Chih Chen

8.2k total citations
312 papers, 6.5k citations indexed

About

Chih Chen is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering. According to data from OpenAlex, Chih Chen has authored 312 papers receiving a total of 6.5k indexed citations (citations by other indexed papers that have themselves been cited), including 266 papers in Electrical and Electronic Engineering, 144 papers in Electronic, Optical and Magnetic Materials and 82 papers in Mechanical Engineering. Recurrent topics in Chih Chen's work include Electronic Packaging and Soldering Technologies (208 papers), 3D IC and TSV technologies (172 papers) and Copper Interconnects and Reliability (137 papers). Chih Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (208 papers), 3D IC and TSV technologies (172 papers) and Copper Interconnects and Reliability (137 papers). Chih Chen collaborates with scholars based in Taiwan, United States and Hong Kong. Chih Chen's co-authors include K. N. Tu, K. N. Tu, Chien-Min Liu, Hsiang‐Yao Hsiao, Yi-Sa Huang, Dinh-Phuc Tran, Han-wen Lin, T. L. Shao, Chia-Ling Lu and C. Y. Liu and has published in prestigious journals such as Science, Journal of the American Chemical Society and ACS Nano.

In The Last Decade

Chih Chen

297 papers receiving 6.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chih Chen Taiwan 45 5.4k 2.5k 2.1k 1.4k 600 312 6.5k
Yanhong Tian China 39 3.4k 0.6× 638 0.3× 1.8k 0.9× 795 0.6× 291 0.5× 277 4.6k
Jiecai Han China 42 2.4k 0.4× 1.8k 0.7× 939 0.5× 1.7k 1.2× 329 0.5× 129 5.4k
Shen J. Dillon United States 37 1.9k 0.4× 858 0.3× 2.0k 1.0× 3.0k 2.1× 478 0.8× 137 5.9k
Shijo Nagao Japan 43 3.5k 0.7× 617 0.2× 1.5k 0.7× 1.2k 0.9× 516 0.9× 191 5.0k
Jun Tan China 30 1.6k 0.3× 1.3k 0.5× 737 0.4× 2.1k 1.5× 392 0.7× 55 4.0k
Hongjie Wang China 35 1.0k 0.2× 1.4k 0.6× 1.4k 0.7× 2.1k 1.5× 246 0.4× 178 5.0k
Kyle Jiang United Kingdom 31 1.3k 0.2× 547 0.2× 1.1k 0.5× 1.1k 0.8× 319 0.5× 161 3.4k
Oliver Kraft Germany 42 1.6k 0.3× 1.1k 0.4× 2.3k 1.1× 2.7k 2.0× 2.5k 4.1× 147 5.9k
Xianghe Peng China 39 1.3k 0.2× 625 0.3× 2.2k 1.1× 2.9k 2.0× 1.9k 3.2× 333 5.5k
Norio Shinya Japan 25 1.8k 0.3× 1.9k 0.7× 704 0.3× 1.4k 1.0× 274 0.5× 134 3.7k

Countries citing papers authored by Chih Chen

Since Specialization
Citations

This map shows the geographic impact of Chih Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chih Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chih Chen more than expected).

Fields of papers citing papers by Chih Chen

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chih Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chih Chen. The network helps show where Chih Chen may publish in the future.

Co-authorship network of co-authors of Chih Chen

This figure shows the co-authorship network connecting the top 25 collaborators of Chih Chen. A scholar is included among the top collaborators of Chih Chen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chih Chen. Chih Chen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hung, Yu‐Wen, et al.. (2025). Impact of microstructure engineering on electromigration resistance of copper redistribution lines. Journal of Materials Research and Technology. 39. 3076–3086.
2.
Lin, Han-wen, et al.. (2025). To suppress tin whisker growth by using (100)-oriented copper. Journal of Materials Research and Technology. 35. 3217–3225. 1 indexed citations
3.
Yang, Shih‐Chi, Hao Su, K. N. Tu, & Chih Chen. (2025). Unraveling the effect of Sn crystallographic orientation on electromigration-induced intermetallic compounds formations in Cu/Ni/SnAg/Ni/Cu microbumps. Journal of Alloys and Compounds. 1021. 179631–179631. 3 indexed citations
4.
Tran, Dinh-Phuc, et al.. (2025). Fabrication and properties of high thermal stability nanocrystalline Cu for low temperature Cu–Cu bonding. Journal of Materials Research and Technology. 35. 7120–7129. 5 indexed citations
5.
Tran, Dinh-Phuc, et al.. (2024). Design of surface topography for fabricating nanotwinned copper/polyimide hybrid joints using in-situ heating atomic force microscopy. Applied Surface Science. 685. 162023–162023. 3 indexed citations
6.
Tran, Dinh-Phuc, et al.. (2024). Effect of heterogeneous microstructures on mechanical properties of thin gradient nanotwinned copper foils. Surface and Coatings Technology. 494. 131381–131381. 5 indexed citations
7.
Yang, Shih‐Chi, et al.. (2024). Effect of bonding interfacial microstructures on the properties and reliabilities of Cu–Cu joints. Journal of Materials Research and Technology. 32. 3490–3499. 6 indexed citations
8.
Chen, Kuan‐Ju, et al.. (2024). Enhanced cross-interfacial growth by thickening transition layers and tailoring grain size of columnar nanotwinned Cu films. Journal of Materials Research and Technology. 33. 2530–2537. 1 indexed citations
9.
Yang, Shih‐Chi, Yu-Tao Yang, & Chih Chen. (2024). Electromigration in Cu–Cu joints: Measurement of activation energy and polarity effect. Journal of Materials Research and Technology. 33. 4522–4532. 9 indexed citations
10.
Tran, Dinh-Phuc, et al.. (2024). Twin boundary and grain boundary engineering to enhance mechanical strength of nanotwinned Cu. Materials Science and Engineering A. 923. 147719–147719. 5 indexed citations
11.
Shie, Kai-Cheng, et al.. (2024). Chemical mechanical planarization of nanotwinned copper/polyimide for low temperature hybrid bonding. Journal of Electroanalytical Chemistry. 969. 118544–118544. 6 indexed citations
12.
13.
Tran, Dinh-Phuc, et al.. (2024). In-situ measurement of thermal expansion in Cu/SiO2 hybrid structures using atomic force microscopy at elevated temperatures. Applied Surface Science. 662. 160103–160103. 14 indexed citations
14.
Tran, Dinh-Phuc, et al.. (2024). Surface modification of nanotwinned copper and SiCN using N2 and Ar plasma activation. Applied Surface Science. 684. 161832–161832. 4 indexed citations
15.
Yao, Yifan, Andriy Gusak, Chih Chen, Yingxia Liu, & K. N. Tu. (2024). Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology. Scripta Materialia. 250. 116175–116175. 7 indexed citations
16.
Yuan, Chen, et al.. (2024). Surface Modification by Wet Treatment for Low-Temperature Cu/SiO2 Hybrid Bonding. 115–116. 2 indexed citations
17.
Chen, Chih, et al.. (2023). Transcriptomic profile of symbiotic accessory nidamental gland during female maturation in bigfin reef squid. Frontiers in Marine Science. 9. 2 indexed citations
18.
Tran, Dinh-Phuc, et al.. (2023). High toughness of nanotwinned copper lines after annealing. Materials Science and Engineering A. 887. 145749–145749. 2 indexed citations
19.
Tran, Dinh-Phuc, et al.. (2023). High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation. Nanomaterials. 13(9). 1575–1575. 10 indexed citations
20.
Shie, Kai-Cheng, et al.. (2021). Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling. Materials. 14(19). 5522–5522. 34 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Yanhong Tian Breakdown of academic impact, for papers by Jiecai Han Breakdown of academic impact, for papers by Shen J. Dillon Breakdown of academic impact, for papers by Shijo Nagao Breakdown of academic impact, for papers by Jun Tan Breakdown of academic impact, for papers by Hongjie Wang Breakdown of academic impact, for papers by Kyle Jiang Breakdown of academic impact, for papers by Oliver Kraft Breakdown of academic impact, for papers by Xianghe Peng Breakdown of academic impact, for papers by Norio Shinya
Rankless by CCL
2026