Jan Felba
- Electrical and Electronic Engineering top 10%
- Biomedical Engineering
- Mechanical Engineering
- Automotive Engineering top 10%
- Materials Chemistry
- Co-authors
- Tomasz PiaseckiK. NitschMichael PechtW. DudzińskiMichał PuchalskiSubramaniam GanesanHelmut WohlfahrtHaiyu Qi
- Topics
- Electronic Packaging and Soldering Technologies (29 papers)Nanomaterials and Printing Technologies (22 papers)Additive Manufacturing and 3D Printing Technologies (14 papers)
- Partner nations
- PolandGermanyUnited States
In The Last Decade
Jan Felba
76 papers receiving 391 citations
Peers
Comparison fields: 5 of 47
- Electrical and Electronic Engineering 314
- Biomedical Engineering 127
- Mechanical Engineering 94
- Automotive Engineering 75
- Materials Chemistry 74
Countries citing papers authored by Jan Felba
This map shows the geographic impact of Jan Felba's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jan Felba with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jan Felba more than expected).
Fields of papers citing papers by Jan Felba
This network shows the impact of papers produced by Jan Felba. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jan Felba. The network helps show where Jan Felba may publish in the future.
Co-authorship network of co-authors of Jan Felba
This figure shows the co-authorship network connecting the top 25 collaborators of Jan Felba. A scholar is included among the top collaborators of Jan Felba based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jan Felba. Jan Felba is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 5 | |
| 3 | 2 | |
| 4 | 2 | |
| 5 | 1 | |
| 6 | Improvement of low-temperature sintered ink containing nano-Ag for ink-jet printing of conductive structures on flexible substrates | 1 |
| 7 | 2 | |
| 8 | 10 | |
| 9 | Influence of different type protective layer on silver metallic nanoparticles for Ink-Jet printing technique | 1 |
| 10 | Low-temperature, photonic approach to sintering the ink-jet printed conductive microstructures containing nano sized silver particles | 7 |
| 11 | 24 | |
| 12 | Ujawnienie historii radiacyjnej napromieniowanego elektronami krzemu otrzymanego metodą Czochralskiego poprzez po-radiacyjną obróbkę termiczną | 0 |
| 13 | Analysis of blind microvias forming process in multilayer printed circuit boards | 1 |
| 14 | The influence of thermal process on electrical conductivity of microstructures: Made by ink-jet painting with the use of ink containing nano sized silver particles | 17 |
| 15 | Influence of thermo-mechanical properties of polymer matrices on the thermal conductivity of adhesives for microelectronic packaging | 2 |
| 16 | 5 | |
| 17 | 4 | |
| 18 | 1 | |
| 19 | 4 | |
| 20 | Specjalistyczna spawarka elektronowa do wykonywania spoin obwodowych tłumików drgań skrętnych | 3 |
About Jan Felba
Jan Felba is a scholar working on Automotive Engineering, Electrical and Electronic Engineering and Structural Biology, having authored 81 papers that have together received 416 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (29 papers), Nanomaterials and Printing Technologies (22 papers) and Additive Manufacturing and 3D Printing Technologies (14 papers). The work is most often cited by research in Automotive Engineering (75 citations), Electrical and Electronic Engineering (314 citations) and General Materials Science (10 citations). Jan Felba has collaborated with scholars based in Poland, Germany and United States. Frequent co-authors include Tomasz Piasecki, K. Nitsch, Michael Pecht, W. Dudziński, Michał Puchalski, Subramaniam Ganesan, Helmut Wohlfahrt, Haiyu Qi, Ryszard Kisiel and Karlheinz Bock. Their work appears in journals such as Applied Surface Science, Journal of Electronic Materials and Vacuum.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.