Jong-ook Suh

2.1k total citations · 1 hit paper
28 papers, 1.7k citations indexed

About

Jong-ook Suh is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Jong-ook Suh has authored 28 papers receiving a total of 1.7k indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 7 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Jong-ook Suh's work include Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (15 papers) and Copper Interconnects and Reliability (7 papers). Jong-ook Suh is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (15 papers) and Copper Interconnects and Reliability (7 papers). Jong-ook Suh collaborates with scholars based in United States, Singapore and Italy. Jong-ook Suh's co-authors include K. N. Tu, Douglas C. Hofmann, R. Peter Dillon, Zi‐Kui Liu, Richard Otis, Andrew A. Shapiro, John Paul Borgonia, Jae-Woong Nah, Nobumichi Tamura and Joanna A. Kolodziejska and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia.

In The Last Decade

Jong-ook Suh

27 papers receiving 1.6k citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Functionally graded material of 304L stainless steel and inconel 625 fabricated by directed energy deposition: Characterization and thermodynamic modeling

2016 486 citations Beth Carroll, Richard Otis et al. Acta Materialia profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Jong-ook Suh United States	14	1.2k	696	537	233	233	28	1.7k
Jijin Xu China	22	1.2k 1.0×	219 0.3×	182 0.3×	86 0.4×	292 1.3×	76	1.4k
Guolin Wang China	14	520 0.4×	322 0.5×	227 0.4×	103 0.4×	488 2.1×	31	1.1k
Martin Corfield United Kingdom	13	467 0.4×	334 0.5×	241 0.4×	72 0.3×	74 0.3×	35	783
Donald Francis Susan United States	16	514 0.4×	245 0.4×	148 0.3×	55 0.2×	273 1.2×	49	800
Jun Luo China	24	386 0.3×	807 1.2×	661 1.2×	34 0.1×	126 0.5×	81	1.4k
Timo Bernthaler Germany	16	638 0.5×	268 0.4×	224 0.4×	104 0.4×	116 0.5×	67	934
Ki-Tae Kim South Korea	17	344 0.3×	1.1k 1.5×	207 0.4×	388 1.7×	295 1.3×	64	1.4k
Sirous Asgari Iran	21	1.2k 1.0×	310 0.4×	150 0.3×	62 0.3×	664 2.8×	41	1.5k
Vladimir Cherman Belgium	19	351 0.3×	820 1.2×	131 0.2×	78 0.3×	101 0.4×	107	1.1k
Douglas C. Hopkins United States	23	280 0.2×	1.5k 2.1×	292 0.5×	337 1.4×	104 0.4×	116	1.6k

Countries citing papers authored by Jong-ook Suh

Since Specialization

Citations

This map shows the geographic impact of Jong-ook Suh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jong-ook Suh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jong-ook Suh more than expected).

Fields of papers citing papers by Jong-ook Suh

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jong-ook Suh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jong-ook Suh. The network helps show where Jong-ook Suh may publish in the future.

Co-authorship network of co-authors of Jong-ook Suh

This figure shows the co-authorship network connecting the top 25 collaborators of Jong-ook Suh. A scholar is included among the top collaborators of Jong-ook Suh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jong-ook Suh. Jong-ook Suh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Kim, Wousik, JR Dennison, B.D. Wood, et al.. (2022). Spacecraft Charging Test Considerations for Composite Materials. IEEE Transactions on Plasma Science. 51(9). 2447–2454. 3 indexed citations

Hofmann, Douglas C., Scott Roberts, R. Peter Dillon, et al.. (2016). Castable Bulk Metallic Glass Strain Wave Gears: Towards Decreasing the Cost of High-Performance Robotics. Scientific Reports. 6(1). 37773–37773. 58 indexed citations

Carroll, Beth, Richard Otis, John Paul Borgonia, et al.. (2016). Functionally graded material of 304L stainless steel and inconel 625 fabricated by directed energy deposition: Characterization and thermodynamic modeling. Acta Materialia. 108. 46–54. 486 indexed citations breakdown →

Hofmann, Douglas C., Joanna A. Kolodziejska, Scott Roberts, et al.. (2014). Compositionally graded metals: A new frontier of additive manufacturing. Journal of materials research/Pratt's guide to venture capital sources. 29(17). 1899–1910. 192 indexed citations

Hofmann, Douglas C., Scott Roberts, Richard Otis, et al.. (2014). Developing Gradient Metal Alloys through Radial Deposition Additive Manufacturing. Scientific Reports. 4(1). 5357–5357. 250 indexed citations

Shapiro, Andrew A., et al.. (2013). A study of solder alloy ductility for cryogenic applications. 82–88. 18 indexed citations

Suh, Jong-ook. (2013). Physics of Failure Analysis of Xilinx Flip Chip CCGA Packages: Effects of Mission Environments on Properties of LP2 Underfill and ATI Lid Adhesive Materials. NASA Technical Reports Server (NASA). 1 indexed citations

Suh, Jong-ook, et al.. (2012). Physics of Failure Analysis of Xilinx Flip Chip CCGA Packages.

Suh, Jong-ook, K. N. Tu, Albert T. Wu, & Nobumichi Tamura. (2011). Preferred orientation relationships with large misfit interfaces between Ni3Sn4 and Ni in reactive wetting of eutectic SnPb on Ni. Journal of Applied Physics. 109(12). 7 indexed citations

10.

Suh, Jong-ook, K. N. Tu, & Nobumichi Tamura. (2007). Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu. Applied Physics Letters. 91(5). 89 indexed citations

11.

Nah, Jae-Woong, Kai Chen, Jong-ook Suh, & K. N. Tu. (2007). Electromigration Study in Flip Chip Solder Joints. 1450–1455. 23 indexed citations

12.

Nah, Jae-Woong, Jong-ook Suh, K. N. Tu, et al.. (2006). Electromigration in Pb-Free Solder Bumps with Cu Column as Flip-Chip Joints. 657–662. 5 indexed citations

13.

Nah, Jae-Woong, Jong-ook Suh, K. N. Tu, et al.. (2006). Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect. Journal of Applied Physics. 100(12). 83 indexed citations

14.

Nah, Jae-Woong, Jong-ook Suh, & K. N. Tu. (2005). Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature. Journal of Applied Physics. 98(1). 68 indexed citations

15.

Suh, Jong-ook, et al.. (2005). Mechanism and Prevention of Spontaneous Tin Whisker Growth. MATERIALS TRANSACTIONS. 46(11). 2300–2308. 35 indexed citations

16.

Yan, Minyu, et al.. (2005). The effect of intermetallic bonding on blocking electromigration induced interfacial diffusion in cu dual damascene interconnects. 462 463. 153–155. 1 indexed citations

17.

Suh, Jong-ook, K. N. Tu, & Andriy Gusak. (2005). Morphology Change, Size Distribution, and Nano-sized Channels in Cu₆Sn₅ Intermetallic Compound Formation at the SnPb Solder and Copper Interface. MRS Proceedings. 863. 2 indexed citations

18.

Nah, Jae-Woong, Jong-ook Suh, Kyung‐Wook Paik, & K. N. Tu. (2005). Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature. 27. 50–53. 3 indexed citations

19.

Yan, Minyu, Jong-ook Suh, Fei Ren, et al.. (2005). Effect of Cu3Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects. Applied Physics Letters. 87(21). 22 indexed citations

20.

Nah, Jae-Woong, Kyung W. Paik, Jong-ook Suh, & K. N. Tu. (2003). Mechanism of electromigration-induced failure in the 97Pb–3Sn and 37Pb–63Sn composite solder joints. Journal of Applied Physics. 94(12). 7560–7566. 125 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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