R. Horton

2.0k total citations · 1 hit paper
31 papers, 1.6k citations indexed

About

R. Horton is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Aerospace Engineering. According to data from OpenAlex, R. Horton has authored 31 papers receiving a total of 1.6k indexed citations (citations by other indexed papers that have themselves been cited), including 31 papers in Electrical and Electronic Engineering, 6 papers in Atomic and Molecular Physics, and Optics and 5 papers in Aerospace Engineering. Recurrent topics in R. Horton's work include 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (13 papers) and Microwave Engineering and Waveguides (7 papers). R. Horton is often cited by papers focused on 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (13 papers) and Microwave Engineering and Waveguides (7 papers). R. Horton collaborates with scholars based in United States, Japan and United Kingdom. R. Horton's co-authors include Cornelia Tsang, John Knickerbocker, Paul Andry, S. L. Wright, R. Polastre, C.S. Patel, E. Sprogis, Bucknell C. Webb, B. Dang and Katsuyuki Sakuma and has published in prestigious journals such as IEEE Journal of Solid-State Circuits, IEEE Transactions on Microwave Theory and Techniques and Electronics Letters.

In The Last Decade

R. Horton

30 papers receiving 1.5k citations

Hit Papers

align trajectories sort by overperformance

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Three-dimensional silicon integration

2008 396 citations John Knickerbocker, Paul Andry et al. IBM Journal of Research and Development profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
R. Horton United States	17	1.5k	228	225	161	128	31	1.6k
E. Sprogis United States	18	1.7k 1.1×	246 1.1×	267 1.2×	153 1.0×	152 1.2×	31	1.7k
B. Dang United States	17	1.4k 0.9×	230 1.0×	250 1.1×	112 0.7×	114 0.9×	29	1.5k
Cornelia Tsang United States	26	2.2k 1.5×	360 1.6×	377 1.7×	167 1.0×	166 1.3×	51	2.4k
Anne Jourdain Belgium	24	1.4k 1.0×	451 2.0×	179 0.8×	126 0.8×	86 0.7×	114	1.5k
R. Polastre United States	21	1.8k 1.2×	339 1.5×	286 1.3×	139 0.9×	158 1.2×	42	2.2k
Paul Andry United States	28	2.4k 1.6×	382 1.7×	405 1.8×	182 1.1×	210 1.6×	64	2.6k
Jonghyun Cho South Korea	18	1.6k 1.1×	116 0.5×	139 0.6×	108 0.7×	62 0.5×	86	1.6k
Fabrice Paillet United States	14	834 0.6×	200 0.9×	43 0.2×	131 0.8×	144 1.1×	21	1.0k
Michele Stucchi Belgium	22	2.3k 1.5×	241 1.1×	195 0.9×	232 1.4×	365 2.9×	132	2.4k
Guruprasad Katti Belgium	13	1.0k 0.7×	140 0.6×	90 0.4×	105 0.7×	67 0.5×	27	1.1k

Countries citing papers authored by R. Horton

Since Specialization

Citations

This map shows the geographic impact of R. Horton's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R. Horton with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R. Horton more than expected).

Fields of papers citing papers by R. Horton

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by R. Horton. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R. Horton. The network helps show where R. Horton may publish in the future.

Co-authorship network of co-authors of R. Horton

This figure shows the co-authorship network connecting the top 25 collaborators of R. Horton. A scholar is included among the top collaborators of R. Horton based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with R. Horton. R. Horton is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Schow, Clint L., Fuad E. Doany, Cornelia Tsang, et al.. (2008). 300-Gb/s, 24-Channel Full-Duplex, 850-nm, CMOS-Based Optical Transceivers. 1–3. 16 indexed citations

Sakuma, Katsuyuki, Paul Andry, Cornelia Tsang, et al.. (2008). 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM Journal of Research and Development. 52(6). 611–622. 126 indexed citations

Doany, Fuad E., Clint L. Schow, Cornelia Tsang, et al.. (2008). 300-Gb/s 24-channel bidirectional Si carrier transceiver Optochip for board-level interconnects. 238–243. 27 indexed citations

Kash, J. A., Fuad E. Doany, Clint L. Schow, et al.. (2008). Terabus: Chip-to-chip board-level optical data buses. 515–516.

Knickerbocker, John, Paul Andry, B. Dang, et al.. (2008). Three-dimensional silicon integration. IBM Journal of Research and Development. 52(6). 553–569. 396 indexed citations breakdown →

Knickerbocker, John, Paul Andry, B. Dang, et al.. (2008). 3D silicon integration. 538–543. 183 indexed citations

Sakuma, Katsuyuki, Paul Andry, B. Dang, et al.. (2007). 3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections. 627–632. 70 indexed citations

Wright, S. L., R. Polastre, H. Gan, et al.. (2006). Characterization of Micro-Bump C4 Interconnects for Si-Carrier SOP Applications. 633–640. 73 indexed citations

Knickerbocker, John, C.S. Patel, Paul Andry, et al.. (2006). 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. IEEE Journal of Solid-State Circuits. 41(8). 1718–1725. 151 indexed citations

10.

Gan, H., S. L. Wright, R. Polastre, et al.. (2006). Pb-free Micro-joints (50 um pitch) for the Next Generation Micro-systems: the Fabrication, Assembly and Characterization. 1210–1215. 36 indexed citations

11.

Knickerbocker, John, C.S. Patel, Paul Andry, et al.. (2006). Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. 43. 654–657. 15 indexed citations

12.

Knickerbocker, John, Paul Andry, L.P. Buchwalter, et al.. (2005). Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM Journal of Research and Development. 49(4.5). 725–753. 199 indexed citations

13.

Patel, C.S., Cornelia Tsang, Christian Stefano Schuster, et al.. (2005). Silicon Carrier with Deep Through-Vias, Fine Pitch Wiring and Through Cavity for Parallel Optical Transceiver. 2. 1318–1324. 29 indexed citations

14.

Palmer, Michael J., et al.. (2002). HAT tool for fluxless OLB and TAB. 507–510. 4 indexed citations

15.

Fryer, P. M., E. G. Colgan, E. Galligan, et al.. (1998). High Conductivity Gate Metallurgy for TFT/LCD's. MRS Proceedings. 508. 1 indexed citations

16.

Wright, S. L., et al.. (1998). Active line repair for thin-film-transistor liquid crystal displays. IBM Journal of Research and Development. 42(3.4). 445–458. 4 indexed citations

17.

Horton, R.. (1973). A Static Approximation of the Inductive and Capacitative Elements Associated with Some Common Microstrip Discontinuities. 1–4. 1 indexed citations

18.

Horton, R.. (1973). Loss Calculations of Coupled Microstrip Lines (Short Papers). IEEE Transactions on Microwave Theory and Techniques. 21(5). 359–360. 6 indexed citations

19.

Horton, R.. (1972). The Electrical Characterization of a Right-Angled Bend in Microstrip Line. 9 indexed citations

20.

Horton, R., B. Easter, & A. Gopinath. (1971). Variation of microstrip losses with thickness of strip. Electronics Letters. 7(17). 490–491. 42 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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