Min Ding

727 total citations
29 papers, 527 citations indexed

About

Min Ding is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Min Ding has authored 29 papers receiving a total of 527 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Electrical and Electronic Engineering, 15 papers in Mechanical Engineering and 9 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Min Ding's work include Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (16 papers) and Copper Interconnects and Reliability (7 papers). Min Ding is often cited by papers focused on Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (16 papers) and Copper Interconnects and Reliability (7 papers). Min Ding collaborates with scholars based in United States, China and Malaysia. Min Ding's co-authors include Paul S. Ho, Peng Su, Brook Chao, Guotao Wang, Xuefeng Zhang, Kuan-Hsun Lu, Jay Im, Jie-Hua Zhao, Xiang Dai and Mingcen Weng and has published in prestigious journals such as Journal of Applied Physics, Chemical Engineering Journal and Journal of Applied Polymer Science.

In The Last Decade

Min Ding

28 papers receiving 501 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Min Ding United States	13	434	220	173	64	53	29	527
Bob Chylak United States	16	549 1.3×	226 1.0×	120 0.7×	57 0.9×	46 0.9×	50	636
Barbara Horváth Hungary	14	355 0.8×	191 0.9×	57 0.3×	57 0.9×	43 0.8×	31	445
G.T. Galyon United States	9	424 1.0×	243 1.1×	101 0.6×	22 0.3×	72 1.4×	15	488
Rong An China	16	506 1.2×	364 1.7×	76 0.4×	54 0.8×	66 1.2×	55	654
Vivek Chidambaram Singapore	13	569 1.3×	361 1.6×	52 0.3×	66 1.0×	42 0.8×	36	661
Chin-Li Kao Taiwan	14	452 1.0×	136 0.6×	187 1.1×	22 0.3×	20 0.4×	38	475
Jeong‐Tak Moon South Korea	13	542 1.2×	186 0.8×	126 0.7×	17 0.3×	17 0.3×	28	577
Kazuhiko Sugiura Japan	11	454 1.0×	319 1.4×	69 0.4×	17 0.3×	16 0.3×	32	550
I. Turlik United States	15	381 0.9×	142 0.6×	57 0.3×	52 0.8×	22 0.4×	35	464
Kyu Seok Han South Korea	11	241 0.6×	99 0.5×	102 0.6×	97 1.5×	63 1.2×	24	402

Countries citing papers authored by Min Ding

Since Specialization

Citations

This map shows the geographic impact of Min Ding's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Min Ding with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Min Ding more than expected).

Fields of papers citing papers by Min Ding

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Min Ding. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Min Ding. The network helps show where Min Ding may publish in the future.

Co-authorship network of co-authors of Min Ding

This figure shows the co-authorship network connecting the top 25 collaborators of Min Ding. A scholar is included among the top collaborators of Min Ding based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Min Ding. Min Ding is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Zhou, Peidi, Min Ding, Junjie Lin, et al.. (2024). Ag@MXene-cellulose nanofiber composite for electromagnetic interference shielding, sensing, and actuating. Sensors and Actuators A Physical. 380. 116045–116045. 4 indexed citations

Ding, Min, et al.. (2022). Theoretical thermal-mechanical modelling and experimental validation of a novel 3D three-fingered electrothermal microgripper. Precision Engineering. 77. 205–219. 2 indexed citations

Weng, Mingcen, Min Ding, Peidi Zhou, et al.. (2022). Multi-functional and integrated actuators made with bio-inspired cobweb carbon nanotube–Polymer composites. Chemical Engineering Journal. 452. 139146–139146. 41 indexed citations

Li, Congwei, Min Ding, Jiahao Zhou, et al.. (2022). Dual‐responsive smart actuator based on Ti3C2Tx/polymer bilayer structure for bionic applications. Sensors and Actuators A Physical. 341. 113553–113553. 15 indexed citations

Ding, Min, et al.. (2021). Research on the Relationship between Carbon Precipitation and Mechanical Properties of Dissimilar Steel Welds. Journal of Physics Conference Series. 1748(6). 62063–62063.

Ding, Min, et al.. (2021). Dual‐responsive and bidirectional bending actuators based on a graphene oxide composite for bionic soft robotics. Journal of Applied Polymer Science. 139(17). 17 indexed citations

Wu, Wei, et al.. (2011). Application of Argon Ion Beam Cross Section Polishing in Material Microstructure Research. Key engineering materials. 492. 419–423. 4 indexed citations

Liu, Weiping, et al.. (2009). Shock resistant and thermally reliable low Ag SAC solders doped with Mn Or Ce. 49–63. 10 indexed citations

Liu, Weiping, et al.. (2009). Achieving high reliability low cost lead-free SAC solder joints via Mn or Ce doping. 994–1007. 34 indexed citations

10.

Zhao, Jie-Hua, et al.. (2006). Microstructure-Based Stress Modeling of Tin Whisker Growth. IEEE Transactions on Electronics Packaging Manufacturing. 29(4). 265–273. 28 indexed citations

11.

Ding, Min, et al.. (2006). Effect of contact metallization on electromigration reliability of Pb-free solder joints. Journal of Applied Physics. 99(9). 70 indexed citations

12.

Chao, Brook, Xuefeng Zhang, Kuan-Hsun Lu, et al.. (2006). Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints. Journal of Applied Physics. 100(8). 94 indexed citations

13.

Zhang, Xuefeng, et al.. (2006). Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages. Journal of Materials Science Materials in Electronics. 18(1-3). 247–258. 31 indexed citations

14.

Ding, Min, et al.. (2006). Lead-free Flux Effect in Lead-free Solder Joint Improvement. 541–548. 1 indexed citations

15.

Zhang, Xuefeng, et al.. (2006). Electromigration Lifetime Statistics for Pb-Free Solder Joints with Cu and Ni UBM in Plastic Flip-Chip Packages. 650–656. 17 indexed citations

16.

Ding, Min, et al.. (2006). A Study on Lead Free SnAgCu Solder System. 450–455. 2 indexed citations

17.

Ding, Min, et al.. (2005). A study of electromigration failure in PB-free solder joints. 21. 518–523. 17 indexed citations

18.

Su, Peng, et al.. (2005). Effects of reflow on the microstructure and whisker growth propensity of Sn finish. 2. 434–440. 16 indexed citations

19.

Ho, Paul S., et al.. (2004). Reliability issues for flip-chip packages. Microelectronics Reliability. 44(5). 719–737. 59 indexed citations

20.

Ding, Min, et al.. (2003). Wheatstone bridge method for electromigration study of solder balls in flip-chip packages. 442–446. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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