Rajiv Dunne
- Electrical and Electronic Engineering top 10%
- Hardware and Architecture top 5%
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials
- Computer Networks and Communications
- Co-authors
- B.J. RubinLewis M. TermanG.V. KopcsayA. DeutschC.W. SurovicTom GalloR.H. DennardDale Becker
- Topics
- 3D IC and TSV technologies (11 papers)Electronic Packaging and Soldering Technologies (5 papers)Electromagnetic Compatibility and Noise Suppression (4 papers)
- Cited by
- Hardware and ArchitectureElectrical and Electronic EngineeringElectronic, Optical and Magnetic Materials
- Journals
- IEEE Transactions on Microwave Theory and TechniquesJournal of materials research/Pratt's guide to venture capital sourcesIBM Journal of Research and Development
- Partner nations
- United States
In The Last Decade
Rajiv Dunne
11 papers receiving 538 citations
Peers
Comparison fields: 5 of 26
- Electrical and Electronic Engineering 563
- Hardware and Architecture 84
- Biomedical Engineering 48
- Electronic, Optical and Magnetic Materials 33
- Computer Networks and Communications 23
Countries citing papers authored by Rajiv Dunne
This map shows the geographic impact of Rajiv Dunne's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Rajiv Dunne with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Rajiv Dunne more than expected).
Fields of papers citing papers by Rajiv Dunne
This network shows the impact of papers produced by Rajiv Dunne. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Rajiv Dunne. The network helps show where Rajiv Dunne may publish in the future.
Co-authorship network of co-authors of Rajiv Dunne
This figure shows the co-authorship network connecting the top 25 collaborators of Rajiv Dunne. A scholar is included among the top collaborators of Rajiv Dunne based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Rajiv Dunne. Rajiv Dunne is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 22 | |
| 2 | 6 | |
| 3 | 23 | |
| 4 | 16 | |
| 5 | 9 | |
| 6 | 14 | |
| 7 | 3 | |
| 8 | 36 | |
| 9 | 24 | |
| 10 | 291 | |
| 11 | 131 |
About Rajiv Dunne
Rajiv Dunne is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Electronic, Optical and Magnetic Materials, having authored 11 papers that have together received 575 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (5 papers) and Electromagnetic Compatibility and Noise Suppression (4 papers). The work is most often cited by research in Hardware and Architecture (84 citations), Electrical and Electronic Engineering (563 citations) and Electronic, Optical and Magnetic Materials (33 citations). Rajiv Dunne has collaborated with scholars based in United States. Frequent co-authors include B.J. Rubin, Lewis M. Terman, G.V. Kopcsay, A. Deutsch, C.W. Surovic, Tom Gallo, R.H. Dennard, Dale Becker, D.R. Knebel and P. Coteus. Their work appears in journals such as IEEE Transactions on Microwave Theory and Techniques, Journal of materials research/Pratt's guide to venture capital sources and IBM Journal of Research and Development.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.