Brook Chao

548 total citations
12 papers, 453 citations indexed

About

Brook Chao is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Brook Chao has authored 12 papers receiving a total of 453 indexed citations (citations by other indexed papers that have themselves been cited), including 12 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 3 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Brook Chao's work include Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (5 papers) and Intermetallics and Advanced Alloy Properties (4 papers). Brook Chao is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (5 papers) and Intermetallics and Advanced Alloy Properties (4 papers). Brook Chao collaborates with scholars based in United States, China and Germany. Brook Chao's co-authors include Paul S. Ho, Jay Im, Xuefeng Zhang, Xuefeng Zhang, Min Ding, Peng Su, Kuan-Hsun Lu, Guotao Wang, Guotao Wang and Zhi‐Quan Luo and has published in prestigious journals such as Journal of Applied Physics, Acta Materialia and Microelectronics Reliability.

In The Last Decade

Brook Chao

12 papers receiving 436 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Brook Chao United States	7	431	203	171	48	43	12	453
King-Ning Tu United States	4	307 0.7×	136 0.7×	107 0.6×	32 0.7×	39 0.9×	6	338
Ying-Ta Chiu Taiwan	13	457 1.1×	248 1.2×	143 0.8×	37 0.8×	35 0.8×	37	493
Chin-Li Kao Taiwan	14	452 1.0×	136 0.7×	187 1.1×	20 0.4×	37 0.9×	38	475
G.T. Galyon United States	9	424 1.0×	243 1.2×	101 0.6×	72 1.5×	77 1.8×	15	488
P. Elenius United States	13	718 1.7×	272 1.3×	231 1.4×	43 0.9×	20 0.5×	27	733
H. Balkan United States	9	526 1.2×	229 1.1×	205 1.2×	35 0.7×	16 0.4×	15	545
Everett C. C. Yeh United States	10	852 2.0×	153 0.8×	371 2.2×	21 0.4×	39 0.9×	14	873
Guangchen Xu China	13	368 0.9×	232 1.1×	112 0.7×	24 0.5×	19 0.4×	25	390
C. Y. Liu United States	7	355 0.8×	151 0.7×	178 1.0×	35 0.7×	27 0.6×	10	398
Yi-Wun Wang Taiwan	14	684 1.6×	535 2.6×	84 0.5×	82 1.7×	58 1.3×	35	750

Countries citing papers authored by Brook Chao

Since Specialization

Citations

This map shows the geographic impact of Brook Chao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Brook Chao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Brook Chao more than expected).

Fields of papers citing papers by Brook Chao

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Brook Chao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Brook Chao. The network helps show where Brook Chao may publish in the future.

Co-authorship network of co-authors of Brook Chao

This figure shows the co-authorship network connecting the top 25 collaborators of Brook Chao. A scholar is included among the top collaborators of Brook Chao based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Brook Chao. Brook Chao is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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12 of 12 papers shown

Chao, Brook, et al.. (2009). Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints. Microelectronics Reliability. 49(3). 253–263. 64 indexed citations

Shi, Hua‐Tian, Huai Huang, Brook Chao, et al.. (2008). Mechanistic Study of CO<inf>2</inf> Plasma Damage to OSG Low k Dielectrics. 26. 31–33. 1 indexed citations

Chao, Brook, et al.. (2008). Dual damascene BEOL processing using multilevel step and flash imprint lithography. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6921. 69210C–69210C. 10 indexed citations

Chao, Brook, et al.. (2008). High resolution nanoimprint templates for dual damascene: fabrication and imprint results. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6921. 69210D–69210D. 6 indexed citations

Chao, Brook, et al.. (2007). Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing. Acta Materialia. 55(8). 2805–2814. 174 indexed citations

Chao, Brook, et al.. (2007). Kinetic Analysis of Electromigration Enhanced Intermetallic Growth and Void Formation in Pb-Free Solders. 28. 1–8. 1 indexed citations

Chao, Brook, et al.. (2007). Investigation of Intermetallic Compound Growth Enhanced by Electromigration in Pb-Free Solder Joints. 22. 1442–1449. 6 indexed citations

Palmieri, Frank L., et al.. (2007). Multilevel step and flash imprint lithography for direct patterning of dielectrics. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6517. 65170K–65170K. 3 indexed citations

Lu, Kuan, Brook Chao, Zhi‐Quan Luo, et al.. (2007). Moisture Transport and its Effects on Fracture Strength and Dielectric Constant of Underfill Materials. 1040–1044. 7 indexed citations

10.

Ding, Min, et al.. (2006). Effect of contact metallization on electromigration reliability of Pb-free solder joints. Journal of Applied Physics. 99(9). 70 indexed citations

11.

Chao, Brook, Xuefeng Zhang, Kuan-Hsun Lu, et al.. (2006). Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints. Journal of Applied Physics. 100(8). 94 indexed citations

12.

Ding, Min, et al.. (2005). A study of electromigration failure in PB-free solder joints. 21. 518–523. 17 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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