Jae-Woong Nah
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Photonic and Optical Devices
- Semiconductor Lasers and Optical Devices
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- Copper Interconnects and Reliability
Papers in
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- 3D IC and TSV technologies 36
- Electronic Packaging and Soldering Technologies 34
- Photonic and Optical Devices 8
- Semiconductor Lasers and Optical Devices 7
- Semiconductor materials and devices 5
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- Advanced Welding Techniques Analysis 6
- Co-authors
- Jong-ook Suh (8 shared papers)K. N. Tu (8 shared papers)Kyung‐Wook Paik (9 shared papers)K. N. Tu (4 shared papers)Kyung W. Paik (3 shared papers)Fei Ren (5 shared papers)J.H.L. Pang (4 shared papers)Tymon Barwicz (11 shared papers)
- Journals
- Journal of Applied Physics (4 papers)IEEE Transactions on Electronics Packaging Manufacturing (2 papers)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (2 papers)IEEE Journal of Selected Topics in Quantum Electronics (1 paper)Optical Fiber Technology (1 paper)
- Partner nations
- United StatesSouth KoreaJapan
In The Last Decade
Jae-Woong Nah
60 papers receiving 1.2k citations
Peers
Comparison fields: 5 of 61
- Electrical and Electronic Engineering 1.1k
- Electronic, Optical and Magnetic Materials 314
- Mechanical Engineering 304
- General Materials Science 19
- Mechanics of Materials 143
Countries citing papers authored by Jae-Woong Nah
This map shows the geographic impact of Jae-Woong Nah's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jae-Woong Nah with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jae-Woong Nah more than expected).
Fields of papers citing papers by Jae-Woong Nah
This network shows the impact of papers produced by Jae-Woong Nah. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jae-Woong Nah. The network helps show where Jae-Woong Nah may publish in the future.
Co-authors
The 25 scholars most cited alongside Jae-Woong Nah, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 60 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 130 | |
| 2 | 2006 | 102 | |
| 3 | 2006 | 88 | |
| 4 | 2016 | 77 | |
| 5 | 2005 | 75 | |
| 6 | 2011 | 59 | |
| 7 | 2003 | 55 | |
| 8 | 2018 | 46 | |
| 9 | 2018 | 42 | |
| 10 | 1999 | 37 | |
| 11 | 2006 | 36 | |
| 12 | 2002 | 35 | |
| 13 | 2000 | 32 | |
| 14 | 2011 | 29 | |
| 15 | 2007 | 27 | |
| 16 | 2015 | 26 | |
| 17 | 2000 | 24 | |
| 18 | 2014 | 22 | |
| 19 | 1999 | 22 | |
| 20 | 2005 | 21 |
About Jae-Woong Nah
Jae-Woong Nah is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering and Mechanics of Materials, having authored 60 papers that have together received 1.3k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (36 papers), Electronic Packaging and Soldering Technologies (34 papers), Copper Interconnects and Reliability (16 papers), Photonic and Optical Devices (8 papers), Semiconductor Lasers and Optical Devices (7 papers), Advanced Welding Techniques Analysis (6 papers), Metal and Thin Film Mechanics (5 papers) and Semiconductor materials and devices (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.1k citations), Electronic, Optical and Magnetic Materials (314 citations), Mechanical Engineering (304 citations), General Materials Science (19 citations) and Mechanics of Materials (143 citations). Jae-Woong Nah has collaborated with scholars based in United States, South Korea and Japan. Frequent co-authors include Jong-ook Suh, K. N. Tu, Kyung‐Wook Paik, K. N. Tu, Kyung W. Paik, Fei Ren, J.H.L. Pang, Tymon Barwicz, Swetha Kamlapurkar and Yves Martin. Their work appears in journals such as Journal of Applied Physics, IEEE Transactions on Electronics Packaging Manufacturing, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films, IEEE Journal of Selected Topics in Quantum Electronics and Optical Fiber Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.