V. Kripesh

2.2k citations

104 papers · 1.7k indexed · h-index 23

Electrical and Electronic Engineering top 2%
- Electronic Packaging and Soldering Technologies 78
- 3D IC and TSV technologies 73
- Advanced MEMS and NEMS Technologies 9
- Electromagnetic Compatibility and Noise Suppression 7
Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies 8
Mechanical Engineering top 5%
Electronic, Optical and Magnetic Materials top 10%
- Copper Interconnects and Reliability 18
General Materials Science top 5%
Biomedical Engineering
- Nanofabrication and Lithography Techniques 8
- Advanced Surface Polishing Techniques 7

Co-authors: John H. Lau A.A.O. Tay Seung Wook Yoon Mohan Kumar Kesarla Navas Khan Soon Wee Ho D. Pinjala Xiaowu Zhang
Cited by: Electrical and Electronic Engineering Automotive Engineering Mechanical Engineering
Journals: IEEE Transactions on Components Packaging and Manufacturing Technology (9 papers)IEEE Transactions on Advanced Packaging (8 papers)IEEE Transactions on Components and Packaging Technologies (5 papers)
Partner nations: Singapore United States Taiwan

In The Last Decade

V. Kripesh

100 papers receiving 1.6k citations

Peers

Countries citing papers authored by V. Kripesh

Since Specialization

Citations

This map shows the geographic impact of V. Kripesh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Kripesh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Kripesh more than expected).

Fields of papers citing papers by V. Kripesh

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by V. Kripesh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Kripesh. The network helps show where V. Kripesh may publish in the future.

Co-authorship network

The 25 scholars most cited alongside V. Kripesh, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with V. Kripesh Line = papers co-authored together V. Kripesh links everyone, so they are left out of the graph.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

#	Work
1	3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections IEEE Transactions on Components Packaging and Manufacturing Technology ·Navas Khan,Li Yu,Parya Bustani Farkush,Soon Wee Ho,V. Kripesh,D. Pinjala,John H. Lau,Huang XD	2013	40
2	Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders Materials Science and Engineering A ·Lívia Aparecida de Almeida e Sousa,Mohan Kumar Kesarla,V. Kripesh,Kaiyang Zeng	2011	12
3	Sensorized guidewires with MEMS tri-axial force sensor for minimally invasive surgical applications PubMed ·Liang Lou,Mary Fredlund,Mauricio A. Alvarez,Woo‐Tae Park,Daquan Yu,A. V. Chikinev,A. Nieoullon,V. Kripesh,Hanhua Feng,義樹前嶋,Chengkuo Lee,Dim-Lee Kwong	2010	10
4	Process Development and Reliability of Microbumps IEEE Transactions on Components and Packaging Technologies ·ლელა გაჩეჩილაძე,Vempati Srinivasa Rao,東子邵,C. Poncet-Legr,V. Kripesh,Charles Lee,John H. Lau,Mirza Faisal Amri,Devakalyani. Moodley	2010	20
5	Thermal modeling and characterization of the embedded micro wafer level package (EMWLP) at the package- and system-level Brenda Mix,Gongyue Tang,Gaurav Sharma,繁飯田,Vempati Srinivasa Rao,Оксана Николаевна Дудина,Sharon Lim Pei Siang,Aditya Kumar,L. Kehret,Kelvin Fatt Kin Low,V. Kripesh	2009	5
6	Integration of High Aspect Ratio Tapered Silicon Via for Silicon Carrier Fabrication IEEE Transactions on Advanced Packaging ·N. Ranganathan,Jonny Wu,M. Dosoky Waleed,Andrew Linzey Colchester,T. Michałowski,V. Kripesh,N. Balasubramanian	2009	15
7	Fabrication of Silicon Carriers With TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages IEEE Transactions on Components and Packaging Technologies ·Aibin Yu,Navas Khan,Omar Tabacc,D. Pinjala,K.C. Toh,V. Kripesh,Seung Wook Yoon,John H. Lau	2009	35
8	Development of a 65nm Cu/low-k Stack Die FBGA Package for SiP Applications Xiaowu Zhang,C.S. Premachandran,Ambi Muhammad Dzuhri,Tassy,Vincent Lee,Shengyao Shi,V. Kripesh,John H. Lau,Ashley Eddy,Francesca Pavan,D. Pinjala,Charles Lee,Hiroka ARIGA	2008	1
9	Patterned micropads made of copper nanowires on silicon substrate for application as chip to substrate interconnects Nanotechnology ·Gaurav Sharma,Ellie Golestanian,Jonny Wu,V. Kripesh,Chee Lip Gan,Chorng Haur Sow	2007	6
10	Development of coaxial shield via in silicon carrier for high frequency application Soon Wee Ho,Chao Fang,Vivek Agwan,Seung Wook Yoon,V. Kripesh	2006	21
11	Through Wafer Copper Via for Silicon Based SiP Application Quản Minh Phương,R. Trisolini,Seung Wook Yoon,V. Kripesh,W. L. Chyi	2006	8
12	Fabrication of patterned and non-patterned metallic nanowire arrays on silicon substrate Thin Solid Films ·Gaurav Sharma,Ser Choong Chong,Jonny Wu,Hui Cai,Chee Lip Gan,V. Kripesh	2006	12
13	Shape matching-assisted self-assembly of microchips on a silicon substrate Zulkili Zulkifli,А. О. Дубровник-Рохова,유병구,E.B. Liao,V. Kripesh	2006	2
14	Numerical Simulation of Capillary and Fluid Dynamic Forces on Tiny Chips in Fluidic Self-Assembly Process National University of Singapore ·A.A.O. Tay,Hua Li,Xiangyang Gao,Jian Chen,V. Kripesh	2006	1
15	150 μm Pitch Pb-Free Flipchip Packaging with Cu/Low-k Interconnects Seung Wook Yoon,V. Kripesh,Heine Santiago Realpe Marín,Hong Yu Li,M.K. Iyer	2005	2
16	Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects E.B. Liao,A.A.O. Tay,Simon S. Ang,Cross Gf,R. Nagarajan,V. Kripesh	2005	0
17	Fractal analysis of intermetallic compounds in Sn–Ag, Sn–Ag–Bi, and Sn–Ag–Cu diffusion couples Materials Letters ·R. Jayaganthan,F. F. Paschenko,Vasarla Nagendra Sekhar,A.A.O. Tay,V. Kripesh	2005	8
18	Fiber misalignment in silicon V-groove based optical modules Optical Fiber Technology ·Anish Priyadarshi,Liu Fen,Subodh G. Mhaisalkar,V. Kripesh,Anand Asundi	2005	16
19	Cooling of a stacked multichip module - tests and validations M. Bertrand,K.C. Toh,John C. Chai,Teck Neng Wong,D. Pinjala,T. Michałowski,Наталія Василівна Кузін,Hengyun Zhang,V. Kripesh	2004	1
20	Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly Microelectronics Reliability ·С.С. Хасанов,V. Kripesh,Chong Ser Choong,Chai Tai Chong,Quan-fa Tan	2002	10

About V. Kripesh

V. Kripesh is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Automotive Engineering, Mechanical Engineering and Biomedical Engineering, having authored 104 papers that have together received 1.7k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (78 papers), 3D IC and TSV technologies (73 papers), Copper Interconnects and Reliability (18 papers), Advanced MEMS and NEMS Technologies (9 papers), Nanofabrication and Lithography Techniques (8 papers), Additive Manufacturing and 3D Printing Technologies (8 papers), Electromagnetic Compatibility and Noise Suppression (7 papers) and Advanced Surface Polishing Techniques (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.6k citations), Automotive Engineering (234 citations), Mechanical Engineering (388 citations), Electronic, Optical and Magnetic Materials (178 citations) and General Materials Science (21 citations). V. Kripesh has collaborated with scholars based in Singapore, United States and Taiwan. Frequent co-authors include John H. Lau, A.A.O. Tay, Seung Wook Yoon, Mohan Kumar Kesarla, Navas Khan, Soon Wee Ho, D. Pinjala, Xiaowu Zhang, Aditya Kumar and T.C. Chai. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Advanced Packaging, IEEE Transactions on Components and Packaging Technologies, Sensors and Actuators A Physical and Nanotechnology.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact