Tengfei Jiang
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials
- Automotive Engineering top 10%
- Topics
- 3D IC and TSV technologies (35 papers)Electronic Packaging and Soldering Technologies (29 papers)Copper Interconnects and Reliability (12 papers)
- Cited by
- Electrical and Electronic EngineeringAutomotive EngineeringElectronic, Optical and Magnetic Materials
- Partner nations
- United StatesSouth KoreaChina
In The Last Decade
Tengfei Jiang
44 papers receiving 705 citations
Peers
Comparison fields: 5 of 50
- Electrical and Electronic Engineering 583
- Mechanical Engineering 137
- Biomedical Engineering 132
- Electronic, Optical and Magnetic Materials 98
- Automotive Engineering 76
Countries citing papers authored by Tengfei Jiang
This map shows the geographic impact of Tengfei Jiang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tengfei Jiang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tengfei Jiang more than expected).
Fields of papers citing papers by Tengfei Jiang
This network shows the impact of papers produced by Tengfei Jiang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tengfei Jiang. The network helps show where Tengfei Jiang may publish in the future.
Co-authorship network of co-authors of Tengfei Jiang
This figure shows the co-authorship network connecting the top 25 collaborators of Tengfei Jiang. A scholar is included among the top collaborators of Tengfei Jiang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tengfei Jiang. Tengfei Jiang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 1 | |
| 3 | 43 | |
| 4 | 2 | |
| 5 | 13 | |
| 6 | 3 | |
| 7 | 6 | |
| 8 | 13 | |
| 9 | 3 | |
| 10 | 2 | |
| 11 | 40 | |
| 12 | 10 | |
| 13 | 49 | |
| 14 | 1 | |
| 15 | 1 | |
| 16 | 4 | |
| 17 | 57 | |
| 18 | 95 | |
| 19 | 22 | |
| 20 | 3 |
About Tengfei Jiang
Tengfei Jiang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering, having authored 45 papers that have together received 723 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (35 papers), Electronic Packaging and Soldering Technologies (29 papers) and Copper Interconnects and Reliability (12 papers). The work is most often cited by research in Electrical and Electronic Engineering (583 citations), Automotive Engineering (76 citations) and Electronic, Optical and Magnetic Materials (98 citations). Tengfei Jiang has collaborated with scholars based in United States, South Korea and China. Frequent co-authors include Paul S. Ho, Rui Huang, Jay Im, Suk-Kyu Ryu, Hwa–Young Son, Jang‐Hi Im, Nobumichi Tamura, Kuan-Hsun Lu, Qiu Zhao and Kwang-Yoo Byun. Their work appears in journals such as Applied Physics Letters, Scripta Materialia and Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.