Cornelia Tsang

3.2k citations

51 papers · 2.4k indexed · 1 hit paper · h-index 26

Electrical and Electronic Engineering top 2%
- 3D IC and TSV technologies 43
- Electronic Packaging and Soldering Technologies 27
- Semiconductor Lasers and Optical Devices 9
- Semiconductor materials and devices 9
- Photonic and Optical Devices 7
Automotive Engineering top 2%
- Additive Manufacturing and 3D Printing Technologies 8
Hardware and Architecture top 5%
Electronic, Optical and Magnetic Materials
Biomedical Engineering top 10%
- Advanced Surface Polishing Techniques 5
Atomic and Molecular Physics, and Optics
- Semiconductor materials and interfaces 5

Co-authors: Paul Andry John Knickerbocker S. L. Wright R. Polastre E. Sprogis Bucknell C. Webb R. Horton B. Dang
Cited by: Electrical and Electronic Engineering Automotive Engineering Hardware and Architecture
Journals: IBM Journal of Research and Development (5 papers)IEEE Journal of Solid-State Circuits (2 papers)IEEE Electron Device Letters (1 paper)
Partner nations: United States Japan Switzerland

In The Last Decade

Cornelia Tsang

49 papers receiving 2.3k citations

Hit Papers

align trajectories log scale

Peers

Countries citing papers authored by Cornelia Tsang

Since Specialization

Citations

This map shows the geographic impact of Cornelia Tsang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cornelia Tsang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cornelia Tsang more than expected).

Fields of papers citing papers by Cornelia Tsang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Cornelia Tsang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cornelia Tsang. The network helps show where Cornelia Tsang may publish in the future.

Co-authorship network

The 25 scholars most cited alongside Cornelia Tsang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Cornelia Tsang Line = papers co-authored together Cornelia Tsang links everyone, so they are left out of the graph.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

#	Work
1	Factors in the selection of temporary wafer handlers for 3D/2.5D integration Bing Dang,Bucknell C. Webb,Cornelia Tsang,Paul Andry,John Knickerbocker	2014	10
2	High-density silicon carrier transmission line design for chip-to-chip interconnects Xiaoxiong Gu,Marco Raffaella Piccarreta,Bing Dang,Cornelia Tsang,Paul Andry,Timothy O. Dickson,Michael P. Beakes,John Knickerbocker,Daniel J. Friedman	2011	19
3	3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections Joana Maria,B. Dang,S. L. Wright,Cornelia Tsang,Paul Andry,R. Polastre,D Cerne,L. B. Wiggins,John Knickerbocker	2011	28
4	An 8×10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects Timothy O. Dickson,Yong Liu,S.V. Rylov,Bing Dang,Cornelia Tsang,Paul Andry,John F. Bulzacchelli,H. Ainspan,Xiaoxiong Gu,Marco Raffaella Piccarreta,Michael P. Beakes,Benjamin D. Parker,John Knickerbocker,Daniel J. Friedman	2011	11
5	IMC bonding for 3D interconnection Katsuyuki Sakuma,拓也坂本,Sayuri Kohara,K. Matsumoto,I.H. Kadi,Gareth Brookes,D. Dion,Britt Elliot,Paul Andry,Cornelia Tsang,John Knickerbocker,Yasumitsu Orii	2010	53
6	CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration Bing Dang,Paul Andry,Cornelia Tsang,Joana Maria,R. Polastre,Robert Trzcinski,孙秉云,John Knickerbocker	2010	36
7	3D chip stack with integrated decoupling capacitors Bing Dang,S. L. Wright,Paul Andry,E. Sprogis,Rials Timothy,Cornelia Tsang,R. Polastre,John Knickerbocker	2009	11
8	Reliable through silicon vias for 3D silicon applications Lucile Humbert,M. J. Interrante,Paul Andry,B. Dang,Cornelia Tsang,R. W. Liptak,正敏勅使河原,E. Sprogis,Xian Shi Jin,Viet Giang Truong,Siedmy Chyril Lengkong,John Knickerbocker	2009	8
9	300-Gb/s, 24-Channel Full-Duplex, 850-nm, CMOS-Based Optical Transceivers Clint L. Schow,Fuad E. Doany,Cornelia Tsang,Morgane Chalopin,Daniel M. Kuchta,Chirag Patel,R. Horton,John Knickerbocker,J. A. Kash	2008	16
10	3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections IBM Journal of Research and Development ·Katsuyuki Sakuma,Paul Andry,Cornelia Tsang,S. L. Wright,B. Dang,C.S. Patel,Bucknell C. Webb,Joana Maria,E. Sprogis,S. K. Kang,R. Polastre,R. Horton,John Knickerbocker	2008	126
11	300-Gb/s 24-channel bidirectional Si carrier transceiver Optochip for board-level interconnects Fuad E. Doany,Clint L. Schow,Cornelia Tsang,Sondes Chemli,R. Horton,Daniel M. Kuchta,C.S. Patel,John Knickerbocker,Jeffrey A. Kash	2008	27
12	Die-to-Wafer 3D Integration Technology for High Yield and Throughput Katsuyuki Sakuma,Paul Andry,Cornelia Tsang,D. Dion,C.S. Patel,拓也坂本,E. Sprogis,John Knickerbocker	2008	4
13	50μm pitch Pb-free micro-bumps by C4NP technology Bing Dang,Da‐Yuan Shih,Stephen L. Buchwalter,Cornelia Tsang,Chirag Patel,John Knickerbocker,Lucas Perbet,Sarah H. Knickerbocker,مهدخت حبیبی,Krystyna W. Semkow,公江斎藤,杨玉昌	2008	17
14	3D silicon integration John Knickerbocker,Paul Andry,B. Dang,R. Horton,C.S. Patel,R. Polastre,Katsuyuki Sakuma,長濱智生,Cornelia Tsang,Bucknell C. Webb,S. L. Wright	2008	183
15	3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections Katsuyuki Sakuma,Paul Andry,B. Dang,Joana Maria,Cornelia Tsang,Chirag Patel,S. L. Wright,Bucknell C. Webb,E. Sprogis,S. K. Kang,R. Polastre,R. Horton,John Knickerbocker	2007	70
16	Characterization of Micro-Bump C4 Interconnects for Si-Carrier SOP Applications S. L. Wright,R. Polastre,H. Gan,L.P. Buchwalter,R. Horton,Paul Andry,E. Sprogis,Chirag Patel,Cornelia Tsang,John Knickerbocker,J. R. Lloyd,A. Sharma,Doanh C. Bui	2006	73
17	Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology John Knickerbocker,C.S. Patel,Paul Andry,Cornelia Tsang,L.P. Buchwalter,E. Sprogis,Ishankulova Farangis,R. Horton,R. Polastre,S. L. Wright,Christian Schuster,Christian Baks,Fuad E. Doany,J. Rosner,EIKICHI ITOUJI	2006	15
18	3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias IEEE Journal of Solid-State Circuits ·John Knickerbocker,C.S. Patel,Paul Andry,Cornelia Tsang,L.P. Buchwalter,E. Sprogis,H. Gan,R. Horton,R. Polastre,S. L. Wright,J. Cotte	2006	151
19	Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection IBM Journal of Research and Development ·John Knickerbocker,Paul Andry,L.P. Buchwalter,A. Deutsch,R. Horton,K.A. Jenkins,Young Kwark,Gerard McVicker,C.S. Patel,R. Polastre,Christian Schuster,A. Sharma,Sri M. Sri-Jayantha,C.W. Surovic,Cornelia Tsang,Bucknell C. Webb,S. L. Wright,M. Kortecka,E. Sprogis,B. Dang	2005	199
20	Silicon Carrier with Deep Through-Vias, Fine Pitch Wiring and Through Cavity for Parallel Optical Transceiver C.S. Patel,Cornelia Tsang,Christian Stefano Schuster,Fuad E. Doany,Xianhong Lin,Christian Baks,R. Budd,L.P. Buchwalter,Paul Andry,D. Canaperi,D. Edelstein,R. Horton,John Knickerbocker,Семенникова Нина Владимировна,Young Kwark,Oketani Yuto,J. H. Magerlein,J. Rosner,E. Sprogis	2005	29

About Cornelia Tsang

Cornelia Tsang is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Atomic and Molecular Physics, and Optics, having authored 51 papers that have together received 2.4k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (43 papers), Electronic Packaging and Soldering Technologies (27 papers), Semiconductor Lasers and Optical Devices (9 papers), Semiconductor materials and devices (9 papers), Additive Manufacturing and 3D Printing Technologies (8 papers), Photonic and Optical Devices (7 papers), Semiconductor materials and interfaces (5 papers) and Advanced Surface Polishing Techniques (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (2.2k citations), Automotive Engineering (377 citations) and Hardware and Architecture (125 citations). Cornelia Tsang has collaborated with scholars based in United States, Japan and Switzerland. Frequent co-authors include Paul Andry, John Knickerbocker, S. L. Wright, R. Polastre, E. Sprogis, Bucknell C. Webb, R. Horton, B. Dang, C.S. Patel and Katsuyuki Sakuma. Their work appears in journals such as IBM Journal of Research and Development, IEEE Journal of Solid-State Circuits, IEEE Electron Device Letters, Journal of Lightwave Technology and Journal of Electronic Packaging.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact