R. Reif

5.4k citations

162 papers · 4.1k indexed · h-index 36

Impact in

Electrical and Electronic Engineering top 1%
- 3D IC and TSV technologies
- Thin-Film Transistor Technologies
- Semiconductor materials and devices
- Silicon and Solar Cell Technologies
- Electronic Packaging and Soldering Technologies
- VLSI and FPGA Design Techniques
Hardware and Architecture top 2%

Papers in

Electrical and Electronic Engineering 155
- Thin-Film Transistor Technologies 75
- Semiconductor materials and devices 64
- Silicon and Solar Cell Technologies 63
- 3D IC and TSV technologies 35
- Electronic Packaging and Soldering Technologies 21
Electronic, Optical and Magnetic Materials 18
- Copper Interconnects and Reliability 17

Co-authors: Kuan‐Neng Chen Andy Fan Chuan Seng Tan R.B. Iverson Arif Rahman Shamik Das Anantha P. Chandrakasan J.H. Comfort
Journals: Applied Physics Letters (26 papers)Journal of The Electrochemical Society (23 papers)Journal of Applied Physics (21 papers)Journal of Electronic Materials (15 papers)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (7 papers)
Partner nations: United States South Korea Taiwan

In The Last Decade

R. Reif

158 papers receiving 3.9k citations

Peers

Countries citing papers authored by R. Reif

Since Specialization

Citations

This map shows the geographic impact of R. Reif's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R. Reif with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R. Reif more than expected).

Fields of papers citing papers by R. Reif

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by R. Reif. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R. Reif. The network helps show where R. Reif may publish in the future.

Co-authors

The 25 scholars most cited alongside R. Reif, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with R. Reif Line = papers co-authored together R. Reif links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	A Back-to-Face Silicon Layer Stacking for Three-Dimensional Integration Chuan Seng Tan, Kuan‐Neng Chen, Andy Fan, R. Reif	2006	4
2	Investigations of strength of copper-bonded wafers with several quantitative and qualitative tests Journal of Electronic Materials ·Kuan‐Neng Chen, Zitong Wan, L.C. Shen, R. Reif	2006	16
3	Microelectronics Thin Film Handling and Transfer Using Low-Temperature Wafer Bonding Electrochemical and Solid-State Letters ·Chuan Seng Tan, R. Reif	2005	11
4	Comparisons of Conventional, 3-D, Optical, and RF Interconnects for On-Chip Clock Distribution IEEE Transactions on Electron Devices ·Kuan‐Neng Chen, M. Kobrinsky, W. Salet, R. Reif	2004	63
5	Temperature and duration effects on microstructure evolution during copper wafer bonding Journal of Electronic Materials ·Kuan‐Neng Chen, Andy Fan, Chuan Seng Tan, R. Reif	2003	34
6	Air-bridge Microcavity APS ·Shanhui Fan, Pierre R. Villeneuve, J. D. Joannopoulos, U., G.S. Petrich, L. A. Kolodziejski, R. Reif, Cragg Stephanie, Redi Rripay, E. P. Ippen	1996	2
7	Phosphorus doping of epitaxial Si and Si1−xGex at very low pressure Applied Physics Letters ·Syun‐Ming Jang, Hwa Yol Jung, R. Reif	1993	15
8	Fundamentals of epitaxial silicon film thickness measurements using emission and reflection Fourier transform infrared spectroscopy Journal of Applied Physics ·张慧, N Glanville, Kathryn L. Hier, R. Reif	1993	6
9	Plasma Enhanced Chemical Vapor Deposition of Blanket TiSi2 on Oxide Patterned Wafers: II . Silicide Properties Journal of The Electrochemical Society ·Jaegab Lee, R. Reif	1992	6
10	Low temperature Si2H6 Si epitaxy in-situ doped with AsH3/SiH4 Journal of Electronic Materials ·Sanja Pajic, J.H. Comfort, R. Reif	1990	5
11	Phosphorus incorporation in GaAsP grown by remote-plasma MOCVD Journal of Electronic Materials ·Alan D. Huelsman, R. Reif	1989	6
12	Proceedings of the First International Symposium on Advanced Materials for ULSI Electrochemical Society eBooks ·Martin Scott, C. Raghunadha Guptha, R. Reif, Insulation Division	1988	2
13	Surface effect as a limitation on the performance of polycrystalline Si thin-film transistors Journal of Applied Physics ·Arsenii O. Vysotskyi, R. Reif	1988	4
14	Enhanced electrical quality of low-temperature (Tdep≤800 °C) epitaxial silicon deposited by plasma-enhanced chemical vapor deposition Applied Physics Letters ·Juan Carlos Andrés, Wolfgang Bürger, R. Reif	1988	4
15	Bulk-quality bipolar transistors fabricated in low-temperature (Tdep =800 °C) epitaxial silicon Applied Physics Letters ·Wolfgang Bürger, R. Reif	1987	12
16	Implant-dose dependence of grain size and {110} texture enhancements in polycrystalline Si films by seed selection through ion channeling Journal of Applied Physics ·Arsenii O. Vysotskyi, R. Reif	1986	26
17	Low Temperature Silicon Epitaxy Deposited by Very Low Pressure Chemical Vapor Deposition: III . Pattern Transfer Journal of The Electrochemical Society ·Karim Ershadul, R. Reif	1986	1
18	A trapping mechanism for autodoping in silicon epitaxy—II. Parameter extraction and simulations IEEE Transactions on Electron Devices ·Man Wong, R. Reif, G. R. Srinivasan	1985	14
19	Solid phase epitaxial recrystallization of thin polysilicon films amorphized by silicon ion implantation Applied Physics Letters ·Zheng Ye-xin, R. Reif	1982	48
20	Low-temperature process to increase the grain size in polysilicon films Electronics Letters ·R. Reif, 栄次槇谷	1981	38

About R. Reif

R. Reif is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Computational Mechanics, Materials Chemistry and Hardware and Architecture, having authored 162 papers that have together received 4.1k indexed citations. Recurring topics across this work include Thin-Film Transistor Technologies (75 papers), Semiconductor materials and devices (64 papers), Silicon and Solar Cell Technologies (63 papers), 3D IC and TSV technologies (35 papers), Silicon Nanostructures and Photoluminescence (34 papers), Electronic Packaging and Soldering Technologies (21 papers), Copper Interconnects and Reliability (17 papers) and Ion-surface interactions and analysis (16 papers). The work is most often cited by research in Electrical and Electronic Engineering (3.8k citations), Hardware and Architecture (269 citations), Materials Chemistry (1.1k citations), Electronic, Optical and Magnetic Materials (417 citations) and Atomic and Molecular Physics, and Optics (599 citations). R. Reif has collaborated with scholars based in United States, South Korea and Taiwan. Frequent co-authors include Kuan‐Neng Chen, Andy Fan, Chuan Seng Tan, R.B. Iverson, Arif Rahman, Shamik Das, Anantha P. Chandrakasan, J.H. Comfort, Syun‐Ming Jang and Noriyoshi Yamauchi. Their work appears in journals such as Applied Physics Letters, Journal of The Electrochemical Society, Journal of Applied Physics, Journal of Electronic Materials and Journal of Vacuum Science & Technology A Vacuum Surfaces and Films.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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