Omid Mokhtari

972 total citations
38 papers, 796 citations indexed

About

Omid Mokhtari is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Omid Mokhtari has authored 38 papers receiving a total of 796 indexed citations (citations by other indexed papers that have themselves been cited), including 34 papers in Electrical and Electronic Engineering, 26 papers in Mechanical Engineering and 4 papers in Biomedical Engineering. Recurrent topics in Omid Mokhtari's work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (22 papers) and Intermetallics and Advanced Alloy Properties (14 papers). Omid Mokhtari is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (22 papers) and Intermetallics and Advanced Alloy Properties (14 papers). Omid Mokhtari collaborates with scholars based in Japan, United Kingdom and Germany. Omid Mokhtari's co-authors include Hiroshi Nishikawa, S.H. Mannan, Hiren R. Kotadia, M.P. Clode, Shiqi Zhou, Mark Green, Gordon Elger, Fosca Conti, Bilal Mansoor and Vasanth Chakravarthy Shunmugasamy and has published in prestigious journals such as Journal of Applied Physics, Materials Science and Engineering A and Journal of Alloys and Compounds.

In The Last Decade

Omid Mokhtari

36 papers receiving 784 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Omid Mokhtari Japan 14 739 610 116 52 44 38 796
Tetsuro Nishimura Australia 10 474 0.6× 352 0.6× 93 0.8× 52 1.0× 35 0.8× 28 522
Zhixian Min China 14 440 0.6× 439 0.7× 102 0.9× 113 2.2× 36 0.8× 29 554
Moon Gi Cho South Korea 15 520 0.7× 381 0.6× 123 1.1× 42 0.8× 53 1.2× 26 554
Yi-Wun Wang Taiwan 14 684 0.9× 535 0.9× 82 0.7× 58 1.1× 55 1.3× 35 750
A. Fawzy Egypt 13 687 0.9× 663 1.1× 157 1.4× 71 1.4× 46 1.0× 24 767
Timothy Gosselin United States 8 759 1.0× 557 0.9× 203 1.8× 59 1.1× 44 1.0× 8 778
Zhong Sheng China 11 534 0.7× 476 0.8× 105 0.9× 28 0.5× 38 0.9× 15 575
A. M. El-Taher Egypt 13 664 0.9× 556 0.9× 146 1.3× 86 1.7× 40 0.9× 26 723
K. Sakamoto Japan 10 428 0.6× 475 0.8× 150 1.3× 68 1.3× 82 1.9× 12 606
G.Y. Li China 12 531 0.7× 470 0.8× 58 0.5× 24 0.5× 42 1.0× 21 563

Countries citing papers authored by Omid Mokhtari

Since Specialization
Citations

This map shows the geographic impact of Omid Mokhtari's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Omid Mokhtari with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Omid Mokhtari more than expected).

Fields of papers citing papers by Omid Mokhtari

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Omid Mokhtari. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Omid Mokhtari. The network helps show where Omid Mokhtari may publish in the future.

Co-authorship network of co-authors of Omid Mokhtari

This figure shows the co-authorship network connecting the top 25 collaborators of Omid Mokhtari. A scholar is included among the top collaborators of Omid Mokhtari based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Omid Mokhtari. Omid Mokhtari is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Mokhtari, Omid, et al.. (2020). Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol. Scripta Materialia. 182. 74–80. 33 indexed citations
3.
Mokhtari, Omid & Hiroshi Nishikawa. (2020). Effect of surface potential distribution on corrosion behavior of Cu/Al interface in Cu wire bonding applications. Microelectronics Reliability. 113. 113942–113942. 7 indexed citations
4.
Mokhtari, Omid, et al.. (2019). Characterization of tin-oxides and tin-formate crystals obtained from SnAgCu solder alloy under formic acid vapor. New Journal of Chemistry. 43(26). 10227–10231. 13 indexed citations
5.
Mokhtari, Omid, et al.. (2019). Hybrid Cu particle paste with surface-modified particles for high temperature electronics packaging. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–8. 4 indexed citations
6.
Mokhtari, Omid, et al.. (2019). Improved sinterability of particles to substrates by surface modifications on substrate metallization. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2019(HiTen). 66–70. 4 indexed citations
7.
Mokhtari, Omid. (2019). A review: Formation of voids in solder joint during the transient liquid phase bonding process - Causes and solutions. Microelectronics Reliability. 98. 95–105. 64 indexed citations
8.
Mokhtari, Omid, et al.. (2019). A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallization. IMAPSource Proceedings. 2019(1). 387–392. 3 indexed citations
9.
Conti, Fosca, et al.. (2018). Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor. New Journal of Chemistry. 42(23). 19232–19236. 18 indexed citations
10.
Zhou, Shiqi, et al.. (2018). Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging. Journal of Alloys and Compounds. 765. 1243–1252. 72 indexed citations
11.
He, Han, Xiaochen Chen, Omid Mokhtari, et al.. (2018). Textile-Integrated Stretchable Structures for Wearable Wireless Platforms. Trepo - Institutional Repository of Tampere University. 1–3. 1 indexed citations
12.
He, Han, Xiaochen Chen, Omid Mokhtari, et al.. (2018). Fabrication and Performance Evaluation of Carbon-based Stretchable RFID Tags on Textile Substrates. 1–5. 3 indexed citations
13.
Camacho, Drexel H., et al.. (2018). Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution. International Journal of Corrosion. 2018. 1–11. 9 indexed citations
14.
Mokhtari, Omid, Shiqi Zhou, Y.C. Chan, & Hiroshi Nishikawa. (2016). Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate. MATERIALS TRANSACTIONS. 57(8). 1272–1276. 14 indexed citations
15.
Mokhtari, Omid & Hiroshi Nishikawa. (2016). Transient liquid phase bonding of Sn–Bi solder with added Cu particles. Journal of Materials Science Materials in Electronics. 27(5). 4232–4244. 39 indexed citations
16.
Mokhtari, Omid & Hiroshi Nishikawa. (2015). Effects of Indium Content on the Tensile Properties of Sn-Bi-In Solder. OUKA (Osaka University Knowledge Archive) (Osaka University). 44(2). 19–22. 1 indexed citations
17.
Mokhtari, Omid, Min‐Su Kim, Hiroshi Nishikawa, et al.. (2014). Investigation of Formation and Growth Behavior of Cu/Al Intermetallic Compounds during Isothermal Aging. 7(1). 1–7. 9 indexed citations
18.
Mokhtari, Omid, Ali Roshanghias, Hiren R. Kotadia, et al.. (2012). Disabling of Nanoparticle Effects at Increased Temperature in Nanocomposite Solders. Journal of Electronic Materials. 41(7). 1907–1914. 19 indexed citations
19.
Kotadia, Hiren R., A. Panneerselvam, Omid Mokhtari, Martin A. Green, & S.H. Mannan. (2012). Massive spalling of Cu-Zn and Cu-Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction. Journal of Applied Physics. 111(7). 16 indexed citations
20.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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