K. Bukat

408 total citations
37 papers, 321 citations indexed

About

K. Bukat is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and General Materials Science. According to data from OpenAlex, K. Bukat has authored 37 papers receiving a total of 321 indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Electrical and Electronic Engineering, 19 papers in Mechanical Engineering and 12 papers in General Materials Science. Recurrent topics in K. Bukat's work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (12 papers) and Metallurgical and Alloy Processes (11 papers). K. Bukat is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (12 papers) and Metallurgical and Alloy Processes (11 papers). K. Bukat collaborates with scholars based in Poland, Slovenia and Japan. K. Bukat's co-authors include J. Sitek, J. Pstruś, Z. Moser, W. Gąsior, Ryszard Kisiel, Małgorzata Jakubowska, Przemysław Fima, Tomasz Gancarz, Ikuo Ohnuma and K. Ishida and has published in prestigious journals such as Journal of Applied Polymer Science, Microelectronics Reliability and Journal of Phase Equilibria and Diffusion.

In The Last Decade

K. Bukat

33 papers receiving 308 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
K. Bukat Poland 10 285 197 70 33 30 37 321
Zhong Sheng China 11 534 1.9× 476 2.4× 38 0.5× 28 0.8× 105 3.5× 15 575
G.Y. Li China 12 531 1.9× 470 2.4× 42 0.6× 24 0.7× 58 1.9× 21 563
G.S. Al-Ganainy Egypt 10 298 1.0× 312 1.6× 28 0.4× 75 2.3× 96 3.2× 18 382
Iuliana Panchenko Germany 9 263 0.9× 111 0.6× 11 0.2× 27 0.8× 23 0.8× 42 292
Shuang Tian China 10 203 0.7× 227 1.2× 14 0.2× 42 1.3× 87 2.9× 32 319
Young-Doo Jeon South Korea 11 345 1.2× 180 0.9× 17 0.2× 10 0.3× 10 0.3× 18 359
Roman Koleňák Slovakia 12 251 0.9× 280 1.4× 37 0.5× 31 0.9× 45 1.5× 47 341
Janne J. Sundelin Finland 8 304 1.1× 188 1.0× 11 0.2× 36 1.1× 63 2.1× 12 343
Hirohiko Watanabe Japan 10 177 0.6× 285 1.4× 20 0.3× 163 4.9× 43 1.4× 31 357
S. G. Jadhav United States 8 262 0.9× 201 1.0× 8 0.1× 50 1.5× 88 2.9× 12 293

Countries citing papers authored by K. Bukat

Since Specialization
Citations

This map shows the geographic impact of K. Bukat's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K. Bukat with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K. Bukat more than expected).

Fields of papers citing papers by K. Bukat

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by K. Bukat. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K. Bukat. The network helps show where K. Bukat may publish in the future.

Co-authorship network of co-authors of K. Bukat

This figure shows the co-authorship network connecting the top 25 collaborators of K. Bukat. A scholar is included among the top collaborators of K. Bukat based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with K. Bukat. K. Bukat is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Sitek, J., et al.. (2012). Influence of modified carbon nanotubes addition to SAC solder paste on solder joints properties and their thermal and mechanical fatigue. 1–6. 1 indexed citations
2.
Bukat, K., et al.. (2012). SAC 305 solder paste with carbon nanotubes – part I: investigation of the influence of the carbon nanotubes on the SAC solder paste properties. Soldering and Surface Mount Technology. 24(4). 267–279. 17 indexed citations
3.
Fima, Przemysław, Tomasz Gancarz, J. Pstruś, K. Bukat, & J. Sitek. (2012). Thermophysical properties and wetting behavior on Cu of selected SAC alloys. Soldering and Surface Mount Technology. 24(2). 71–76. 29 indexed citations
4.
Bukat, K., et al.. (2012). Investigation of the wetting of PCBs with SnCu (HASL) and Snimm finishes by SnZnBiIn solders. Soldering and Surface Mount Technology. 24(1). 4–11. 2 indexed citations
5.
Sitek, J., et al.. (2011). Investigation of inkjet technology for printed organic electronics. Elektronika : konstrukcje, technologie, zastosowania. 52. 112–114. 2 indexed citations
6.
Bukat, K., et al.. (2011). Silver nanoparticles effect on the wettability of Sn‐Ag‐Cu solder pastes and solder joints microstructure on copper. Soldering and Surface Mount Technology. 23(3). 150–160. 36 indexed citations
7.
Moser, Z., Przemysław Fima, K. Bukat, et al.. (2011). Investigation of the effect of indium addition on wettability of Sn‐Ag‐Cu solders. Soldering and Surface Mount Technology. 23(1). 22–29. 21 indexed citations
8.
9.
10.
Bukat, K., et al.. (2010). Application of silver nanoparticles to improve wettability of SnAgCu solder paste. 27. 473–477. 3 indexed citations
11.
Bukat, K., et al.. (2008). Trends in wettability studies df Pb-free solders. Basic and application. Part II. Relation between surface tension, interfacial tension and wertability of lead-free Sn-Zn and Sn-Bi-Sb alloys. Archives of Metallurgy and Materials. 1065–1074. 8 indexed citations
12.
Moser, Z., W. Gąsior, K. Bukat, J. Pstruś, & J. Sitek. (2008). Trends in wettability studies of Pb-free solders. Basic and application. Part I. Surface tension and density measurements of Sn-Zn- and Sn-Zn-Bi-Sb alloys. Experiment vs. modelling. Archives of Metallurgy and Materials. 1055–1063. 9 indexed citations
13.
Kisiel, Ryszard, et al.. (2007). Quality Management in Electronics Manufacturing after Implementation of RoHS Directive. 34–39. 1 indexed citations
14.
Bukat, K.. (2006). Badanie wpływu starzenia płytek drukowanych z powłoką cyny immersyjnej na ich lutowność stopami bezołowiowymi. Elektronika : konstrukcje, technologie, zastosowania. 47. 14–18.
15.
Sitek, J., et al.. (2006). Wettability of lead-free PCBs finishes after long-term natural storage. Elektronika : konstrukcje, technologie, zastosowania. 47. 33–35. 2 indexed citations
16.
Moser, Z., W. Gąsior, K. Bukat, et al.. (2006). Pb-Free Solders: Part 1. Wettability Testing of Sn-Ag-Cu Alloys with Bi Additions. Journal of Phase Equilibria and Diffusion. 27(2). 133–139. 9 indexed citations
17.
Kisiel, Ryszard, W. Gąsior, Z. Moser, et al.. (2005). Electrical and mechanical studies of the Sn-Ag-Cu-Bi and Sn-Ag-Cu-Bi-Sb lead free soldering materials. Archives of Metallurgy and Materials. 1065–1071. 1 indexed citations
18.
Sitek, J., et al.. (2004). A comparison of the quality of lead‐free solder pastes. Soldering and Surface Mount Technology. 16(3). 22–30. 4 indexed citations
19.
Kisiel, Ryszard, W. Gąsior, Z. Moser, et al.. (2004). (Sn-Ag)<SUB>eut</SUB> + Cu Soldering Materials, Part II: Electrical and Mechanical Studies. Journal of Phase Equilibria and Diffusion. 25(2). 122–124. 14 indexed citations
20.
Bukat, K., et al.. (1999). Comparison of new no-clean fluxes on PCBs and thick film hybrid circuits. Microelectronics Journal. 30(9). 887–893. 9 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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