Y. Takaku

903 total citations
21 papers, 724 citations indexed

About

Y. Takaku is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and General Materials Science. According to data from OpenAlex, Y. Takaku has authored 21 papers receiving a total of 724 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 8 papers in General Materials Science. Recurrent topics in Y. Takaku's work include Electronic Packaging and Soldering Technologies (18 papers), Intermetallics and Advanced Alloy Properties (10 papers) and Metallurgical and Alloy Processes (8 papers). Y. Takaku is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), Intermetallics and Advanced Alloy Properties (10 papers) and Metallurgical and Alloy Processes (8 papers). Y. Takaku collaborates with scholars based in Japan, China and Switzerland. Y. Takaku's co-authors include Ikuo Ohnuma, Ryosuke Kainuma, K. Ishida, Kiyohito Ishida, Yuji Yagi, X. J. Liu, Yuri Yamada, Xingjun Liu, Y. Nishibe and Yuji Sutou and has published in prestigious journals such as Journal of materials research/Pratt's guide to venture capital sources, Metallurgical and Materials Transactions A and Intermetallics.

In The Last Decade

Y. Takaku

21 papers receiving 688 citations

Peers

Countries citing papers authored by Y. Takaku

Since Specialization

Citations

This map shows the geographic impact of Y. Takaku's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Y. Takaku with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Y. Takaku more than expected).

Fields of papers citing papers by Y. Takaku

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Y. Takaku. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Y. Takaku. The network helps show where Y. Takaku may publish in the future.

Co-authorship network of co-authors of Y. Takaku

This figure shows the co-authorship network connecting the top 25 collaborators of Y. Takaku. A scholar is included among the top collaborators of Y. Takaku based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Y. Takaku. Y. Takaku is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Liquid-immiscibility-induced formation of micron-scale crystalline/amorphous composite powder 2012 ·Intermetallics ·(unknown), Y. Takaku, Makoto Nagasako, C.P. Wang, Xingjun Liu, Ryosuke Kainuma, K. Ishida	13
2	A Review of Pb-Free High-Temperature Solders for Power-Semiconductor Devices: Bi-Base Composite Solder and Zn-Al Base Solder 2011 ·Y. Takaku, Ikuo Ohnuma, (unknown), Yuji Yagi, (unknown), (unknown), (unknown), K. Ishida	3
3	Experimental Investigation and Thermodynamic Calculation of the Phase Equilibria in the Al-Bi-Sn Ternary System 2011 ·Journal of Phase Equilibria and Diffusion ·(unknown), (unknown), (unknown), X. J. Liu, Y. Takaku, Ikuo Ohnuma, Ryosuke Kainuma, K. Ishida	29
4	Thermodynamic assessment of phase equilibria in the Sn-Au-Bi system with key experimental verification 2010 ·Journal of materials research/Pratt's guide to venture capital sources ·Feng Gao, Cuiping Wang, Xingjun Liu, Y. Takaku, Ikuo Ohnuma, Kiyohito Ishida	6
5	A Review of Pb-Free High-Temperature Solders for Power-Semiconductor Devices: Bi-Base Composite Solder and Zn–Al Base Solder 2010 ·Journal of ASTM International ·Y. Takaku, Ikuo Ohnuma, Yuri Yamada, Yuji Yagi, (unknown), (unknown), (unknown), K. Ishida	7
6	Experimental investigation and thermodynamic calculation in the Ag–Bi–Ni and Cu–Bi–Ni systems 2009 ·Journal of materials research/Pratt's guide to venture capital sources ·Feng Gao, Cuiping Wang, Xingjun Liu, Y. Takaku, Ikuo Ohnuma, Kiyohito Ishida	6
7	Pb-Free High Temperature Solder Joints for Power Semiconductor Devices 2009 ·(unknown), Y. Takaku, Yuji Yagi, (unknown), (unknown), (unknown), Ikuo Ohnuma, Kiyohito Ishida	23
8	Thermodynamic assessment of the Ni-Sb binary system 2008 ·Rare Metals ·Zhanmin Cao, Y. Takaku, Ikuo Ohnuma, Ryosuke Kainuma, (unknown), (unknown)	27
9	Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap 2008 ·Journal of Electronic Materials ·Ikuo Ohnuma, Toshiari Saegusa, Y. Takaku, C.P. Wang, Xingjun Liu, Ryosuke Kainuma, K. Ishida	50
10	Bi-Base Composite Solders for Mounting Power Semiconductor Devices 2008 ·Journal of The Japan Institute of Electronics Packaging ·Y. Takaku, Ikuo Ohnuma, (unknown), Yuji Yagi, Y. Nishibe, Yuji Sutou, Ryosuke Kainuma, Kiyohito Ishida	2
11	Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate 2008 ·Journal of Electronic Materials ·Y. Takaku, (unknown), (unknown), Ikuo Ohnuma, Ryosuke Kainuma, (unknown), Yuji Yagi, (unknown), (unknown), Kiyohito Ishida	37
12	Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device 2007 ·Microelectronics Reliability ·Yuri Yamada, Y. Takaku, Yuji Yagi, (unknown), (unknown), (unknown), Ikuo Ohnuma, K. Ishida	92
13	Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders 2007 ·Journal of Electronic Materials ·Y. Takaku, (unknown), Ikuo Ohnuma, Ryosuke Kainuma, Kiyohito Ishida	61
14	Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: Thermodynamic calculation, microstructure, and interfacial reaction 2006 ·Journal of Electronic Materials ·Y. Takaku, Ikuo Ohnuma, Ryosuke Kainuma, (unknown), Yuji Yagi, Y. Nishibe, Kiyohito Ishida	42
15	Pb-free high temperature solders for power device packaging 2006 ·Microelectronics Reliability ·Yuri Yamada, Y. Takaku, Yuji Yagi, Y. Nishibe, Ikuo Ohnuma, Yuji Sutou, Ryosuke Kainuma, K. Ishida	76
16	Novel Bi-based High Temperature Solder for Power Semiconductor Joining 2006 ·(unknown), Y. Takaku, Yuji Yagi, Y. Nishibe, Ikuo Ohnuma, Kiyohito Ishida	1
17	Experimental investigation and thermodynamic calculation of phase equilibria in the Sn-Au-Ni system 2005 ·Journal of Electronic Materials ·X. J. Liu, (unknown), Y. Takaku, Ikuo Ohnuma, Ryosuke Kainuma, K. Ishida	28
18	Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate 2004 ·MATERIALS TRANSACTIONS ·Y. Takaku, Xingjun Liu, Ikuo Ohnuma, Ryosuke Kainuma, Kiyohito Ishida	47
19	Formation of core-type macroscopic morphologies in Cu-Fe base alloys with liquid miscibility gap 2004 ·Metallurgical and Materials Transactions A ·(unknown), X. J. Liu, Ryosuke Kainuma, Y. Takaku, Ikuo Ohnuma, K. Ishida	92
20	Experimental determination and thermodynamic calculation of the phase equilibria and surface tension in the Sn-Ag-In system 2002 ·Journal of Electronic Materials ·(unknown), (unknown), Y. Takaku, Ikuo Ohnuma, Ryosuke Kainuma, K. Ishida, Z. Moser, W. Gąsior, J. Pstruś	74

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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