Rajiv Dunne

794 total citations
11 papers, 575 citations indexed

About

Rajiv Dunne is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Rajiv Dunne has authored 11 papers receiving a total of 575 indexed citations (citations by other indexed papers that have themselves been cited), including 11 papers in Electrical and Electronic Engineering, 2 papers in Electronic, Optical and Magnetic Materials and 1 paper in Atomic and Molecular Physics, and Optics. Recurrent topics in Rajiv Dunne's work include 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (5 papers) and Electromagnetic Compatibility and Noise Suppression (4 papers). Rajiv Dunne is often cited by papers focused on 3D IC and TSV technologies (11 papers), Electronic Packaging and Soldering Technologies (5 papers) and Electromagnetic Compatibility and Noise Suppression (4 papers). Rajiv Dunne collaborates with scholars based in United States. Rajiv Dunne's co-authors include Tom Gallo, A. Deutsch, G.V. Kopcsay, C.W. Surovic, Lewis M. Terman, B.J. Rubin, R.H. Dennard, D.R. Knebel, P. Coteus and G. Katopis and has published in prestigious journals such as IEEE Transactions on Microwave Theory and Techniques, Journal of materials research/Pratt's guide to venture capital sources and IBM Journal of Research and Development.

In The Last Decade

Rajiv Dunne

11 papers receiving 538 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Rajiv Dunne United States	9	563	84	48	33	23	11	575
Yidnekachew S. Mekonnen United States	6	303 0.5×	62 0.7×	30 0.6×	18 0.5×	30 1.3×	15	337
Jae-Kyung Wee South Korea	10	275 0.5×	43 0.5×	61 1.3×	12 0.4×	34 1.5×	47	320
Kiyeong Kim South Korea	12	620 1.1×	33 0.4×	28 0.6×	33 1.0×	39 1.7×	34	632
Mikhail Popovich United States	13	399 0.7×	54 0.6×	33 0.7×	19 0.6×	52 2.3×	27	417
Didier Lattard France	12	302 0.5×	151 1.8×	38 0.8×	29 0.9×	191 8.3×	49	395
Feng-Wei Kuo Taiwan	11	496 0.9×	21 0.3×	137 2.9×	19 0.6×	39 1.7×	27	534
Noah Sturcken United States	10	374 0.7×	33 0.4×	64 1.3×	34 1.0×	25 1.1×	20	427
Haigang Feng China	17	995 1.8×	24 0.3×	90 1.9×	25 0.8×	12 0.5×	93	1.0k
H. Shimamoto Japan	15	635 1.1×	55 0.7×	83 1.7×	10 0.3×	6 0.3×	82	674
Mark I. Montrose United States	8	392 0.7×	17 0.2×	16 0.3×	18 0.5×	10 0.4×	24	444

Countries citing papers authored by Rajiv Dunne

Since Specialization

Citations

This map shows the geographic impact of Rajiv Dunne's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Rajiv Dunne with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Rajiv Dunne more than expected).

Fields of papers citing papers by Rajiv Dunne

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Rajiv Dunne. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Rajiv Dunne. The network helps show where Rajiv Dunne may publish in the future.

Co-authorship network of co-authors of Rajiv Dunne

This figure shows the co-authorship network connecting the top 25 collaborators of Rajiv Dunne. A scholar is included among the top collaborators of Rajiv Dunne based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Rajiv Dunne. Rajiv Dunne is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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11 of 11 papers shown

Wang, Yiwei, Rajiv Dunne, Kazuaki Mawatari, et al.. (2012). Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect. 319–325. 22 indexed citations

Dunne, Rajiv, et al.. (2012). Development of a stacked WCSP package platform using TSV (Through Silicon Via) technology. 1062–1067. 23 indexed citations

Dunne, Rajiv, et al.. (2012). Over Molding Process Development for a Stacked Wafer-level Chip Scale Package with Through Silicon Vias (TSVs). 5(1). 122–131. 6 indexed citations

Kumbhat, Nitesh, P. Markondeya Raj, Rongwei Zhang, et al.. (2010). Low temperature, low profile, ultra-fine pitch copper-to-copper chip-last embedded-active interconnection technology. 350–356. 16 indexed citations

Xu, Yuhuan, et al.. (2008). Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester. Journal of materials research/Pratt's guide to venture capital sources. 23(5). 1482–1487. 9 indexed citations

Deutsch, A., G.V. Kopcsay, C.W. Surovic, et al.. (2002). Challenges raised by long on-chip wiring for CMOS microprocessor applications. 21–23. 3 indexed citations

Deutsch, A., Dale Becker, G. Katopis, et al.. (2002). Design guidelines for short, medium, and long on-chip interconnections. Electrical Performance of Electronic Packaging. 30–32. 14 indexed citations

Deutsch, A., G.V. Kopcsay, P.J. Restle, et al.. (2002). When are transmission-line effects important for on-chip interconnections. 704–712. 36 indexed citations

Deutsch, A., H. Smith, G. Katopis, et al.. (2002). The importance of inductance and inductive coupling for on-chip wiring. Electrical Performance of Electronic Packaging. 53–56. 24 indexed citations

10.

Deutsch, A., G.V. Kopcsay, P.J. Restle, et al.. (1997). When are transmission-line effects important for on-chip interconnections?. IEEE Transactions on Microwave Theory and Techniques. 45(10). 1836–1846. 291 indexed citations

11.

Deutsch, A., G.V. Kopcsay, C.W. Surovic, et al.. (1995). Modeling and characterization of long on-chip interconnections for high-performance microprocessors. IBM Journal of Research and Development. 39(5). 547–567. 131 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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