Jan Felba

640 total citations
81 papers, 416 citations indexed

About

Jan Felba is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Jan Felba has authored 81 papers receiving a total of 416 indexed citations (citations by other indexed papers that have themselves been cited), including 53 papers in Electrical and Electronic Engineering, 18 papers in Mechanical Engineering and 18 papers in Materials Chemistry. Recurrent topics in Jan Felba's work include Electronic Packaging and Soldering Technologies (29 papers), Nanomaterials and Printing Technologies (22 papers) and Additive Manufacturing and 3D Printing Technologies (14 papers). Jan Felba is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), Nanomaterials and Printing Technologies (22 papers) and Additive Manufacturing and 3D Printing Technologies (14 papers). Jan Felba collaborates with scholars based in Poland, Germany and United States. Jan Felba's co-authors include Tomasz Piasecki, Michael Pecht, K. Nitsch, W. Dudziński, Helmut Wohlfahrt, Michał Puchalski, Subramaniam Ganesan, Haiyu Qi, Karlheinz Bock and Ryszard Kisiel and has published in prestigious journals such as Applied Surface Science, Journal of Electronic Materials and Vacuum.

In The Last Decade

Jan Felba

76 papers receiving 391 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jan Felba Poland 11 314 127 94 75 74 81 416
Gilhwan Cha United States 10 120 0.4× 108 0.9× 173 1.8× 39 0.5× 112 1.5× 12 345
See Jo Kim South Korea 11 81 0.3× 88 0.7× 112 1.2× 24 0.3× 49 0.7× 27 318
Angkur Jyoti Dipanka Shaikeea United Kingdom 8 109 0.3× 119 0.9× 136 1.4× 35 0.5× 37 0.5× 16 314
J. Sitek Poland 10 310 1.0× 31 0.2× 213 2.3× 25 0.3× 35 0.5× 59 364
Klaus-Juergen Wolter Germany 12 318 1.0× 62 0.5× 164 1.7× 17 0.2× 75 1.0× 48 393
Jianbin Wang China 11 150 0.5× 158 1.2× 247 2.6× 17 0.2× 123 1.7× 26 406
Poi-Siong Teo Singapore 11 298 0.9× 52 0.4× 136 1.4× 14 0.2× 48 0.6× 18 372
Jun Cao China 11 151 0.5× 36 0.3× 193 2.1× 17 0.2× 130 1.8× 59 336
Eлена Колева Bulgaria 10 76 0.2× 41 0.3× 252 2.7× 29 0.4× 41 0.6× 53 347
Kenny C. Otiaba United Kingdom 9 253 0.8× 27 0.2× 189 2.0× 18 0.2× 141 1.9× 16 405

Countries citing papers authored by Jan Felba

Since Specialization
Citations

This map shows the geographic impact of Jan Felba's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jan Felba with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jan Felba more than expected).

Fields of papers citing papers by Jan Felba

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jan Felba. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jan Felba. The network helps show where Jan Felba may publish in the future.

Co-authorship network of co-authors of Jan Felba

This figure shows the co-authorship network connecting the top 25 collaborators of Jan Felba. A scholar is included among the top collaborators of Jan Felba based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jan Felba. Jan Felba is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Felba, Jan, et al.. (2022). Thermal and mechanical analysis of low-temperature and low-pressure silver-based sintered thermal joints. Soldering and Surface Mount Technology. 35(1). 9–17. 2 indexed citations
2.
Felba, Jan, et al.. (2016). Thermal joints based on sintered silver micro- and nano- sized particles. 1. 116–121. 2 indexed citations
5.
Felba, Jan, et al.. (2013). Improvement of low-temperature sintered ink containing nano-Ag for ink-jet printing of conductive structures on flexible substrates. European Microelectronics and Packaging Conference. 1–6. 1 indexed citations
6.
Felba, Jan, et al.. (2013). Coarse grained molecular dynamics study of heat transfer in thermal interface materials. 4. 259–262. 2 indexed citations
7.
Felba, Jan, et al.. (2011). Influence of different type protective layer on silver metallic nanoparticles for Ink-Jet printing technique. European Microelectronics and Packaging Conference. 1–6. 1 indexed citations
8.
Felba, Jan, et al.. (2011). Low-temperature, photonic approach to sintering the ink-jet printed conductive microstructures containing nano sized silver particles. European Microelectronics and Packaging Conference. 1–4. 7 indexed citations
9.
Felba, Jan, et al.. (2011). Nano-silver inkjet printed interconnections through the microvias for flexible electronics. 473–477. 24 indexed citations
10.
Misiuk, A., et al.. (2010). Ujawnienie historii radiacyjnej napromieniowanego elektronami krzemu otrzymanego metodą Czochralskiego poprzez po-radiacyjną obróbkę termiczną. PRZEGLĄD ELEKTROTECHNICZNY. 29–31.
11.
Felba, Jan, et al.. (2009). The influence of thermal process on electrical conductivity of microstructures: Made by ink-jet painting with the use of ink containing nano sized silver particles. 408–411. 17 indexed citations
12.
Felba, Jan, et al.. (2009). Analysis of blind microvias forming process in multilayer printed circuit boards. 59–72. 1 indexed citations
13.
Felba, Jan. (2008). Nanomaterials and technology for conductive microstructures. 79. 205–210. 9 indexed citations
14.
Felba, Jan, et al.. (2007). Influence of thermo-mechanical properties of polymer matrices on the thermal conductivity of adhesives for microelectronic packaging. 2 indexed citations
15.
Felba, Jan, et al.. (2006). Magnetron Sputtering Deposition of Copper on Polymers in High Density Interconnection PCB's. 192–196. 4 indexed citations
17.
Felba, Jan, et al.. (2006). Viscoelastic Characterization of Polymer Matrix of Thermally Conductive Adhesives. 773–781. 1 indexed citations
18.
Felba, Jan, et al.. (2002). Specjalistyczna spawarka elektronowa do wykonywania spoin obwodowych tłumików drgań skrętnych. Elektronika : konstrukcje, technologie, zastosowania. 43. 36–39. 3 indexed citations
19.
Felba, Jan, et al.. (2002). Electrical conduction of adhesive joints in microwave applications. 3. 71–78. 2 indexed citations
20.
Felba, Jan, et al.. (1990). Application of glow discharge electron gun to surface modification. Vacuum. 41(7-9). 2177–2180. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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