Jae-Woong Nah

1.4k total citations
58 papers, 1.2k citations indexed

About

Jae-Woong Nah is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Jae-Woong Nah has authored 58 papers receiving a total of 1.2k indexed citations (citations by other indexed papers that have themselves been cited), including 50 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 15 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Jae-Woong Nah's work include 3D IC and TSV technologies (35 papers), Electronic Packaging and Soldering Technologies (33 papers) and Copper Interconnects and Reliability (15 papers). Jae-Woong Nah is often cited by papers focused on 3D IC and TSV technologies (35 papers), Electronic Packaging and Soldering Technologies (33 papers) and Copper Interconnects and Reliability (15 papers). Jae-Woong Nah collaborates with scholars based in United States, South Korea and Japan. Jae-Woong Nah's co-authors include Jong-ook Suh, K. N. Tu, Kyung‐Wook Paik, K. N. Tu, Kyung W. Paik, Fei Ren, J.H.L. Pang, Yves Martin, Tymon Barwicz and Swetha Kamlapurkar and has published in prestigious journals such as ACS Nano, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

Jae-Woong Nah

58 papers receiving 1.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jae-Woong Nah United States 20 1.0k 290 284 143 137 58 1.2k
Byung‐Chul Woo South Korea 17 1.1k 1.1× 443 1.5× 367 1.3× 93 0.7× 53 0.4× 75 1.3k
Eugene J. Rymaszewski United States 14 1.3k 1.3× 158 0.5× 359 1.3× 376 2.6× 243 1.8× 32 1.7k
J. Nicolics Austria 16 538 0.5× 136 0.5× 176 0.6× 211 1.5× 79 0.6× 138 853
Toshiro Ono Japan 16 548 0.5× 135 0.5× 185 0.7× 216 1.5× 147 1.1× 96 977
Young‐Hee Han South Korea 22 819 0.8× 278 1.0× 169 0.6× 248 1.7× 88 0.6× 95 1.6k
Darvin Edwards United States 15 781 0.8× 101 0.3× 424 1.5× 91 0.6× 159 1.2× 35 991
M. Mayer Canada 21 1.2k 1.2× 130 0.4× 771 2.7× 196 1.4× 304 2.2× 110 1.5k
Hervé Morel France 18 1.5k 1.5× 105 0.4× 354 1.2× 220 1.5× 39 0.3× 126 1.7k
H. Walter Germany 21 970 1.0× 171 0.6× 393 1.4× 150 1.0× 262 1.9× 109 1.5k
Marc Christopher Wurz Germany 13 415 0.4× 115 0.4× 245 0.9× 109 0.8× 85 0.6× 111 717

Countries citing papers authored by Jae-Woong Nah

Since Specialization
Citations

This map shows the geographic impact of Jae-Woong Nah's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jae-Woong Nah with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jae-Woong Nah more than expected).

Fields of papers citing papers by Jae-Woong Nah

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jae-Woong Nah. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jae-Woong Nah. The network helps show where Jae-Woong Nah may publish in the future.

Co-authorship network of co-authors of Jae-Woong Nah

This figure shows the co-authorship network connecting the top 25 collaborators of Jae-Woong Nah. A scholar is included among the top collaborators of Jae-Woong Nah based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jae-Woong Nah. Jae-Woong Nah is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Colgan, E. G., Kai Schleupen, Jae-Woong Nah, et al.. (2023). Fabrication and Performance of 300-mm Wafer-Scale Silicon Microchannel Cooler. IEEE Transactions on Components Packaging and Manufacturing Technology. 13(4). 472–480. 3 indexed citations
2.
Chen, Qianwen, E. G. Colgan, Bing Dang, et al.. (2018). High-Speed Precision Handling Technology of Micro-Chip for Fan-Out Wafer Level Packaging (FOWLP) Application. 1981–1986. 1 indexed citations
3.
4.
Barwicz, Tymon, Yoichi Taira, Yves Martin, et al.. (2018). Breaking the mold of photonic packaging. 25–25. 2 indexed citations
5.
Barwicz, Tymon, Yoichi Taira, Nicolas Boyer, et al.. (2016). A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities. IEEE Journal of Selected Topics in Quantum Electronics. 22(6). 455–466. 71 indexed citations
6.
Martin, Yves, Jae-Woong Nah, Swetha Kamlapurkar, Sebastian Engelmann, & Tymon Barwicz. (2016). Toward High-Yield 3D Self-Alignment of Flip-Chip Assemblies via Solder Surface Tension. 588–594. 17 indexed citations
7.
Barwicz, Tymon, Yoichi Taira, Nicolas Boyer, et al.. (2015). Enabling large-scale deployment of photonics through cost-efficient and scalable packaging. 155–156. 10 indexed citations
8.
Barwicz, Tymon, Yoichi Taira, Nicolas Boyer, et al.. (2015). Photonic Packaging in High-Throughput Microelectronic Assembly Lines for Cost-Efficiency and Scalability. Optical Fiber Communication Conference. W3H.4–W3H.4. 8 indexed citations
9.
Nah, Jae-Woong, Jeffrey D. Gelorme, Paul Lauro, et al.. (2014). Wafer IMS (Injection molded solder) — A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility. 1308–1313. 21 indexed citations
10.
Nah, Jae-Woong, Michael Gaynes, E Perfecto, & Claudius Feger. (2012). Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates. 1233–1238. 9 indexed citations
11.
12.
Nah, Jae-Woong, et al.. (2006). Electromigration in Pb-free flip chip solder joints on flexible substrates. Journal of Applied Physics. 99(2). 35 indexed citations
13.
Nah, Jae-Woong, Jong-ook Suh, K. N. Tu, et al.. (2006). Electromigration in Pb-Free Solder Bumps with Cu Column as Flip-Chip Joints. 657–662. 5 indexed citations
14.
Nah, Jae-Woong, Jong-ook Suh, & K. N. Tu. (2005). Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature. Journal of Applied Physics. 98(1). 68 indexed citations
15.
Son, Hwa–Young, Jae-Woong Nah, & Kyung‐Wook Paik. (2005). Formation of Pb/63Sn solder bumps using a solder droplet jetting method. IEEE Transactions on Electronics Packaging Manufacturing. 28(3). 274–281. 21 indexed citations
16.
Kim, Dong‐Won, et al.. (2004). Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages. Materials Science and Engineering A. 380(1-2). 231–236. 10 indexed citations
17.
Nah, Jae-Woong, et al.. (2004). Flip chip assembly on PCB substrates with coined solder bumps. 8. 244–249. 3 indexed citations
18.
Nah, Jae-Woong, et al.. (2003). Characterization of coined solder bumps on PCB pads. 154–160. 2 indexed citations
19.
Nah, Jae-Woong, et al.. (2003). A study on coining processes of solder bumps on organic substrates. IEEE Transactions on Electronics Packaging Manufacturing. 26(2). 166–172. 5 indexed citations
20.
Nah, Jae-Woong, et al.. (2000). Development of a complex heat resistant hard coating based on (Ta,Si)N by reactive sputtering. Materials Chemistry and Physics. 62(2). 115–121. 24 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Byung‐Chul Woo Breakdown of academic impact, for papers by Eugene J. Rymaszewski Breakdown of academic impact, for papers by J. Nicolics Breakdown of academic impact, for papers by Toshiro Ono Breakdown of academic impact, for papers by Young‐Hee Han Breakdown of academic impact, for papers by Darvin Edwards Breakdown of academic impact, for papers by M. Mayer Breakdown of academic impact, for papers by Hervé Morel Breakdown of academic impact, for papers by H. Walter Breakdown of academic impact, for papers by Marc Christopher Wurz
Rankless by CCL
2026