K.-D. Lang

513 total citations
60 papers, 398 citations indexed

About

K.-D. Lang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, K.-D. Lang has authored 60 papers receiving a total of 398 indexed citations (citations by other indexed papers that have themselves been cited), including 48 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 10 papers in Biomedical Engineering. Recurrent topics in K.-D. Lang's work include 3D IC and TSV technologies (27 papers), Electronic Packaging and Soldering Technologies (25 papers) and Electromagnetic Compatibility and Noise Suppression (5 papers). K.-D. Lang is often cited by papers focused on 3D IC and TSV technologies (27 papers), Electronic Packaging and Soldering Technologies (25 papers) and Electromagnetic Compatibility and Noise Suppression (5 papers). K.-D. Lang collaborates with scholars based in Germany, Switzerland and Italy. K.-D. Lang's co-authors include Tanja Braun, Hermann Oppermann, Michael J. Topper, Ivan Ndip, R. Aschenbrenner, Martin Schneider‐Ramelow, Kai Zoschke, Martin Wilke, O. Ehrmann and Karl‐Friedrich Becker and has published in prestigious journals such as Applied Surface Science, Surface Science and Electronics Letters.

In The Last Decade

K.-D. Lang

52 papers receiving 374 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
K.-D. Lang Germany 12 334 75 58 43 40 60 398
Vasarla Nagendra Sekhar Singapore 11 417 1.2× 80 1.1× 51 0.9× 30 0.7× 24 0.6× 64 456
Venkatesh Sundaram United States 13 366 1.1× 77 1.0× 27 0.5× 28 0.7× 49 1.2× 23 407
M.K. Iyer Singapore 12 470 1.4× 77 1.0× 90 1.6× 23 0.5× 64 1.6× 68 560
Deepak Goyal United States 11 271 0.8× 51 0.7× 64 1.1× 35 0.8× 13 0.3× 31 313
Srikrishna Sitaraman United States 13 516 1.5× 76 1.0× 57 1.0× 50 1.2× 82 2.0× 56 567
Scott Pollard United States 14 338 1.0× 84 1.1× 26 0.4× 19 0.4× 33 0.8× 39 380
Lixi Wan China 12 494 1.5× 119 1.6× 55 0.9× 24 0.6× 63 1.6× 137 612
E. Zakel Germany 14 424 1.3× 54 0.7× 125 2.2× 83 1.9× 11 0.3× 51 468
Yu-Min Lin Taiwan 15 621 1.9× 55 0.7× 53 0.9× 29 0.7× 12 0.3× 68 649
Wei‐Ting Chen Taiwan 10 231 0.7× 47 0.6× 69 1.2× 13 0.3× 17 0.4× 39 318

Countries citing papers authored by K.-D. Lang

Since Specialization
Citations

This map shows the geographic impact of K.-D. Lang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K.-D. Lang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K.-D. Lang more than expected).

Fields of papers citing papers by K.-D. Lang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by K.-D. Lang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K.-D. Lang. The network helps show where K.-D. Lang may publish in the future.

Co-authorship network of co-authors of K.-D. Lang

This figure shows the co-authorship network connecting the top 25 collaborators of K.-D. Lang. A scholar is included among the top collaborators of K.-D. Lang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with K.-D. Lang. K.-D. Lang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Bickel, Jessica E., et al.. (2022). Platinum interconnections for harsh environment applications using atmospheric pressure sputtering. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 167–168. 1 indexed citations
2.
Marx, Sebastian, et al.. (2017). Insertion loss study for panel-level single-mode glass waveguides. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 10109. 101090J–101090J. 5 indexed citations
3.
Kahle, R., Tanja Braun, J. Bauer, et al.. (2016). In-situ measuring module for transfer molding process monitoring. IMAPSource Proceedings. 2016(1). 475–477. 1 indexed citations
4.
Hahn, Robert, et al.. (2016). Variable Capacitor Energy Harvesting Based on Polymer Dielectric and Composite Electrode. Energy Harvesting and Systems. 3(4). 277–285. 3 indexed citations
5.
Krüger, Michael, et al.. (2016). Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars. Microelectronics Reliability. 64. 140–144. 7 indexed citations
6.
Cronin, Richard, et al.. (2016). Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 3. 82–87. 3 indexed citations
7.
Braun, Tanja, J. Bauer, K.-F. Becker, et al.. (2015). Influence of humidity on reliability of plastic packages. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–6. 3 indexed citations
8.
Braun, Tanja, Karl‐Friedrich Becker, V. Bader, et al.. (2015). From fan-out wafer to fan-out panel level packaging. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–4. 13 indexed citations
9.
Zoschke, Kai, Martin Wilke, Matthias Wegner, et al.. (2014). Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 49. 1204–1211. 5 indexed citations
10.
Sousa, Maria F.B., H. Walter, Matthias Hütter, et al.. (2014). Thermo-mechanical simulation of sintered Ag die attach for high temperature applications. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2014(HITEC). 378–384.
11.
Hölck, O., M. C. Nuss, H. Walter, et al.. (2014). Development of process and design criteria for stress management in through silicon vias. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 625–630. 12 indexed citations
12.
Schröder, H., et al.. (2014). Array fiber welding on micro optical glass substrates for chip-to-fiber coupling. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 8991. 89910F–89910F. 1 indexed citations
13.
Zoschke, Kai, Martin Wilke, Nils Jürgensen, et al.. (2013). Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1500–1507. 22 indexed citations
14.
Bauer, J., Karl‐Friedrich Becker, R. Kahle, et al.. (2013). Panel level packaging for LED lighting. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 100–103.
15.
Ndip, Ivan, et al.. (2012). Modelling the shape, length and radiation characteristics of bond wire antennas. IET Microwaves Antennas & Propagation. 6(10). 1187–1194. 25 indexed citations
16.
Schneider‐Ramelow, Martin, et al.. (2012). European R&D Trends in wire bonding technologies. IMAPSource Proceedings. 2012(1). 209–214. 5 indexed citations
17.
Becker, K.-F., Matthias Koch, J. Bauer, et al.. (2012). Precision Jetting of Glob Top Materials – a methodology for process optimization. IMAPSource Proceedings. 2012(1). 351–358. 3 indexed citations
18.
Ostmann, Andreas, et al.. (2011). Modular microelectronics by System-in-Packages with embedded components. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–5. 1 indexed citations
19.
Kowina, P., et al.. (2006). DIGITAL TECHNIQUES IN BPM MEASUREMENTS AT GSI-SIS. 2 indexed citations
20.
Lang, K.-D., et al.. (2005). Industrially compatible PCB stacking technology for miniaturized sensor systems. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 6 pp.–6 pp..

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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