Keith Sweatman

498 total citations
26 papers, 362 citations indexed

About

Keith Sweatman is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering. According to data from OpenAlex, Keith Sweatman has authored 26 papers receiving a total of 362 indexed citations (citations by other indexed papers that have themselves been cited), including 26 papers in Electrical and Electronic Engineering, 21 papers in Mechanical Engineering and 8 papers in Aerospace Engineering. Recurrent topics in Keith Sweatman's work include Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (13 papers) and Intermetallics and Advanced Alloy Properties (10 papers). Keith Sweatman is often cited by papers focused on Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (13 papers) and Intermetallics and Advanced Alloy Properties (10 papers). Keith Sweatman collaborates with scholars based in Australia, Japan and Malaysia. Keith Sweatman's co-authors include Kazuhiro Nogita, Stuart D. McDonald, Shiqian Liu, Tetsuro Nishimura, Qinfen Gu, A. K. Dahle, Hideaki Tsukamoto, J. Read, Xin Fu Tan and Syo Matsumura and has published in prestigious journals such as Scripta Materialia, Materials and JOM.

In The Last Decade

Keith Sweatman

21 papers receiving 356 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Keith Sweatman Australia 10 279 230 67 52 39 26 362
Tetsuro Nishimura Australia 10 474 1.7× 352 1.5× 52 0.8× 93 1.8× 20 0.5× 28 522
Vemal Raja Manikam Malaysia 7 433 1.6× 225 1.0× 82 1.2× 20 0.4× 41 1.1× 12 508
T. Kirkpatrick United States 6 325 1.2× 167 0.7× 83 1.2× 77 1.5× 57 1.5× 9 381
Yongjun Huo China 12 274 1.0× 123 0.5× 100 1.5× 25 0.5× 62 1.6× 43 351
G. Humpston United Kingdom 12 303 1.1× 287 1.2× 65 1.0× 59 1.1× 40 1.0× 29 458
Ryszard Kisiel Poland 11 404 1.4× 221 1.0× 42 0.6× 16 0.3× 21 0.5× 67 456
Min-Bo Zhou China 10 317 1.1× 140 0.6× 46 0.7× 31 0.6× 40 1.0× 67 354
S. Sommadossi Argentina 12 221 0.8× 306 1.3× 119 1.8× 93 1.8× 22 0.6× 32 455
L.A. Bendersky United States 6 272 1.0× 194 0.8× 110 1.6× 79 1.5× 36 0.9× 6 418
Vivek Chidambaram Singapore 13 569 2.0× 361 1.6× 57 0.9× 42 0.8× 66 1.7× 36 661

Countries citing papers authored by Keith Sweatman

Since Specialization
Citations

This map shows the geographic impact of Keith Sweatman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Keith Sweatman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Keith Sweatman more than expected).

Fields of papers citing papers by Keith Sweatman

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Keith Sweatman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Keith Sweatman. The network helps show where Keith Sweatman may publish in the future.

Co-authorship network of co-authors of Keith Sweatman

This figure shows the co-authorship network connecting the top 25 collaborators of Keith Sweatman. A scholar is included among the top collaborators of Keith Sweatman based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Keith Sweatman. Keith Sweatman is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Nogita, Kazuhiro, Xin Fu Tan, Stuart D. McDonald, et al.. (2025). In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy. Materials. 18(16). 3925–3925.
2.
Tan, Xin Fu, et al.. (2024). Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys. 207–208.
3.
Tan, Xin Fu, Qinfen Gu, Stuart D. McDonald, et al.. (2023). The effects of Sb on the lattice and microstructure characteristics of hypo-eutectic Sn-Bi alloys. Materials Characterization. 201. 112934–112934. 9 indexed citations
4.
Tan, Xin Fu, et al.. (2023). The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys. Journal of Electronic Materials. 53(3). 1183–1191. 7 indexed citations
5.
Tan, Xin Fu, Qinfen Gu, Stuart D. McDonald, et al.. (2023). In-situ investigation of the time-temperature dependent lattice and microstructure of Sn-Bi alloys. Materialia. 33. 101974–101974. 4 indexed citations
6.
Tan, Xin Fu, et al.. (2023). Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys. Journal of Electronic Materials. 53(3). 1223–1238. 7 indexed citations
7.
Tan, Xin Fu, et al.. (2022). The Effects of Temperature and Solute Diffusion on Volume Change in Sn-Bi Solder Alloys. JOM. 74(4). 1739–1750. 13 indexed citations
8.
9.
Somidin, Flora, Stuart D. McDonald, Xiaozhou Ye, et al.. (2020). Reducing Cracking in Solder Joint Interfacial Cu<sub>6</sub>Sn<sub>5</sub> with Modified Reflow Profile. 13(0). E19–4. 3 indexed citations
10.
11.
Liu, Shiqian, Stuart D. McDonald, Qinfen Gu, et al.. (2019). Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature. Journal of Electronic Materials. 49(1). 128–139. 41 indexed citations
12.
Liu, Shiqian, Stuart D. McDonald, Keith Sweatman, & Kazuhiro Nogita. (2018). The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review. Microelectronics Reliability. 84. 170–180. 36 indexed citations
13.
14.
Sweatman, Keith, et al.. (2013). Grain refinement for improved lead-Free solder joint reliability. Queensland's institutional digital repository (The University of Queensland). 5 indexed citations
15.
Sweatman, Keith, Tetsuro Nishimura, Stuart D. McDonald, & Kazuhiro Nogita. (2012). Effect of cooling rate on the intermetallic layer in solder joints. Queensland's institutional digital repository (The University of Queensland).
16.
Sweatman, Keith, et al.. (2011). The Effect Of Microalloy Additions On The Morphology And Growth Of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders. Queensland's institutional digital repository (The University of Queensland). 13(1). 703–708.
17.
18.
Sweatman, Keith. (2009). Hot Air Solder Leveling in the lead-free era. 4. 2378–2391. 6 indexed citations
19.
Gourlay, C.M., Kazuhiro Nogita, Stuart D. McDonald, et al.. (2006). A rheological assessment of the effect of trace level Ni additions on the solidification of Sn–0.7Cu. Scripta Materialia. 54(9). 1557–1562. 19 indexed citations
20.
Nogita, Kazuhiro, et al.. (2005). Microstructure Control in Sn&ndash;0.7 mass%Cu Alloys. MATERIALS TRANSACTIONS. 46(11). 2419–2425. 39 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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