 3366–3374. 6 indexed citations
8.
Dutkiewicz, J., et al.. (2015). Copper matrix composites strengthened with carbon nanotubes or graphene platelets prepared by ball milling and vacuum hot pressing. 15(3). 174–180. 1 indexed citations
9.
Fima, Przemysław, J. Pstruś, & Tomasz Gancarz. (2014). Wetting and Interfacial Chemistry of SnZnCu Alloys with Cu and Al Substrates. Journal of Materials Engineering and Performance. 23(5). 1530–1535. 19 indexed citations
10.
Pstruś, J., et al.. (2011). Influence of the Reforging Degree on the Annihilation of the Segregation Defects in the Massive Forging Ingots. Archives of Metallurgy and Materials. 56(4). 3 indexed citations
11.
Pstruś, J., Przemysław Fima, & W. Gąsior. (2011). Surface Tension, Density, and Thermal Expansion of (Bi-Ag)eut-Zn Alloys. Journal of Electronic Materials. 40(12). 2465–2469. 5 indexed citations
12.
13.
Bukat, K., et al.. (2008). Trends in wettability studies df Pb-free solders. Basic and application. Part II. Relation between surface tension, interfacial tension and wertability of lead-free Sn-Zn and Sn-Bi-Sb alloys. Archives of Metallurgy and Materials. 1065–1074. 8 indexed citations
14.
Moser, Z., W. Gąsior, K. Bukat, J. Pstruś, & J. Sitek. (2008). Trends in wettability studies of Pb-free solders. Basic and application. Part I. Surface tension and density measurements of Sn-Zn- and Sn-Zn-Bi-Sb alloys. Experiment vs. modelling. Archives of Metallurgy and Materials. 1055–1063. 9 indexed citations
15.
Pstruś, J., Z. Moser, W. Gąsior, & A. Dębski. (2006). Surface tension and density measurements of liquid Sn-Zn alloys. Experiment vs. SURDATdatabase of Pb-free solders. Archives of Metallurgy and Materials. 335–343. 10 indexed citations
16.
Kisiel, Ryszard, W. Gąsior, Z. Moser, et al.. (2005). Electrical and mechanical studies of the Sn-Ag-Cu-Bi and Sn-Ag-Cu-Bi-Sb lead free soldering materials. Archives of Metallurgy and Materials. 1065–1071. 1 indexed citations
17.
Gąsior, W., Z. Moser, & J. Pstruś. (2004). Measurements of the surface tension and density of TIN based Sn-Ag-Cu-Sb liquid alloys. Archives of Metallurgy and Materials. 155–167. 8 indexed citations
18.
Moser, Z., W. Gąsior, J. Pstruś, et al.. (2004). Surface Tension and Density Measurements of Sn-Ag-Sb Liquid Alloys and Phase Diagram Calculations of the Sn-Ag-Sb ternary system. MATERIALS TRANSACTIONS. 45(3). 652–660. 35 indexed citations
19.
Moser, Z., W. Gąsior, & J. Pstruś. (2002). Lead-free soldering materials.. Inżynieria Materiałowa. 65–69. 5 indexed citations
20.
Gąsior, W., Z. Moser, J. Pstruś, & M. Kucharski. (2001). Viscosity of the lead-tin liquid alloys. 46(1). 23–32. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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