J. Sitek

472 total citations
59 papers, 364 citations indexed

About

J. Sitek is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and General Materials Science. According to data from OpenAlex, J. Sitek has authored 59 papers receiving a total of 364 indexed citations (citations by other indexed papers that have themselves been cited), including 46 papers in Electrical and Electronic Engineering, 27 papers in Mechanical Engineering and 13 papers in General Materials Science. Recurrent topics in J. Sitek's work include Electronic Packaging and Soldering Technologies (38 papers), 3D IC and TSV technologies (14 papers) and Metallurgical and Alloy Processes (11 papers). J. Sitek is often cited by papers focused on Electronic Packaging and Soldering Technologies (38 papers), 3D IC and TSV technologies (14 papers) and Metallurgical and Alloy Processes (11 papers). J. Sitek collaborates with scholars based in Poland, Japan and Sweden. J. Sitek's co-authors include K. Bukat, J. Pstruś, Z. Moser, W. Gąsior, Ryszard Kisiel, Małgorzata Jakubowska, Przemysław Fima, Tomasz Gancarz, Ikuo Ohnuma and K. Ishida and has published in prestigious journals such as Microelectronics Reliability, Journal of Materials Engineering and Performance and Journal of Phase Equilibria and Diffusion.

In The Last Decade

J. Sitek

50 papers receiving 347 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
J. Sitek Poland 10 310 213 74 35 32 59 364
Ning-Cheng Lee Taiwan 11 548 1.8× 348 1.6× 33 0.4× 25 0.7× 48 1.5× 76 576
Mohd Izrul Izwan Ramli Malaysia 11 336 1.1× 258 1.2× 38 0.5× 34 1.0× 16 0.5× 54 396
Abdullah Fahim United States 11 314 1.0× 207 1.0× 18 0.2× 22 0.6× 68 2.1× 36 380
A. Guédon-Gracia France 8 190 0.6× 111 0.5× 7 0.1× 22 0.6× 37 1.2× 33 223
Shuang Tian China 10 203 0.7× 227 1.1× 14 0.2× 42 1.2× 25 0.8× 32 319
Won Sik Hong South Korea 10 268 0.9× 144 0.7× 5 0.1× 35 1.0× 19 0.6× 42 333
Robert Starosta Poland 11 37 0.1× 225 1.1× 57 0.8× 77 2.2× 61 1.9× 52 295
Maria Abu Bakar Malaysia 10 209 0.7× 252 1.2× 6 0.1× 60 1.7× 68 2.1× 67 406
Jan Felba Poland 11 314 1.0× 94 0.4× 10 0.1× 74 2.1× 61 1.9× 81 416
А. Д. Быкова Russia 8 24 0.1× 124 0.6× 58 0.8× 95 2.7× 39 1.2× 67 206

Countries citing papers authored by J. Sitek

Since Specialization
Citations

This map shows the geographic impact of J. Sitek's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Sitek with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Sitek more than expected).

Fields of papers citing papers by J. Sitek

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Sitek. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Sitek. The network helps show where J. Sitek may publish in the future.

Co-authorship network of co-authors of J. Sitek

This figure shows the co-authorship network connecting the top 25 collaborators of J. Sitek. A scholar is included among the top collaborators of J. Sitek based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Sitek. J. Sitek is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Czaja, Paweł, et al.. (2023). Wetting and Interfacial Chemistry of New Pb-Free Sn-Zn-Ag-Al-Li (SZAAL) Solder with Cu, Ni, and Al Substrates. Journal of Materials Engineering and Performance. 32(13). 5723–5730. 4 indexed citations
2.
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Nissen, Nils F., et al.. (2012). Life Cycle thinking in small and medium sized enterprises - Status quo and strategic needs in the electronics sector. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–6. 4 indexed citations
4.
Sitek, J., et al.. (2012). Influence of modified carbon nanotubes addition to SAC solder paste on solder joints properties and their thermal and mechanical fatigue. 1–6. 1 indexed citations
5.
Sitek, J., et al.. (2011). Investigation of inkjet technology for printed organic electronics. Elektronika : konstrukcje, technologie, zastosowania. 52. 112–114. 2 indexed citations
6.
Sitek, J., et al.. (2011). Wpływ jakości powłok na płytce drukowanej na wyniki lutowania bezołowiowego. Elektronika : konstrukcje, technologie, zastosowania. 52. 75–81. 1 indexed citations
7.
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9.
Sitek, J., et al.. (2009). Organiczna Elektronika : ekonomiczna alternatywa dla elektroniki. Elektronika : konstrukcje, technologie, zastosowania. 50. 95–99. 2 indexed citations
10.
Bukat, K., et al.. (2008). Trends in wettability studies df Pb-free solders. Basic and application. Part II. Relation between surface tension, interfacial tension and wertability of lead-free Sn-Zn and Sn-Bi-Sb alloys. Archives of Metallurgy and Materials. 1065–1074. 8 indexed citations
11.
Sitek, J.. (2008). Kontrola lutowności materiałów i podzespołów elektronicznych metodą meniskograficzną. Elektronika : konstrukcje, technologie, zastosowania. 49. 51–54.
12.
Moser, Z., W. Gąsior, K. Bukat, J. Pstruś, & J. Sitek. (2008). Trends in wettability studies of Pb-free solders. Basic and application. Part I. Surface tension and density measurements of Sn-Zn- and Sn-Zn-Bi-Sb alloys. Experiment vs. modelling. Archives of Metallurgy and Materials. 1055–1063. 9 indexed citations
13.
Sitek, J.. (2007). Problemy montażowe złożonych zespołów elektronicznych. Elektronika : konstrukcje, technologie, zastosowania. 48. 24–28.
14.
Sitek, J., et al.. (2006). Projekt GreenRoSE - doświadczenia w bezołowiowym lutowaniu rozpływowym i na fali. 74–83.
15.
Sitek, J.. (2006). Wybrane czynniki wpływające na bezołowiowe lutowanie rozpływowe. Elektronika : konstrukcje, technologie, zastosowania. 47. 40–44. 1 indexed citations
16.
Sitek, J., et al.. (2006). Wettability of lead-free PCBs finishes after long-term natural storage. Elektronika : konstrukcje, technologie, zastosowania. 47. 33–35. 2 indexed citations
17.
Sitek, J.. (2005). Adaptacja agregatu lutowniczego do bezołowiowej technologii lutowania na fali lutowia i badania topników wodnych. Elektronika : konstrukcje, technologie, zastosowania. 46. 55–57. 1 indexed citations
18.
Kisiel, Ryszard, W. Gąsior, Z. Moser, et al.. (2005). Electrical and mechanical studies of the Sn-Ag-Cu-Bi and Sn-Ag-Cu-Bi-Sb lead free soldering materials. Archives of Metallurgy and Materials. 1065–1071. 1 indexed citations
19.
Sitek, J., et al.. (2004). Preliminary trials of mass lead free reflow soldering. Elektronika : konstrukcje, technologie, zastosowania. 45. 209–212.
20.
Sitek, J., et al.. (2004). A comparison of the quality of lead‐free solder pastes. Soldering and Surface Mount Technology. 16(3). 22–30. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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