Tanja Braun
Impact in
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Microwave Engineering and Waveguides
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
Papers in
-
- Electronic Packaging and Soldering Technologies 63
- 3D IC and TSV technologies 59
- Electromagnetic Compatibility and Noise Suppression 20
- Microwave Engineering and Waveguides 10
-
- Additive Manufacturing and 3D Printing Technologies 20
- Co-authors
- R. AschenbrennerKarl‐Friedrich BeckerS. VogesR. KahleK.-F. BeckerV. BaderT. ThomasMartin Schneider‐Ramelow
- Journals
- Microelectronics Reliability (3 papers)Microsystem Technologies (2 papers)Journal of Electronic Packaging (1 paper)Biomaterials (1 paper)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)
- Partner nations
- GermanyUnited StatesItaly
In The Last Decade
Tanja Braun
113 papers receiving 853 citations
Peers
Comparison fields: 5 of 73
- Electrical and Electronic Engineering 728
- Automotive Engineering 111
- Industrial and Manufacturing Engineering 52
- Polymers and Plastics 68
- Biomedical Engineering 214
Countries citing papers authored by Tanja Braun
This map shows the geographic impact of Tanja Braun's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tanja Braun with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tanja Braun more than expected).
Fields of papers citing papers by Tanja Braun
This network shows the impact of papers produced by Tanja Braun. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tanja Braun. The network helps show where Tanja Braun may publish in the future.
Co-authors
The 25 scholars most cited alongside Tanja Braun, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2024 | 0 | |
| 3 | 2024 | 1 | |
| 4 | 2024 | 1 | |
| 5 | 2023 | 1 | |
| 6 | 2023 | 1 | |
| 7 | 2023 | 0 | |
| 8 | 2023 | 1 | |
| 9 | 2022 | 1 | |
| 10 | 2022 | 4 | |
| 11 | 2016 | 1 | |
| 12 | 2016 | 1 | |
| 13 | Evaluation of the dielectric cure monitoring of epoxy molding compound in transfer molding process for electronic packages | 2015 | 5 |
| 14 | Influence of humidity on reliability of plastic packages | 2015 | 3 |
| 15 | 2012 | 2 | |
| 16 | 3D stacking approaches for mold embedded packages | 2011 | 10 |
| 17 | 2010 | 4 | |
| 18 | 2009 | 15 | |
| 19 | 2008 | 1 | |
| 20 | 2002 | 10 |
About Tanja Braun
Tanja Braun is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Industrial and Manufacturing Engineering, Mechanical Engineering and Mechanics of Materials, having authored 123 papers that have together received 925 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (63 papers), 3D IC and TSV technologies (59 papers), Electromagnetic Compatibility and Noise Suppression (20 papers), Additive Manufacturing and 3D Printing Technologies (20 papers), Manufacturing Process and Optimization (11 papers), Microwave Engineering and Waveguides (10 papers), Epoxy Resin Curing Processes (10 papers) and Material Properties and Processing (9 papers). The work is most often cited by research in Electrical and Electronic Engineering (728 citations), Automotive Engineering (111 citations), Industrial and Manufacturing Engineering (52 citations), Polymers and Plastics (68 citations) and Biomedical Engineering (214 citations). Tanja Braun has collaborated with scholars based in Germany, United States and Italy. Frequent co-authors include R. Aschenbrenner, Karl‐Friedrich Becker, S. Voges, R. Kahle, K.-F. Becker, V. Bader, T. Thomas, Martin Schneider‐Ramelow, J. Bauer and H. Reichl. Their work appears in journals such as Microelectronics Reliability, Microsystem Technologies, Journal of Electronic Packaging, Biomaterials and IEEE Transactions on Electronics Packaging Manufacturing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.