Jeffery C. C. Lo
- Electrical and Electronic Engineering
- Mechanics of Materials top 10%
- Biomedical Engineering
- Mechanical Engineering
- Materials Chemistry
- Topics
- Electronic Packaging and Soldering Technologies (43 papers)3D IC and TSV technologies (33 papers)GaN-based semiconductor devices and materials (15 papers)
- Partner nations
- Hong KongChinaUnited States
In The Last Decade
Jeffery C. C. Lo
90 papers receiving 399 citations
Peers
Comparison fields: 5 of 56
- Electrical and Electronic Engineering 261
- Mechanics of Materials 90
- Biomedical Engineering 83
- Mechanical Engineering 81
- Materials Chemistry 66
Countries citing papers authored by Jeffery C. C. Lo
This map shows the geographic impact of Jeffery C. C. Lo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jeffery C. C. Lo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jeffery C. C. Lo more than expected).
Fields of papers citing papers by Jeffery C. C. Lo
This network shows the impact of papers produced by Jeffery C. C. Lo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jeffery C. C. Lo. The network helps show where Jeffery C. C. Lo may publish in the future.
Co-authorship network of co-authors of Jeffery C. C. Lo
This figure shows the co-authorship network connecting the top 25 collaborators of Jeffery C. C. Lo. A scholar is included among the top collaborators of Jeffery C. C. Lo based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jeffery C. C. Lo. Jeffery C. C. Lo is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 4 | |
| 3 | 0 | |
| 4 | 2 | |
| 5 | 1 | |
| 6 | 1 | |
| 7 | 0 | |
| 8 | 8 | |
| 9 | 3 | |
| 10 | 11 | |
| 11 | 2 | |
| 12 | 0 | |
| 13 | 5 | |
| 14 | 3 | |
| 15 | 9 | |
| 16 | 9 | |
| 17 | Computational parametric study on the strain hardening effect of lead-free solder joints in board level mechanical drop tests | 3 |
| 18 | 5 | |
| 19 | 3 | |
| 20 | 12 |
About Jeffery C. C. Lo
Jeffery C. C. Lo is a scholar working on Electrical and Electronic Engineering, Condensed Matter Physics and Automotive Engineering, having authored 98 papers that have together received 412 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (43 papers), 3D IC and TSV technologies (33 papers) and GaN-based semiconductor devices and materials (15 papers). The work is most often cited by research in Condensed Matter Physics (62 citations), Electrical and Electronic Engineering (261 citations) and Mechanics of Materials (90 citations). Jeffery C. C. Lo has collaborated with scholars based in Hong Kong, China and United States. Frequent co-authors include S. W. Ricky Lee, Tong Wu, Rong Zhang, P. S. Alexopoulos, C. Hwang, Fubin Song, Tong Jiang, Wei Xu, Zhiwei Wang and Chaoran Yang. Their work appears in journals such as Journal of Applied Physics, Thin Solid Films and Polymers.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.