H. Walter

1.9k citations

109 papers · 1.5k indexed · h-index 21

Condensed Matter Physics top 5%
- Physics of Superconductivity and Magnetism 19
Electrical and Electronic Engineering top 5%
- Electronic Packaging and Soldering Technologies 54
- 3D IC and TSV technologies 27
Mechanics of Materials top 5%
- Mechanical Behavior of Composites 17
Mechanical Engineering top 5%
- Epoxy Resin Curing Processes 11
Electronic, Optical and Magnetic Materials
Biomedical Engineering
- Superconducting Materials and Applications 11
- Advanced Sensor and Energy Harvesting Materials 8
Atomic and Molecular Physics, and Optics
- Magnetic properties of thin films 7

Co-authors: B. Michel J. Böck R. Dudek H.C. Freyhardt A. Leenders Andreas Schubert Bernhard Wunderle F. Breuer
Cited by: Condensed Matter Physics Electrical and Electronic Engineering Mechanics of Materials
Journals: Physica C Superconductivity (7 papers)IEEE Transactions on Applied Superconductivity (6 papers)Superconductor Science and Technology (5 papers)
Partner nations: Germany United Kingdom Austria

In The Last Decade

H. Walter

106 papers receiving 1.4k citations

Peers

Countries citing papers authored by H. Walter

Since Specialization

Citations

This map shows the geographic impact of H. Walter's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Walter with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Walter more than expected).

Fields of papers citing papers by H. Walter

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H. Walter. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Walter. The network helps show where H. Walter may publish in the future.

Co-authorship network

The 25 scholars most cited alongside H. Walter, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with H. Walter Line = papers co-authored together H. Walter links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Analysis of the Impact of Environmental Conditions on the Reliability in 5G PCB Assemblies Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·H. Walter,Olaf Wittler,Annie Mustika Putri,Low Zhao Xuan,Paul Willner,Martin Schneider‐Ramelow	2023	1
2	Mechanical properties of structured copper and printed silver hybrid stretchable electronic systems Flexible and Printed Electronics ·Marianne D. Borger,Hoitul Anam,Kryzhanovskiy,Michael P. Keating,Shin-ichiro Nagasaka,Aturo Bogajo,H. Walter,Thomas Löher,Jukka Vanhala	2023	2
3	Influence of humidity on reliability of plastic packages Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·Tanja Braun,J. Bauer,K.-F. Becker,O. Hölck,H. Walter,Annie Mustika Putri,R. Aschenbrenner,K.-D. Lang	2015	3
4	Thermo-mechanical simulation of sintered Ag die attach for high temperature applications Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ·Maria F.B. Sousa,Annie Mustika Putri,H. Walter,You Tong-shu,Matthias Hütter,Hermann Oppermann,Olaf Wittler,K.-D. Lang	2014	0
5	Development of process and design criteria for stress management in through silicon vias Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·O. Hölck,M. C. Nuss,Hongkuan Yang,Xiaohai Chen,R.A. Goldbohm,明針谷,Sharon McAvoy,H. Walter,M. J. Wolf,Olaf Wittler,K.-D. Lang	2014	12
6	In-situ - characterization of moisture induced swelling behaviour of microelectronic relevant polymers Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·H. Walter,J. Bauer,Tanja Braun,O. Hölck,Bernhard Wunderle,Olaf Wittler	2012	1
7	Experimental and numerical reinvestigation for lifetime-estimation of plated through holes in printed circuit boards Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·S. L. Seido,Fares Djama,H. Walter,Bernhard Wunderle,Mohamad Abo Ras,Fahrul Zaman,Olaf Wittler,Klaus‐Dieter Lang	2011	4
8	Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation Microsystem Technologies ·Bernhard Wunderle,Karl‐Friedrich Becker,Winfried Kluth,Olaf Wittler,Fares Djama,H. Walter,Martin Schneider‐Ramelow,Darius A. Spieth,N.E. Guernsey,B. Michel,H. Reichl	2009	37
9	Reliability modeling & test for flip-chip on flex substrates with Ag-filled anisotropic conductive adhesive Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Bernhard Wunderle,Christine Kallmayer,H. Walter,Tanja Braun,B. Michel,H. Reichl	2008	1
10	Structure property correlation of epoxy resins under the influence of moisture; and comparison of diffusion coefficient with MD-simulations Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Jing Rao,Bernhard Wunderle,J. Bauer,H. Walter,B. Michel	2008	15
11	Conceptual Design of a 110 kV Resistive Superconducting Fault Current Limiter Using MCP-BSCCO 2212 Bulk Material IEEE Transactions on Applied Superconductivity ·M. Noë,A. Kudymow,S. Fink,S. Elschner,F. Breuer,J. Böck,H. Walter,Leah Spokhow,Diop JPD,Claus Neumann,Pearce Rachel,陈其普,T. A. Aslanova,Ruifeng Sun,B. Ducret,Barbara Beblich	2007	18
12	Novel methods to characterize bulk RE-BCO superconductors Physica C Superconductivity ·S. Haindl,M. Eisterer,Nerida Taylor,H.W. Weber,H. Walter,L. Shlyk,G. Krabbes,N. Hari Babu,D A Cardwell	2005	12
13	Thermomechanical design for reliability of WLPs with compliant interconnects R. Dudek,H. Walter,Carisa Oksana Polischuk,B. Michel,Tyler Meyer,Yıldız Derya Birincioğlu,Mahdi Rezaee	2005	10
14	Thermal fatigue modelling for SnAgCu and SnPb solder joints Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·R. Dudek,H. Walter,Carisa Oksana Polischuk,B. Michel	2004	36
15	Development and successful testing of MCP BSCCO-2212 components for a 10 MVA resistive superconducting fault current limiter Superconductor Science and Technology ·J. Böck,F. Breuer,H. Walter,M. Noë,Z. Zhang,Leah Spokhow,Diop JPD,S. Elschner	2004	31
16	Studies on parameters for popcorn cracking Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·R. Dudek,H. Walter,B. Michel,P. Alpern,A.N. Nikolishin,R. Tilgner	2001	9
17	Large intergranular critical currents in joined YBCO monoliths Europhysics Letters (EPL) ·H. Walter,Ch. Jooss,F. Sandiumenge,Alejandro González,M.P. Delamare,A. Leenders,H.C. Freyhardt	2001	10
18	Batch production of high-quality-customized-shaped-monolithic HTSC Physica C Superconductivity ·M. Ullrich,H. Walter,A. Leenders,H.C. Freyhardt	1999	36
19	Low-Temperature Anomaly in the Penetration Depth ofYBa2Cu3O7Films: Evidence for Andreev Bound States at Surfaces Physical Review Letters ·H. Walter,W. Prusseit,R. Semerad,H. Kinder,W. Assmann,H. Huber,H. Burkhardt,D. Rainer,J. A. Sauls	1998	85
20	Measuring the waterbalance of a three-layer cover of a domestic waste landfill Engineering Geology ·H. Hötzl,M.O Al-Shafe'i,H. Walter,Stefan Wohnlich	1985	0

About H. Walter

H. Walter is a scholar working on Condensed Matter Physics, Mechanics of Materials and Electrical and Electronic Engineering, having authored 109 papers that have together received 1.5k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (54 papers), 3D IC and TSV technologies (27 papers), Physics of Superconductivity and Magnetism (19 papers), Mechanical Behavior of Composites (17 papers), Superconducting Materials and Applications (11 papers), Epoxy Resin Curing Processes (11 papers), Advanced Sensor and Energy Harvesting Materials (8 papers) and Magnetic properties of thin films (7 papers). The work is most often cited by research in Condensed Matter Physics (429 citations), Electrical and Electronic Engineering (970 citations) and Mechanics of Materials (262 citations). H. Walter has collaborated with scholars based in Germany, United Kingdom and Austria. Frequent co-authors include B. Michel, J. Böck, R. Dudek, H.C. Freyhardt, A. Leenders, Andreas Schubert, Bernhard Wunderle, F. Breuer, S. Elschner and Olaf Wittler. Their work appears in journals such as Physica C Superconductivity, IEEE Transactions on Applied Superconductivity, Superconductor Science and Technology, Microelectronics Reliability and Microsystem Technologies.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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