K.-D. Lang

513 citations

60 papers · 398 indexed · h-index 12

Impact in

Electrical and Electronic Engineering top 10%
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advanced MEMS and NEMS Technologies
- Microwave Engineering and Waveguides
- Electromagnetic Compatibility and Noise Suppression
- Semiconductor Lasers and Optical Devices
- Semiconductor materials and devices
Automotive Engineering

Papers in ⓘ

Electrical and Electronic Engineering 48
- 3D IC and TSV technologies 27
- Electronic Packaging and Soldering Technologies 25
- Advanced MEMS and NEMS Technologies 5
- Semiconductor Lasers and Optical Devices 5
- Microwave Engineering and Waveguides 5
- Electromagnetic Compatibility and Noise Suppression 5
Surfaces, Coatings and Films 3

Co-authors: Tanja Braun (17 shared papers)Hermann Oppermann (9 shared papers)Michael J. Topper (7 shared papers)Martin Schneider‐Ramelow (13 shared papers)R. Aschenbrenner (12 shared papers)Ivan Ndip (7 shared papers)Kai Zoschke (5 shared papers)Karl‐Friedrich Becker (10 shared papers)
Journals: Microelectronics Reliability (5 papers)Journal of Instrumentation (2 papers)Applied Surface Science (1 paper)IET Microwaves Antennas & Propagation (1 paper)Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment (1 paper)
Partner nations: Germany Switzerland Italy

In The Last Decade

K.-D. Lang

52 papers receiving 374 citations

Peers

Countries citing papers authored by K.-D. Lang

Since Specialization

Citations

This map shows the geographic impact of K.-D. Lang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K.-D. Lang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K.-D. Lang more than expected).

Fields of papers citing papers by K.-D. Lang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by K.-D. Lang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K.-D. Lang. The network helps show where K.-D. Lang may publish in the future.

Co-authors

The 25 scholars most cited alongside K.-D. Lang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with K.-D. Lang Line = papers co-authored together K.-D. Lang links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 60 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Polyimide based temporary wafer bonding technology for high temperature compliant TSV backside processing and thin device handling Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·Kai Zoschke, Thorsten Fischer, Michael J. Topper, T. Fritzsch, O. Ehrmann, Toshiaki Itabashi, Melvin P. Zussman, Matthew Souter, Hermann Oppermann, K.-D. Lang	2012	32
2	Panel Level Packaging - A View Along the Process Chain Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck, R. Kahle, Markus Wöhrmann, Lars Boettcher, Michael J. Topper, Lutz Stobbe, Hannes Zedel, R. Aschenbrenner, S. Voges, Martin Schneider‐Ramelow, K.-D. Lang	2018	28
3	Modelling the shape, length and radiation characteristics of bond wire antennas IET Microwaves Antennas & Propagation ·Ivan Ndip, Abdurrahman Öz, Christian Tschoban, Stephan Guttowski, H. Reichl, K.-D. Lang, Heino Henke	2012	25
4	Surface oxide films on Aluminum bondpads: Influence on thermosonic wire bonding behavior and hardness Microelectronics Reliability ·Matthias Petzold, L. Berthold, D. S. Katzer, Heiko Knoll, Dieter Memhard, Petra Meier, K.-D. Lang	2000	25
5	Hermetic wafer level packaging of MEMS components using through silicon via and wafer to wafer bonding technologies Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Kai Zoschke, Charles-Alix Manier, Martin Wilke, Nils Jürgensen, Hermann Oppermann, David Ruffieux, James Dekker, H. Heikkinen, Silvio Dalla Piazza, Giorgio Allegato, K.-D. Lang	2013	22
6	Fan-out wafer level packaging for 5G and mm-Wave applications Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Tanja Braun, Karl‐Friedrich Becker, Ole Hoelck, R. Kahle, Markus Woehrmann, Michael Toepper, Ivan Ndip, Uwe Maaß, Christian Tschoban, R. Aschenbrenner, S. Voges, K.-D. Lang	2018	16
7	Material and process trends for moving from FOWLP to FOPLP Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·Tanja Braun, S. Voges, Michael J. Topper, Martin Wilke, Markus Wöhrmann, Uwe Maas, M. Huhn, K.-F. Becker, S. Raatz, J.-U. Kim, R. Aschenbrenner, K.-D. Lang, Corey O'Connor, Robert Barr, Jeffrey M. Calvert, Michael Gallagher, Elissei Iagodkine, Tina Aoude, Andrew Politis	2015	16
8	Application of TSV integration and wafer bonding technologies for hermetic wafer level packaging of MEMS components for miniaturized timing devices Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Kai Zoschke, Charles-Alix Manier, Martin Wilke, Hermann Oppermann, David Ruffieux, James Dekker, A. Jaakkola, Silvio Dalla Piazza, Giorgio Allegato, K.-D. Lang	2015	15
9	Opportunities of Fan-out Wafer Level Packaging (FOWLP) for RF applications Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·Tanja Braun, Michael J. Topper, Karl‐Friedrich Becker, Martin Wilke, M. Huhn, Uwe Maaß, Ivan Ndip, R. Aschenbrenner, K.-D. Lang	2016	14
10	From fan-out wafer to fan-out panel level packaging Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·Tanja Braun, Karl‐Friedrich Becker, S. Raatz, V. Bader, J. Bauer, R. Aschenbrenner, S. Voges, T. Thomas, R. Kahle, K.-D. Lang	2015	13
11	Development of process and design criteria for stress management in through silicon vias Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·O. Hölck, M. C. Nuss, Arian Grams, Tobias Prewitz, Peggy John, Conny Fiedler, M. Böttcher, H. Walter, M. J. Wolf, Olaf Wittler, K.-D. Lang	2014	12
12	Electronic transport in ultrathin epitaxial Pb films on Si(111) surfaces Applied Surface Science ·O. Pfennigstorf, K.-D. Lang, H.‐L. Günter, M. Henzler	2000	12
13	Experimental verification and analysis of analytical model of the shape of bond wire antennas Electronics Letters ·Ivan Ndip, M. Huhn, F. Brandenburger, Christian Ehrhardt, Martin Schneider‐Ramelow, H. Reichl, K.-D. Lang, Heino Henke	2017	9
14	Technologies and Trends to Improve Power Electronic Packaging IMAPSource Proceedings ·Martin Schneider‐Ramelow, Matthias Hütter, Hermann Oppermann, J.-M. Göhre, S. Schmitz, Eckart Hoene, K.-D. Lang	2011	8
15	Correlation between mechanical properties and microstructure of different aluminum wire qualities after ultrasonic bonding Microelectronics Reliability ·M. Broll, Uwe Geißler, Jan Höfer, Stefan Schmitz, Olaf Wittler, Martin Schneider‐Ramelow, K.-D. Lang	2015	8
16	Requirements for the application of ECUs in e-mobility originally qualified for gasoline cars Microelectronics Reliability ·Michael Krüger, S. Straube, A. Middendorf, Daniel Hahn, Tom Dobs, K.-D. Lang	2016	7
17	Flip chip assembly of thinned chips for hybrid pixel detector applications Journal of Instrumentation ·T. Fritzsch, Kai Zoschke, Markus Woehrmann, M. Rothermund, F. Huegging, O. Ehrmann, Hermann Oppermann, K.-D. Lang	2014	7
18	Structure and electronic properties of epitaxial metallic monolayers Surface Science ·M. Henzler, O. Pfennigtorf, K.-D. Lang, T. Lüer, Francesca Moresco, T. Hildebrandt	1999	7
19	Evaluation of the relationship between stress and lifetime of Pb-free solder joints subjected to vibration load using a generalized local stress approach Microelectronics Reliability ·Joel Luther Thambi, Ulrich Tetzlaff, Andreas Schießl, K.-D. Lang, Manuela Waltz	2020	7
20	Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment ·T. Fritzsch, R. Jordan, Hermann Oppermann, O. Ehrmann, Michael J. Topper, Tobias Baumgartner, K.-D. Lang	2010	6

About K.-D. Lang

K.-D. Lang is a scholar working on Electrical and Electronic Engineering, Surfaces, Coatings and Films, Automotive Engineering, Industrial and Manufacturing Engineering and Mechanics of Materials, having authored 60 papers that have together received 398 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (27 papers), Electronic Packaging and Soldering Technologies (25 papers), Advanced MEMS and NEMS Technologies (5 papers), Semiconductor Lasers and Optical Devices (5 papers), Microwave Engineering and Waveguides (5 papers), Electromagnetic Compatibility and Noise Suppression (5 papers), Additive Manufacturing and 3D Printing Technologies (4 papers) and Metal and Thin Film Mechanics (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (334 citations), Automotive Engineering (28 citations), Mechanics of Materials (43 citations), Biomedical Engineering (75 citations) and Aerospace Engineering (40 citations). K.-D. Lang has collaborated with scholars based in Germany, Switzerland and Italy. Frequent co-authors include Tanja Braun, Hermann Oppermann, Michael J. Topper, Martin Schneider‐Ramelow, R. Aschenbrenner, Ivan Ndip, Kai Zoschke, Karl‐Friedrich Becker, O. Ehrmann and Martin Wilke. Their work appears in journals such as Microelectronics Reliability, Journal of Instrumentation, Applied Surface Science, IET Microwaves Antennas & Propagation and Nuclear Instruments and Methods in Physics Research Section A Accelerators Spectrometers Detectors and Associated Equipment.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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