Fengqun Lang

626 total citations
30 papers, 526 citations indexed

About

Fengqun Lang is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Ceramics and Composites. According to data from OpenAlex, Fengqun Lang has authored 30 papers receiving a total of 526 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Mechanical Engineering, 21 papers in Electrical and Electronic Engineering and 8 papers in Ceramics and Composites. Recurrent topics in Fengqun Lang's work include Electronic Packaging and Soldering Technologies (15 papers), Aluminum Alloys Composites Properties (15 papers) and Silicon Carbide Semiconductor Technologies (11 papers). Fengqun Lang is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), Aluminum Alloys Composites Properties (15 papers) and Silicon Carbide Semiconductor Technologies (11 papers). Fengqun Lang collaborates with scholars based in Japan, China and Indonesia. Fengqun Lang's co-authors include Zhi‐Ming Yu, Toshio Narita, Hiroshi Yamaguchi, Hiroshi Sato, Hiroshi Nakagawa, S. Gedevanishvili, S.C. Deevi, Hiromichi Ohashi, Hirohisa Tanaka and Taguchi Toshihiko and has published in prestigious journals such as Journal of The Electrochemical Society, Japanese Journal of Applied Physics and Surface and Coatings Technology.

In The Last Decade

Fengqun Lang

30 papers receiving 501 citations

Peers

Countries citing papers authored by Fengqun Lang

Since Specialization

Citations

This map shows the geographic impact of Fengqun Lang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fengqun Lang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fengqun Lang more than expected).

Fields of papers citing papers by Fengqun Lang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fengqun Lang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fengqun Lang. The network helps show where Fengqun Lang may publish in the future.

Co-authorship network of co-authors of Fengqun Lang

This figure shows the co-authorship network connecting the top 25 collaborators of Fengqun Lang. A scholar is included among the top collaborators of Fengqun Lang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fengqun Lang. Fengqun Lang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Thermal resistance evaluation of die-attachment made of nano-composite Cu/Sn TLPS paste in SiC power module 2017 ·Fumiki Kato, Fengqun Lang, Hiroshi Nakagawa, Hiroshi Yamaguchi, (unknown), Keiji Okada, (unknown), (unknown), (unknown), (unknown), Hiroshi Sato	5
2	Low Temperature Bonding Technology for 250 °C-Operating SiC Power Modules Using Nano-Composite Cu/Sn Paste 2016 ·Fengqun Lang, Fumiki Kato, Hiroshi Nakagawa, Hiroshi Yamaguchi, Hiroshi Sato, (unknown), Hiroaki Ikeda, Koichi Shimokawa, (unknown), (unknown)	3
3	250 °C-Operated sandwich-structured all-SiC power module 2015 ·Japanese Journal of Applied Physics ·Fumiki Kato, Rejeki Simanjorang, Fengqun Lang, Hiroshi Nakagawa, Hiroshi Yamaguchi, Hiroshi Sato	10
4	Deformation and Oxidation of Copper Metallization on Ceramic Substrate During Thermal Cycling From −40 °C to 250 °C 2015 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·Fengqun Lang, Hiroshi Yamaguchi, Hiroshi Nakagawa, Hiroshi Sato	6
5	Solid-State Interfacial Reaction between Eutectic Au−Ge Solder and Cu/Ni(P)/Au Metalized Ceramic Substrate and Its Suppression 2015 ·Journal of Material Science and Technology ·Fengqun Lang, Hiroshi Yamaguchi, Hiroshi Nakagawa, Hiroshi Sato	15
6	Cyclic Thermal Stress-Induced Degradation of Cu Metallization on Si3N4 Substrate at −40°C to 300°C 2014 ·Journal of Electronic Materials ·Fengqun Lang, Hiroshi Yamaguchi, Hiroshi Nakagawa, Hiroshi Sato	26
7	Fabrication of Wire Bond-Less SiC Power Module with Sandwich Structure for High Temperature Device Operation 2013 ·Journal of The Japan Institute of Electronics Packaging ·Fumiki Kato, Fengqun Lang, Rejeki Simanjorang, Hiroshi Nakagawa, Hiroshi Yamaguchi, Hiroshi Sato	1
8	Development of SiC power module for high-speed switching operation 2013 ·Hiroshi Sato, Fumiki Kato, Hiroshi Nakagawa, Hiroshi Yamaguchi, Rejeki Simanjorang, Fengqun Lang	4
9	Precise Chip Joint Method with Sub-micron Au Particle for High-density SiC Power Module Operating at High Temperature 2013 ·Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ·Fumiki Kato, Fengqun Lang, Rejeki Simanjorang, Hiroshi Nakagawa, Hiroshi Yamaguchi, Hiroshi Sato	5
10	High temperature resistant joint technology for SiC power devices using transient liquid phase sintering process 2012 ·Fengqun Lang, Hiroshi Yamaguchi, Hiroshi Nakagawa, (unknown)	11
11	Improvement in Joint Reliability of SiC Power Devices by a Diffusion Barrier Between Au-Ge Solder and Cu/Ni(P)-Metalized Ceramic Substrates 2011 ·Journal of Electronic Materials ·Fengqun Lang, Hiroshi Yamaguchi, Hiromichi Ohashi, Hiroshi Sato	36
12	Long-term joint reliability of sic power devices at 330ºc 2009 ·European Microelectronics and Packaging Conference ·Fengqun Lang, Satoshi Tanimoto, Hiromichi Ohashi, Hiroshi Yamaguchi	4
13	A Novel Three-Dimensional Packaging Method for Al-Metalized SiC Power Devices 2009 ·IEEE Transactions on Advanced Packaging ·Fengqun Lang, Yoshikatsu Hayashi, Hiroshi Nakagawa, Masahiro Aoyagi, Hiromichi Ohashi	5
14	Joint Reliability of Double-Side Packaged SiC Power Devices to a DBC Substrate with High Temperature Solders 2008 ·Fengqun Lang, Yusuke Hayashi, Hiroshi Nakagawa, Masahiro Aoyagi, Hiromichi Ohashi	6
15	A novel chip joint method for high temperature operated SiC power modules 2006 ·Fengqun Lang, Yusuke Hayashi, Hiroshi Nakagawa, Masahiro Aoyagi, Hiromichi Ohashi	3
16	The effect of strain rate and temperature on the tensile properties of Sn–3.5Ag solder 2004 ·Materials Characterization ·Fengqun Lang, Hirohisa Tanaka, (unknown), Taguchi Toshihiko, Toshio Narita	69
17	Cyclic oxidation behavior of Fe-40Al sheet 2004 ·Intermetallics ·Fengqun Lang, Zhiming Yu, S. Gedevanishvili, S.C. Deevi, Toshio Narita	8
18	Isothermal oxidation behavior of a sheet alloy of Fe–40at.%Al at temperatures between 1073 and 1473 K 2003 ·Intermetallics ·Fengqun Lang, Zhiming Yu, S. Gedevanishvili, S.C. Deevi, Toshio Narita	32
19	Corrosion behavior of Fe-40Al sheet in N2–11.2O2–7.5CO2 atmospheres with various SO2 contents at 1273 K 2003 ·Intermetallics ·Fengqun Lang, Zhi‐Ming Yu, S. Gedevanishvili, S.C. Deevi, Shigenari Hayashi, Toshio Narita	26
20	The corrosion resistance and wear resistance of thick TiN coatings deposited by arc ion plating 2001 ·Surface and Coatings Technology ·Fengqun Lang, Zhi‐Ming Yu	98

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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