G. Humpston

667 total citations
29 papers, 458 citations indexed

About

G. Humpston is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and General Materials Science. According to data from OpenAlex, G. Humpston has authored 29 papers receiving a total of 458 indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 6 papers in General Materials Science. Recurrent topics in G. Humpston's work include Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (7 papers) and Metallurgical and Alloy Processes (5 papers). G. Humpston is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), 3D IC and TSV technologies (7 papers) and Metallurgical and Alloy Processes (5 papers). G. Humpston collaborates with scholars based in United Kingdom. G. Humpston's co-authors include David M. Jacobson and S. P. S. Sangha and has published in prestigious journals such as International Materials Reviews, Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment and Materials Science and Technology.

In The Last Decade

G. Humpston

28 papers receiving 409 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
G. Humpston United Kingdom 12 303 287 65 62 59 29 458
K. Sakamoto Japan 10 428 1.4× 475 1.7× 68 1.0× 82 1.3× 150 2.5× 12 606
Vivek Chidambaram Singapore 13 569 1.9× 361 1.3× 57 0.9× 74 1.2× 42 0.7× 36 661
Ryszard Kisiel Poland 11 404 1.3× 221 0.8× 42 0.6× 49 0.8× 16 0.3× 67 456
S. Sommadossi Argentina 12 221 0.7× 306 1.1× 119 1.8× 89 1.4× 93 1.6× 32 455
B. P. Richards United Kingdom 11 194 0.6× 222 0.8× 146 2.2× 25 0.4× 85 1.4× 34 460
Przemysław Fima Poland 17 377 1.2× 456 1.6× 140 2.2× 142 2.3× 133 2.3× 43 613
Y. Takaku Japan 14 494 1.6× 498 1.7× 180 2.8× 140 2.3× 129 2.2× 21 724
Keith Sweatman Australia 10 279 0.9× 230 0.8× 67 1.0× 26 0.4× 52 0.9× 26 362
G. Matijasevic United States 10 465 1.5× 198 0.7× 51 0.8× 37 0.6× 15 0.3× 27 539
Ö. Ünal United States 13 289 1.0× 461 1.6× 215 3.3× 31 0.5× 92 1.6× 25 647

Countries citing papers authored by G. Humpston

Since Specialization
Citations

This map shows the geographic impact of G. Humpston's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by G. Humpston with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites G. Humpston more than expected).

Fields of papers citing papers by G. Humpston

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by G. Humpston. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by G. Humpston. The network helps show where G. Humpston may publish in the future.

Co-authorship network of co-authors of G. Humpston

This figure shows the co-authorship network connecting the top 25 collaborators of G. Humpston. A scholar is included among the top collaborators of G. Humpston based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with G. Humpston. G. Humpston is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Humpston, G.. (2009). Cobalt: a universal barrier metal for solderable under bump metallisations. Journal of Materials Science Materials in Electronics. 21(6). 584–588. 34 indexed citations
2.
3.
Humpston, G., et al.. (2008). Electrophoretic Materials in Wafer Level Packages for Solid State Imagers to Meet Automotive Reliability Standards. IEEE Transactions on Advanced Packaging. 31(1). 33–38. 1 indexed citations
4.
5.
Jacobson, David M. & G. Humpston. (2006). Fluxless soldering. International Materials Reviews. 51(5). 313–328. 4 indexed citations
6.
Jacobson, David M. & G. Humpston. (2005). Principles of Brazing. ASM International eBooks. 63 indexed citations
7.
Humpston, G. & David M. Jacobson. (2004). Principles of Soldering. ASM International eBooks. 94 indexed citations
8.
Humpston, G.. (1999). The essential role of gold in the fabrication of microwave electronics systems. Gold bulletin. 32(3). 75–79. 5 indexed citations
9.
Humpston, G., et al.. (1998). Diffusion bonding of gold. Gold bulletin. 31(4). 131–132. 4 indexed citations
10.
Humpston, G., et al.. (1997). Advanced flip-chip solder bonding. Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment. 395(3). 375–378. 4 indexed citations
11.
Jacobson, David M., G. Humpston, & S. P. S. Sangha. (1996). A new low-melting-point aluminum braze. Welding Journal. 75(8). 20 indexed citations
12.
Jacobson, David M. & G. Humpston. (1992). Gold in the Electronics Industry Some New Developments in Semiconductor Packaging. Interdisciplinary Science Reviews. 17(3). 244–250. 1 indexed citations
13.
Jacobson, David M. & G. Humpston. (1992). Diffusion Soldering. Soldering and Surface Mount Technology. 4(1). 27–32. 31 indexed citations
14.
Humpston, G. & David M. Jacobson. (1992). A new high strength gold bond wire. Gold bulletin. 25(4). 132–145. 14 indexed citations
15.
Jacobson, David M. & G. Humpston. (1989). Gold coatings for fluxless soldering. Gold bulletin. 22(1). 9–18. 53 indexed citations
16.
Humpston, G. & David M. Jacobson. (1989). Gold in gallium arsenide die-attach technology. Gold bulletin. 22(3). 79–91. 7 indexed citations
17.
Humpston, G., et al.. (1987). Constitution of Au–AuSn–Pb partial ternary system. Materials Science and Technology. 3(8). 621–627. 4 indexed citations
18.
Humpston, G., et al.. (1987). Constitution of Au–AuSn–Pb partial ternary system. Materials Science and Technology. 3(8). 621–627. 14 indexed citations
19.
Humpston, G., et al.. (1985). Constitution of AuSn–Pb–Sn partial ternary system. Materials Science and Technology. 1(6). 433–441. 11 indexed citations
20.
Humpston, G., et al.. (1984). Thermal analysis of AuSn-Pb quasibinary section. Metal Science. 18(6). 329–331. 9 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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