M. Mayer
Impact in
- Mechanical Engineering top 2%
- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
- Metal Forming Simulation Techniques
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Electronic Packaging and Soldering Technologies 91
- 3D IC and TSV technologies 59
- Integrated Circuits and Semiconductor Failure Analysis 13
- Electrostatic Discharge in Electronics 10
- Advanced MEMS and NEMS Technologies 8
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- Advanced Welding Techniques Analysis 26
- Co-authors
- Y. Zhou (50 shared papers)Chunqing Wang (6 shared papers)C.J. Hang (7 shared papers)Yanhong Tian (6 shared papers)I. Lum (8 shared papers)A. Shah (15 shared papers)J.T. Moon (12 shared papers)John Persic (21 shared papers)
- Journals
- Microelectronics Reliability (15 papers)Microelectronic Engineering (6 papers)Journal of Electronic Materials (5 papers)MATERIALS TRANSACTIONS (5 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (4 papers)
- Partner nations
- CanadaChinaSouth Korea
In The Last Decade
M. Mayer
105 papers receiving 1.4k citations
Peers
Comparison fields: 5 of 55
- Mechanical Engineering 775
- Electrical and Electronic Engineering 1.2k
- Mechanics of Materials 305
- Electronic, Optical and Magnetic Materials 130
- Ceramics and Composites 28
Countries citing papers authored by M. Mayer
This map shows the geographic impact of M. Mayer's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Mayer with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Mayer more than expected).
Fields of papers citing papers by M. Mayer
This network shows the impact of papers produced by M. Mayer. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Mayer. The network helps show where M. Mayer may publish in the future.
Co-authors
The 25 scholars most cited alongside M. Mayer, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 110 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 214 | |
| 2 | 2009 | 87 | |
| 3 | 2009 | 74 | |
| 4 | 2006 | 62 | |
| 5 | 2008 | 49 | |
| 6 | 2008 | 47 | |
| 7 | 2009 | 35 | |
| 8 | 1999 | 35 | |
| 9 | 2008 | 34 | |
| 10 | 2009 | 32 | |
| 11 | 2015 | 31 | |
| 12 | 2003 | 31 | |
| 13 | 2009 | 29 | |
| 14 | 2000 | 28 | |
| 15 | 2002 | 27 | |
| 16 | 2007 | 27 | |
| 17 | 2010 | 25 | |
| 18 | 2008 | 25 | |
| 19 | 2010 | 22 | |
| 20 | 2009 | 21 |
About M. Mayer
M. Mayer is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Biomedical Engineering and Electronic, Optical and Magnetic Materials, having authored 110 papers that have together received 1.5k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (91 papers), 3D IC and TSV technologies (59 papers), Advanced Welding Techniques Analysis (26 papers), Adhesion, Friction, and Surface Interactions (15 papers), Integrated Circuits and Semiconductor Failure Analysis (13 papers), Electrostatic Discharge in Electronics (10 papers), Advanced MEMS and NEMS Technologies (8 papers) and Copper Interconnects and Reliability (8 papers). The work is most often cited by research in Mechanical Engineering (775 citations), Electrical and Electronic Engineering (1.2k citations), Mechanics of Materials (305 citations), Electronic, Optical and Magnetic Materials (130 citations) and Ceramics and Composites (28 citations). M. Mayer has collaborated with scholars based in Canada, China and South Korea. Frequent co-authors include Y. Zhou, Chunqing Wang, C.J. Hang, Yanhong Tian, I. Lum, A. Shah, J.T. Moon, John Persic, Dong Du and Baohua Chang. Their work appears in journals such as Microelectronics Reliability, Microelectronic Engineering, Journal of Electronic Materials, MATERIALS TRANSACTIONS and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.