R. Dudek
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 5%
- Mechanics of Materials top 5%
- Aerospace Engineering top 10%
- Biomedical Engineering
- Topics
- Electronic Packaging and Soldering Technologies (112 papers)3D IC and TSV technologies (44 papers)Mechanical Behavior of Composites (19 papers)
- Journals
- Microelectronics ReliabilityMaterials Today ProceedingsIEEE Transactions on Components and Packaging Technologies
- Partner nations
- GermanyUnited KingdomPoland
In The Last Decade
R. Dudek
130 papers receiving 1.4k citations
Peers
Comparison fields: 5 of 54
- Electrical and Electronic Engineering 1.3k
- Mechanical Engineering 507
- Mechanics of Materials 421
- Aerospace Engineering 117
- Biomedical Engineering 105
Countries citing papers authored by R. Dudek
This map shows the geographic impact of R. Dudek's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R. Dudek with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R. Dudek more than expected).
Fields of papers citing papers by R. Dudek
This network shows the impact of papers produced by R. Dudek. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R. Dudek. The network helps show where R. Dudek may publish in the future.
Co-authorship network of co-authors of R. Dudek
This figure shows the co-authorship network connecting the top 25 collaborators of R. Dudek. A scholar is included among the top collaborators of R. Dudek based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with R. Dudek. R. Dudek is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 5 | |
| 3 | 4 | |
| 4 | 7 | |
| 5 | 10 | |
| 6 | 1 | |
| 7 | Evaluation of Ag-sinter and CuSn-TLP Based Joining Technologies on Lead Frame | 2 |
| 8 | 3 | |
| 9 | 2 | |
| 10 | 14 | |
| 11 | 2 | |
| 12 | 1 | |
| 13 | 3 | |
| 14 | 7 | |
| 15 | 5 | |
| 16 | 2 | |
| 17 | 36 | |
| 18 | 12 | |
| 19 | 16 | |
| 20 | 9 |
About R. Dudek
R. Dudek is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Mechanical Engineering, having authored 133 papers that have together received 1.5k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (112 papers), 3D IC and TSV technologies (44 papers) and Mechanical Behavior of Composites (19 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.3k citations), Mechanics of Materials (421 citations) and Mechanical Engineering (507 citations). R. Dudek has collaborated with scholars based in Germany, United Kingdom and Poland. Frequent co-authors include B. Michel, Andreas Schubert, H. Reichl, E. Auerswald, H. Walter, Bernd Michel, Sven Rzepka, D. Vogel, Bernhard Wunderle and P. Alpern. Their work appears in journals such as Microelectronics Reliability, Materials Today Proceedings and IEEE Transactions on Components and Packaging Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.