G. Matijasevic

699 total citations
27 papers, 539 citations indexed

About

G. Matijasevic is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, G. Matijasevic has authored 27 papers receiving a total of 539 indexed citations (citations by other indexed papers that have themselves been cited), including 26 papers in Electrical and Electronic Engineering, 8 papers in Mechanics of Materials and 6 papers in Mechanical Engineering. Recurrent topics in G. Matijasevic's work include Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (17 papers) and Adhesion, Friction, and Surface Interactions (7 papers). G. Matijasevic is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (17 papers) and Adhesion, Friction, and Surface Interactions (7 papers). G. Matijasevic collaborates with scholars based in United States. G. Matijasevic's co-authors include C.C. Lee, Chin C. Lee, J. Maguire, Catherine Shearer, Rebecca A. Metzler, Xin Cheng, Yi-Chia Chen, Chen S. Tsai, Ravindra Kumar and Lutz Brandt and has published in prestigious journals such as Thin Solid Films, Journal of Electronic Materials and Journal of Electronic Packaging.

In The Last Decade

G. Matijasevic

25 papers receiving 505 citations

Peers

Countries citing papers authored by G. Matijasevic

Since Specialization

Citations

This map shows the geographic impact of G. Matijasevic's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by G. Matijasevic with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites G. Matijasevic more than expected).

Fields of papers citing papers by G. Matijasevic

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by G. Matijasevic. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by G. Matijasevic. The network helps show where G. Matijasevic may publish in the future.

Co-authorship network of co-authors of G. Matijasevic

This figure shows the co-authorship network connecting the top 25 collaborators of G. Matijasevic. A scholar is included among the top collaborators of G. Matijasevic based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with G. Matijasevic. G. Matijasevic is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	A reliability study of Au-Sn eutectic binding with Ga-As dice 2003 ·G. Matijasevic, (unknown)	2
2	A new interlayer interconnect technology for multilayer fabrication 2002 ·(unknown), (unknown), (unknown), (unknown), G. Matijasevic, (unknown), (unknown), (unknown), (unknown)	0
3	Thermal management with additive multilayer circuitry on metal substrates 2002 ·G. Matijasevic, (unknown), (unknown), (unknown), (unknown)	1
4	Materials selection issues for high operating temperature (HOT) electronic packaging 2002 ·(unknown), (unknown), G. Matijasevic	6
5	Vertical microvia connections achieved using a unique conductive composite material 2002 ·G. Matijasevic, (unknown), (unknown)	0
6	Extremely reliable bonding of large silicon dice using gold-tin alloy 2002 ·G. Matijasevic, (unknown), (unknown)	2
7	Thermal study of additive multilayer circuitry on polymer and metal substrates 2002 ·(unknown), G. Matijasevic, (unknown), (unknown), (unknown)	1
8	A fully additive, polymeric process for the fabrication and assembly of substrate and component level packaging 2002 ·(unknown), (unknown), G. Matijasevic	3
9	Vertical interconnect in multilayer applications using Ormet/sup R/ conductive composites 2002 ·(unknown), G. Matijasevic, (unknown), (unknown), (unknown), Ravindra Kumar, (unknown)	2
10	High density multilayer substrates using patterned microvia interposers 2002 ·G. Matijasevic, (unknown), (unknown)	1
11	A fluxless oxidation-free bonding technology 2002 ·C.C. Lee, Yi-Chia Chen, G. Matijasevic, Rebecca A. Metzler	3
12	High-sensitivity, surface-attached heat flux sensors 1999 ·Microelectronics Journal ·(unknown), (unknown), G. Matijasevic, (unknown)	14
13	Transient liquid phase sintering composites: Polymer adhesives with metallurgical bonds 1999 ·Journal of Electronic Materials ·Catherine Shearer, (unknown), G. Matijasevic, (unknown)	10
14	A FULLY ADDITIVE POLYMERIC PROCESS FOR THE FABRICATION AND ASSEMBLY OF SUBSTRATE AND COMPONENT LEVEL PACKAGING 1997 ·Journal of Electronics Manufacturing ·(unknown), (unknown), G. Matijasevic	3
15	Advances in Bonding Technology for Electronic Packaging 1993 ·Journal of Electronic Packaging ·Chin C. Lee, (unknown), G. Matijasevic	44
16	AuSn alloy phase diagram and properties related to its use as a bonding medium 1993 ·Thin Solid Films ·G. Matijasevic, Chin C. Lee, (unknown)	127
17	Bonding technology of semiconductor devices and its characterization using scanning acoustic microscopy 1992 ·G. Matijasevic	9
18	A new bonding technology using gold and tin multilayer composite structures 1991 ·IEEE Transactions on Components Hybrids and Manufacturing Technology ·C.C. Lee, (unknown), G. Matijasevic	109
19	Highly reliable die attachment on polished GaAs surfaces using gold-tin eutectic alloy 1989 ·IEEE Transactions on Components Hybrids and Manufacturing Technology ·C.C. Lee, G. Matijasevic	23
20	Imaging and characterization of film coating using scanning acoustic microscopy 1987 ·Thin Solid Films ·Chin C. Lee, G. Matijasevic, Xin Cheng, Chen S. Tsai	3

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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