H. Ceric

1.1k total citations
102 papers, 835 citations indexed

About

H. Ceric is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, H. Ceric has authored 102 papers receiving a total of 835 indexed citations (citations by other indexed papers that have themselves been cited), including 91 papers in Electrical and Electronic Engineering, 55 papers in Electronic, Optical and Magnetic Materials and 22 papers in Mechanics of Materials. Recurrent topics in H. Ceric's work include Copper Interconnects and Reliability (54 papers), Semiconductor materials and devices (49 papers) and Electronic Packaging and Soldering Technologies (45 papers). H. Ceric is often cited by papers focused on Copper Interconnects and Reliability (54 papers), Semiconductor materials and devices (49 papers) and Electronic Packaging and Soldering Technologies (45 papers). H. Ceric collaborates with scholars based in Austria, Belgium and Russia. H. Ceric's co-authors include S. Selberherr, Roberto Lacerda de Orio, Tibor Grasser, Stanislav Tyaginov, H. Enichlmair, Ivan A. Starkov, Christoph Jungemann, Rui Huang, Kristof Croes and Houman Zahedmanesh and has published in prestigious journals such as Journal of Applied Physics, American Journal of Obstetrics and Gynecology and IEEE Transactions on Electron Devices.

In The Last Decade

H. Ceric

94 papers receiving 824 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
H. Ceric Austria 15 767 347 103 79 78 102 835
S. Kadomura Japan 11 499 0.7× 170 0.5× 68 0.7× 34 0.4× 75 1.0× 43 542
Harry A. Schafft United States 13 603 0.8× 291 0.8× 65 0.6× 91 1.2× 97 1.2× 47 690
L.W. Schaper United States 15 563 0.7× 108 0.3× 58 0.6× 57 0.7× 110 1.4× 64 669
M. Kobrinsky United States 12 448 0.6× 156 0.4× 155 1.5× 148 1.9× 101 1.3× 23 581
L.T. Su United States 14 944 1.2× 129 0.4× 67 0.7× 82 1.0× 225 2.9× 31 1.1k
H.-U. Schreiber Germany 15 500 0.7× 288 0.8× 67 0.7× 138 1.7× 60 0.8× 48 718
A. Farcy France 17 834 1.1× 199 0.6× 44 0.4× 59 0.7× 115 1.5× 102 936
D. Harmon United States 15 727 0.9× 156 0.4× 43 0.4× 41 0.5× 129 1.7× 26 765
Ritwik Chatterjee United States 16 909 1.2× 85 0.2× 39 0.4× 51 0.6× 60 0.8× 31 952
H. Fujimoto United States 12 323 0.4× 144 0.4× 266 2.6× 77 1.0× 134 1.7× 45 613

Countries citing papers authored by H. Ceric

Since Specialization
Citations

This map shows the geographic impact of H. Ceric's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Ceric with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Ceric more than expected).

Fields of papers citing papers by H. Ceric

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H. Ceric. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Ceric. The network helps show where H. Ceric may publish in the future.

Co-authorship network of co-authors of H. Ceric

This figure shows the co-authorship network connecting the top 25 collaborators of H. Ceric. A scholar is included among the top collaborators of H. Ceric based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H. Ceric. H. Ceric is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Croes, Kristof, et al.. (2025). Novel concept-oriented synthetic data approach for training generative AI-Driven crystal grain analysis using diffusion model. Computational Materials Science. 251. 113723–113723. 2 indexed citations
2.
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4.
Ceric, H., Roberto Lacerda de Orio, & S. Selberherr. (2023). Statistical study of electromigration in gold interconnects. Microelectronics Reliability. 147. 115061–115061. 5 indexed citations
5.
Ceric, H., Houman Zahedmanesh, Kristof Croes, Roberto Lacerda de Orio, & S. Selberherr. (2023). Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds. Journal of Applied Physics. 133(10). 6 indexed citations
6.
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Zahedmanesh, Houman, et al.. (2023). Impact of via geometry and line extension on via-electromigration in nano-interconnects. Lirias. 1–4. 1 indexed citations
8.
Ceric, H., et al.. (2021). Void-dynamics in nano-wires and the role of microstructure investigated via a multi-scale physics-based model. Journal of Applied Physics. 129(12). 8 indexed citations
9.
Grill, Alexander, Bernhard Stampfer, Michael Waltl, et al.. (2017). Characterization and modeling of single defects in GaN/AlGaN fin-MIS-HEMTs. 3B–5.1. 11 indexed citations
10.
Ceric, H., et al.. (2015). Impact of microstructure and current crowding on electromigration: A TCAD study. 194–197. 3 indexed citations
11.
Orio, Roberto Lacerda de, H. Ceric, & S. Selberherr. (2012). Electromigration failure in a copper dual-damascene structure with a through silicon via. Microelectronics Reliability. 52(9-10). 1981–1986. 23 indexed citations
12.
Cassidy, Cathal, et al.. (2012). Through Silicon Via Reliability. IEEE Transactions on Device and Materials Reliability. 12(2). 285–295. 45 indexed citations
13.
Orio, Roberto Lacerda de, H. Ceric, & S. Selberherr. (2011). A compact model for early electromigration failures of copper dual-damascene interconnects. Microelectronics Reliability. 51(9-11). 1573–1577. 26 indexed citations
14.
Starkov, Ivan A., Stanislav Tyaginov, H. Enichlmair, et al.. (2011). Hot-carrier degradation caused interface state profile—Simulation versus experiment. Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena. 29(1). 22 indexed citations
15.
Ceric, H. & S. Selberherr. (2010). Electromigration in submicron interconnect features of integrated circuits. Materials Science and Engineering R Reports. 71(5-6). 53–86. 67 indexed citations
16.
Tyaginov, Stanislav, Ivan A. Starkov, Christoph Jungemann, et al.. (2010). Interface states charges as a vital component for hc degradation modeling.. RWTH Publications (RWTH Aachen). 2 indexed citations
17.
Ceric, H., et al.. (2006). Three-Dimensional Simulation of Thermal Oxidation and the Influence of Stress. ECS Meeting Abstracts. MA2005-02(19). 734–734. 1 indexed citations
18.
Ceric, H., et al.. (2005). Simulation of dynamic NBTI degradation for a 90nm CMOS technology. TechConnect Briefs. 3(2005). 29–32. 4 indexed citations
19.
Ceric, H. & S. Selberherr. (2003). An Adaptive Grid Approach for the Simulation of Electromigration Induced Void Migration( the IEEE International Coference on SISPAD '02). IEICE Transactions on Electronics. 86(3). 421–426. 1 indexed citations
20.
Ceric, H., et al.. (2003). MODELING OF SEGREGATION ON MATERIAL INTERFACES BY MEANS OF THE FINITE ELEMENT METHOD. American Journal of Obstetrics and Gynecology. 131(6). 620–3. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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