Cornelia Tsang

3.2k total citations · 1 hit paper
51 papers, 2.4k citations indexed

About

Cornelia Tsang is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering. According to data from OpenAlex, Cornelia Tsang has authored 51 papers receiving a total of 2.4k indexed citations (citations by other indexed papers that have themselves been cited), including 49 papers in Electrical and Electronic Engineering, 8 papers in Automotive Engineering and 6 papers in Biomedical Engineering. Recurrent topics in Cornelia Tsang's work include 3D IC and TSV technologies (43 papers), Electronic Packaging and Soldering Technologies (27 papers) and Semiconductor Lasers and Optical Devices (9 papers). Cornelia Tsang is often cited by papers focused on 3D IC and TSV technologies (43 papers), Electronic Packaging and Soldering Technologies (27 papers) and Semiconductor Lasers and Optical Devices (9 papers). Cornelia Tsang collaborates with scholars based in United States, Japan and Switzerland. Cornelia Tsang's co-authors include Paul Andry, John Knickerbocker, S. L. Wright, R. Polastre, E. Sprogis, Bucknell C. Webb, R. Horton, B. Dang, C.S. Patel and Katsuyuki Sakuma and has published in prestigious journals such as IEEE Journal of Solid-State Circuits, Journal of Lightwave Technology and IEEE Electron Device Letters.

In The Last Decade

Cornelia Tsang

49 papers receiving 2.3k citations

Hit Papers

Three-dimensional silicon integration 2008 2026 2014 2020 2008 100 200 300
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Three-dimensional silicon integration
    2008 396 citations John Knickerbocker, Paul Andry et al. IBM Journal of Research and Development profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Cornelia Tsang United States 26 2.2k 377 360 196 167 51 2.4k
John Knickerbocker United States 26 2.4k 1.1× 392 1.0× 453 1.3× 267 1.4× 188 1.1× 89 2.7k
Paul Andry United States 28 2.4k 1.1× 405 1.1× 382 1.1× 149 0.8× 182 1.1× 64 2.6k
R. Polastre United States 21 1.8k 0.8× 286 0.8× 339 0.9× 493 2.5× 139 0.8× 42 2.2k
Bucknell C. Webb United States 22 1.7k 0.7× 262 0.7× 289 0.8× 146 0.7× 293 1.8× 52 1.9k
Katsuyuki Sakuma Japan 20 1.8k 0.8× 386 1.0× 383 1.1× 150 0.8× 103 0.6× 82 1.9k
B. Dang United States 17 1.4k 0.6× 250 0.7× 230 0.6× 125 0.6× 112 0.7× 29 1.5k
E. Sprogis United States 18 1.7k 0.7× 267 0.7× 246 0.7× 91 0.5× 153 0.9× 31 1.7k
R. Horton United States 17 1.5k 0.7× 225 0.6× 228 0.6× 97 0.5× 161 1.0× 31 1.6k
Michele Stucchi Belgium 22 2.3k 1.0× 195 0.5× 241 0.7× 66 0.3× 232 1.4× 132 2.4k
Anne Jourdain Belgium 24 1.4k 0.6× 179 0.5× 451 1.3× 75 0.4× 126 0.8× 114 1.5k

Countries citing papers authored by Cornelia Tsang

Since Specialization
Citations

This map shows the geographic impact of Cornelia Tsang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cornelia Tsang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cornelia Tsang more than expected).

Fields of papers citing papers by Cornelia Tsang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Cornelia Tsang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cornelia Tsang. The network helps show where Cornelia Tsang may publish in the future.

Co-authorship network of co-authors of Cornelia Tsang

This figure shows the co-authorship network connecting the top 25 collaborators of Cornelia Tsang. A scholar is included among the top collaborators of Cornelia Tsang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Cornelia Tsang. Cornelia Tsang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Dang, Bing, Bucknell C. Webb, Cornelia Tsang, Paul Andry, & John Knickerbocker. (2014). Factors in the selection of temporary wafer handlers for 3D/2.5D integration. 576–581. 10 indexed citations
2.
Gu, Xiaoxiong, Bing Dang, Cornelia Tsang, et al.. (2011). High-density silicon carrier transmission line design for chip-to-chip interconnects. 27–30. 19 indexed citations
3.
Maria, Joana, B. Dang, S. L. Wright, et al.. (2011). 3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections. 268–273. 28 indexed citations
4.
Dickson, Timothy O., Yong Liu, S.V. Rylov, et al.. (2011). An 8×10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects. 80–81. 11 indexed citations
5.
Sakuma, Katsuyuki, Sayuri Kohara, K. Matsumoto, et al.. (2010). IMC bonding for 3D interconnection. 864–871. 53 indexed citations
6.
Dang, Bing, Paul Andry, Cornelia Tsang, et al.. (2010). CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration. 1393–1398. 36 indexed citations
7.
Dang, Bing, S. L. Wright, Paul Andry, et al.. (2009). 3D chip stack with integrated decoupling capacitors. 1–5. 11 indexed citations
8.
Interrante, M. J., Paul Andry, B. Dang, et al.. (2009). Reliable through silicon vias for 3D silicon applications. 63–66. 8 indexed citations
9.
Schow, Clint L., Fuad E. Doany, Cornelia Tsang, et al.. (2008). 300-Gb/s, 24-Channel Full-Duplex, 850-nm, CMOS-Based Optical Transceivers. 1–3. 16 indexed citations
10.
Sakuma, Katsuyuki, Paul Andry, Cornelia Tsang, et al.. (2008). 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM Journal of Research and Development. 52(6). 611–622. 126 indexed citations
11.
Doany, Fuad E., Clint L. Schow, Cornelia Tsang, et al.. (2008). 300-Gb/s 24-channel bidirectional Si carrier transceiver Optochip for board-level interconnects. 238–243. 27 indexed citations
12.
Sakuma, Katsuyuki, Paul Andry, Cornelia Tsang, et al.. (2008). Die-to-Wafer 3D Integration Technology for High Yield and Throughput. 4 indexed citations
13.
Dang, Bing, Da‐Yuan Shih, Stephen L. Buchwalter, et al.. (2008). 50μm pitch Pb-free micro-bumps by C4NP technology. 1505–1510. 17 indexed citations
14.
Knickerbocker, John, Paul Andry, B. Dang, et al.. (2008). 3D silicon integration. 538–543. 183 indexed citations
15.
Sakuma, Katsuyuki, Paul Andry, B. Dang, et al.. (2007). 3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections. 627–632. 70 indexed citations
16.
Wright, S. L., R. Polastre, H. Gan, et al.. (2006). Characterization of Micro-Bump C4 Interconnects for Si-Carrier SOP Applications. 633–640. 73 indexed citations
17.
Knickerbocker, John, C.S. Patel, Paul Andry, et al.. (2006). Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. 43. 654–657. 15 indexed citations
18.
Knickerbocker, John, C.S. Patel, Paul Andry, et al.. (2006). 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. IEEE Journal of Solid-State Circuits. 41(8). 1718–1725. 151 indexed citations
19.
Knickerbocker, John, Paul Andry, L.P. Buchwalter, et al.. (2005). Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. IBM Journal of Research and Development. 49(4.5). 725–753. 199 indexed citations
20.
Patel, C.S., Cornelia Tsang, Christian Stefano Schuster, et al.. (2005). Silicon Carrier with Deep Through-Vias, Fine Pitch Wiring and Through Cavity for Parallel Optical Transceiver. 2. 1318–1324. 29 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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