Yasumitsu Orii
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering
- Automotive Engineering top 10%
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials
- Co-authors
- Kazushige ToriyamaSayuri KoharaKatsuyuki SakumaHiroyuki MoriK. MatsumotoFumiaki YamadaIkuo ShohjiKeiji Matsumoto
- Topics
- 3D IC and TSV technologies (63 papers)Electronic Packaging and Soldering Technologies (58 papers)Additive Manufacturing and 3D Printing Technologies (21 papers)
- Partner nations
- JapanUnited StatesTaiwan
In The Last Decade
Yasumitsu Orii
68 papers receiving 585 citations
Peers
Comparison fields: 5 of 39
- Electrical and Electronic Engineering 566
- Mechanical Engineering 162
- Automotive Engineering 114
- Biomedical Engineering 69
- Electronic, Optical and Magnetic Materials 50
Countries citing papers authored by Yasumitsu Orii
This map shows the geographic impact of Yasumitsu Orii's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yasumitsu Orii with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yasumitsu Orii more than expected).
Fields of papers citing papers by Yasumitsu Orii
This network shows the impact of papers produced by Yasumitsu Orii. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yasumitsu Orii. The network helps show where Yasumitsu Orii may publish in the future.
Co-authorship network of co-authors of Yasumitsu Orii
This figure shows the co-authorship network connecting the top 25 collaborators of Yasumitsu Orii. A scholar is included among the top collaborators of Yasumitsu Orii based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yasumitsu Orii. Yasumitsu Orii is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 3 | |
| 3 | 21 | |
| 4 | 2 | |
| 5 | 2 | |
| 6 | Scaling challenges of packaging in the Era of Big Data | 0 |
| 7 | 1 | |
| 8 | 19 | |
| 9 | 2 | |
| 10 | 4 | |
| 11 | 3 | |
| 12 | 5 | |
| 13 | 4 | |
| 14 | 53 | |
| 15 | 22 | |
| 16 | 5 | |
| 17 | 3 | |
| 18 | 4 | |
| 19 | 5 | |
| 20 | 0 |
About Yasumitsu Orii
Yasumitsu Orii is a scholar working on Automotive Engineering, Electrical and Electronic Engineering and Hardware and Architecture, having authored 72 papers that have together received 622 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (63 papers), Electronic Packaging and Soldering Technologies (58 papers) and Additive Manufacturing and 3D Printing Technologies (21 papers). The work is most often cited by research in Electrical and Electronic Engineering (566 citations), Automotive Engineering (114 citations) and Mechanical Engineering (162 citations). Yasumitsu Orii has collaborated with scholars based in Japan, United States and Taiwan. Frequent co-authors include Kazushige Toriyama, Sayuri Kohara, Katsuyuki Sakuma, Hiroyuki Mori, K. Matsumoto, Fumiaki Yamada, Ikuo Shohji, Keiji Matsumoto, Keishi Okamoto and Hideo Mori. Their work appears in journals such as Acta Materialia, Journal of Micromechanics and Microengineering and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.