M. Kobrinsky

905 citations

23 papers · 581 indexed · h-index 12

Impact in

Electronic, Optical and Magnetic Materials
- Copper Interconnects and Reliability
Electrical and Electronic Engineering top 10%
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electromagnetic Simulation and Numerical Methods

Papers in

Electronic, Optical and Magnetic Materials 11
- Copper Interconnects and Reliability 11
Electrical and Electronic Engineering 19
- Electronic Packaging and Soldering Technologies 5
- Electromagnetic Compatibility and Noise Suppression 4
- 3D IC and TSV technologies 4
- Semiconductor materials and devices 4
- Low-power high-performance VLSI design 3
- Photonic and Optical Devices 3

Co-authors: Carl V. Thompson P. Morrow Shriram Ramanathan S.D. Senturia Kuan‐Neng Chen R. Reif M. E. Gross S. Chakravarty
Journals: Applied Physics Letters (2 papers)Acta Materialia (2 papers)IEEE Electron Device Letters (1 paper)Physical review. B, Condensed matter (1 paper)Journal of Microelectromechanical Systems (1 paper)
Partner nations: United States Belgium Ireland

In The Last Decade

M. Kobrinsky

22 papers receiving 558 citations

Peers

Countries citing papers authored by M. Kobrinsky

Since Specialization

Citations

This map shows the geographic impact of M. Kobrinsky's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Kobrinsky with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Kobrinsky more than expected).

Fields of papers citing papers by M. Kobrinsky

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Kobrinsky. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Kobrinsky. The network helps show where M. Kobrinsky may publish in the future.

Co-authorship network

The 25 scholars most cited alongside M. Kobrinsky, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with M. Kobrinsky Line = papers co-authored together M. Kobrinsky links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Back End Of Line opportunities and reliability challenges for future technology nodes M. Kobrinsky, Dr.M.V. Sudhamani	2021	1
2	A Selectively Colorful yet Chilly Perspective on the ^Highs and _Lows of Dielectric Materials for CMOS Nanoelectronics Sean W. King, John J. Plombon, Jeff Bielefeld, James M. Blackwell, Sumit Vyas, Ramanan Chebiam, Carl H. Naylor, David J. Michalak, M. Kobrinsky, Florian Gstrein, M. Metz, James S. Clarke, G.H. Courellis, Michelle M. Paquette, Nancy Martínez-Martínez, Nicholas C. Strandwitz, Fan Ye, M. Orłowski	2020	5
3	Staggered Metallization with Air gaps for Independently Tuned Interconnect Resistance and Capacitance Imre Szekrényesi, Mark Anders, Robert Bristol, Amanda ReCupido, M J Giménez-Torres, F. Anger, Himanshu Kaul, M. Kobrinsky, Ram Krishnamurthy, Miriam Reshotko, Hui Jae Yoo	2020	2
4	Wafer-level electromigration for reliability monitoring: Quick-turn electromigration stress with correlation to package-level stress Pei-jing RONG, Salvar Sigurdarson, Saburo Motozawa, Shinzo Kawase, M. Kobrinsky, Eva Bercel, Hambleton D. Lord	2015	1
5	Demonstration of a sidewall capacitor to evaluate dielectrics and metal barrier thin films Imre Szekrényesi, C.T. Carver, Ramanan Chebiam, Natanael Oliveira Dos Santos, Christin Schulz, Saburo Motozawa, Tejaswi Indukuri, Christopher Jezewski, M. Kobrinsky, B. Krist, Janice Davies, Clirim Tafaj, Alan Myers, John J. Plombon, Kanwal Jit Singh, Hui Jae Yoo	2014	0
6	Controlled fracture of Cu/ultralow-k interconnects Applied Physics Letters ·Han Li, M. Kobrinsky, Shariq Ahmed, John T. Richards, Jiang Liu, Markus Kühn	2013	7
7	A low power electro-optic polymer clad Mach-Zehnder modulator for high speed optical interconnects Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·Bruce A. Block, Shawna M. Liff, M. Kobrinsky, Miriam Reshotko, Ricky J. Tseng, Ibrahim Ban, Peter Chang	2013	5
8	Demonstration of a reliable high-performance and yielding Air gap interconnect process Hui Jae Yoo, S. Balakrishnan, Jeff Bielefeld, Saburo Motozawa, Hidenori Hiramatsu, Sean W. King, M. Kobrinsky, B. Krist, Nazanin Falconer, Nengah Widiadnyana, Kanwal Jit Singh, A García-Testal, Chloe Della Costa	2010	13
9	Design and Fabrication of 3D Microprocessors MRS Proceedings ·JOSEPH ANDREWS L, Bryan Black, M. Kobrinsky, Sriram Muthukumar, Don Nelson, Ian B. Ashton, Clair Webb	2006	30
10	An active 90nm inductive signal noise testchip with realistic microprocessor signal buses 成美山田, Eli Chiprout, 浦辺宏明, Michael Wolfe, M. Kobrinsky	2006	1
11	Three-dimensional wafer stacking via Cu-Cu bonding integrated with 65-nm strained-Si/low-k CMOS technology IEEE Electron Device Letters ·P. Morrow, S. Chaker, Shriram Ramanathan, M. Kobrinsky, Saburo Motozawa	2006	129
12	Comparisons of Conventional, 3-D, Optical, and RF Interconnects for On-Chip Clock Distribution IEEE Transactions on Electron Devices ·Kuan‐Neng Chen, M. Kobrinsky, W. Salet, R. Reif	2004	63
13	A novel technique for full-wave modeling of large-scale three-dimensional high-speed on/off-chip interconnect structures Dan Jiao, Lara Suárez Escandón, S. Chakravarty, Changhong Dai, M. Kobrinsky, Saburo Motozawa, S. List	2003	29
14	Diffusional creep in damascene Cu lines Journal of Applied Physics ·M. Kobrinsky, Carl V. Thompson, M. E. Gross	2001	41
15	Effects of thickness on the characteristic length scale of dislocation plasticity in Ag thin films Acta Materialia ·M. Kobrinsky, Gerhard Dehm, Carl V. Thompson, Eduard Arzt	2001	27
16	Effect of support compliance and residual stress on the shape of doubly supported surface-micromachined beams Journal of Microelectromechanical Systems ·M. Kobrinsky, Stendal EBB InnoKomp GmbH, S.D. Senturia	2000	56
17	Analytic model for the development of bamboo microstructures in thin film strips undergoing normal grain growth Physical review. B, Condensed matter ·H. Kartawan, M. Kobrinsky, Carl V. Thompson	2000	5
18	Activation volume for inelastic deformation in polycrystalline Ag thin films Acta Materialia ·M. Kobrinsky, Carl V. Thompson	2000	66
19	Activation Volume for Inelastic Deformation in Polycrystalline Ag Films at Low Temperatures MRS Proceedings ·M. Kobrinsky, Carl V. Thompson	1999	2
20	The thickness dependence of the flow stress of capped and uncapped polycrystalline Ag thin films Applied Physics Letters ·M. Kobrinsky, Carl V. Thompson	1998	52

About M. Kobrinsky

M. Kobrinsky is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Mechanics of Materials, Atomic and Molecular Physics, and Optics and Condensed Matter Physics, having authored 23 papers that have together received 581 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (11 papers), Electronic Packaging and Soldering Technologies (5 papers), Electromagnetic Compatibility and Noise Suppression (4 papers), Metal and Thin Film Mechanics (4 papers), 3D IC and TSV technologies (4 papers), Semiconductor materials and devices (4 papers), Low-power high-performance VLSI design (3 papers) and Photonic and Optical Devices (3 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (156 citations), Electrical and Electronic Engineering (448 citations), Mechanics of Materials (155 citations), Atomic and Molecular Physics, and Optics (148 citations) and Materials Chemistry (101 citations). M. Kobrinsky has collaborated with scholars based in United States, Belgium and Ireland. Frequent co-authors include Carl V. Thompson, P. Morrow, Shriram Ramanathan, S.D. Senturia, Kuan‐Neng Chen, R. Reif, M. E. Gross, S. Chakravarty, S. List and Dan Jiao. Their work appears in journals such as Applied Physics Letters, Acta Materialia, IEEE Electron Device Letters, Physical review. B, Condensed matter and Journal of Microelectromechanical Systems.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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