George G. Harman
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 10%
- Mechanics of Materials top 10%
- Materials Chemistry
- Electronic, Optical and Magnetic Materials
- Co-authors
- David L. BlackburnJoseph J. KopanskiD.W. BerningKlaus‐Dieter LangPavel MachMichael GaitanYogendra JoshiCharles L. Wilson
- Topics
- Electronic Packaging and Soldering Technologies (12 papers)3D IC and TSV technologies (9 papers)Integrated Circuits and Semiconductor Failure Analysis (4 papers)
- Journals
- Journal of Applied PhysicsReview of Scientific InstrumentsPhysical Review
- Partner nations
- United StatesCzechia
In The Last Decade
George G. Harman
22 papers receiving 564 citations
Peers
Comparison fields: 5 of 49
- Electrical and Electronic Engineering 526
- Mechanical Engineering 200
- Mechanics of Materials 117
- Materials Chemistry 99
- Electronic, Optical and Magnetic Materials 74
Countries citing papers authored by George G. Harman
This map shows the geographic impact of George G. Harman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by George G. Harman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites George G. Harman more than expected).
Fields of papers citing papers by George G. Harman
This network shows the impact of papers produced by George G. Harman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by George G. Harman. The network helps show where George G. Harman may publish in the future.
Co-authorship network of co-authors of George G. Harman
This figure shows the co-authorship network connecting the top 25 collaborators of George G. Harman. A scholar is included among the top collaborators of George G. Harman based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with George G. Harman. George G. Harman is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | Wire bonding in microelectronics | 153 |
| 2 | Modern wire bonding technologies - ready for the challenges of future microelectronic packaging | 5 |
| 3 | Wire bonding to advanced copper-low-K integrated circuits, the metal/dielectric stacks, and Materials considerations | 5 |
| 4 | Wire bond temperature sensor | 5 |
| 5 | 3 | |
| 6 | Wire bonding in microelectronics : materials, processes, reliability, and yield | 295 |
| 7 | Wire Bonding in Microelectronics Materials, Processes, Reliability and Yield, 2nd Edition | 7 |
| 8 | Reliability and Yield Problems of Wire Bonding in Microelectronics, The Application of Materials and Interface Science, International Society for Hybrid Microelectronics (ISHM) Monograph | 11 |
| 9 | 2 | |
| 10 | 1 | |
| 11 | 4 | |
| 12 | 21 | |
| 13 | 1 | |
| 14 | 9 | |
| 15 | 5 | |
| 16 | 1 | |
| 17 | 3 | |
| 18 | 26 | |
| 19 | 4 | |
| 20 | 50 |
About George G. Harman
George G. Harman is a scholar working on Structural Biology, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, having authored 23 papers that have together received 642 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (9 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (526 citations), Mechanical Engineering (200 citations) and Mechanics of Materials (117 citations). George G. Harman has collaborated with scholars based in United States and Czechia. Frequent co-authors include David L. Blackburn, Joseph J. Kopanski, D.W. Berning, Klaus‐Dieter Lang, Pavel Mach, Michael Gaitan, Yogendra Joshi and Charles L. Wilson. Their work appears in journals such as Journal of Applied Physics, Review of Scientific Instruments and Physical Review.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.