M. Mayer

1.9k total citations
110 papers, 1.5k citations indexed

About

M. Mayer is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, M. Mayer has authored 110 papers receiving a total of 1.5k indexed citations (citations by other indexed papers that have themselves been cited), including 99 papers in Electrical and Electronic Engineering, 41 papers in Mechanical Engineering and 22 papers in Mechanics of Materials. Recurrent topics in M. Mayer's work include Electronic Packaging and Soldering Technologies (91 papers), 3D IC and TSV technologies (59 papers) and Advanced Welding Techniques Analysis (26 papers). M. Mayer is often cited by papers focused on Electronic Packaging and Soldering Technologies (91 papers), 3D IC and TSV technologies (59 papers) and Advanced Welding Techniques Analysis (26 papers). M. Mayer collaborates with scholars based in Canada, China and South Korea. M. Mayer's co-authors include Y. Zhou, Chunqing Wang, C.J. Hang, Yanhong Tian, I. Lum, A. Shah, J.T. Moon, John Persic, Dong Du and Baohua Chang and has published in prestigious journals such as Journal of Applied Physics, RSC Advances and Journal of Physics D Applied Physics.

In The Last Decade

M. Mayer

105 papers receiving 1.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
M. Mayer Canada	21	1.2k	771	304	196	130	110	1.5k
H. Walter Germany	21	970 0.8×	393 0.5×	262 0.9×	150 0.8×	171 1.3×	109	1.5k
Darvin Edwards United States	15	781 0.7×	424 0.5×	159 0.5×	91 0.5×	101 0.8×	35	991
S. K. Kang United States	23	1.5k 1.2×	821 1.1×	119 0.4×	181 0.9×	111 0.9×	57	1.6k
Tz-Cheng Chiu Taiwan	13	907 0.8×	435 0.6×	316 1.0×	88 0.4×	229 1.8×	67	1.2k
M. Braunović Canada	16	464 0.4×	924 1.2×	533 1.8×	195 1.0×	87 0.7×	67	1.2k
Paul T. Vianco United States	23	2.1k 1.8×	1.6k 2.1×	262 0.9×	270 1.4×	177 1.4×	133	2.4k
Jae-Woong Nah United States	20	1.0k 0.9×	284 0.4×	137 0.5×	143 0.7×	290 2.2×	58	1.2k
Yi-Shao Lai Taiwan	18	555 0.5×	248 0.3×	224 0.7×	162 0.8×	211 1.6×	41	787
Mohammad Motalab Bangladesh	18	690 0.6×	492 0.6×	226 0.7×	410 2.1×	31 0.2×	71	1.1k

Countries citing papers authored by M. Mayer

Since Specialization

Citations

This map shows the geographic impact of M. Mayer's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Mayer with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Mayer more than expected).

Fields of papers citing papers by M. Mayer

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Mayer. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Mayer. The network helps show where M. Mayer may publish in the future.

Co-authorship network of co-authors of M. Mayer

This figure shows the co-authorship network connecting the top 25 collaborators of M. Mayer. A scholar is included among the top collaborators of M. Mayer based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. Mayer. M. Mayer is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Hook, Michael David, Sally V. Hunter, & M. Mayer. (2018). Deriving lifetime predictions for wire bonds at high temperatures. Microelectronics Reliability. 88-90. 1124–1129. 1 indexed citations

Mayer, M., et al.. (2016). The Electrical Reliability of Silver Wire Bonds under High Temperature Storage. 654–659. 4 indexed citations

Mayer, M.. (2016). Process Design of Fine Pitch Ball Bonding by Volume Conservation Modelling. 20. 2216–2221. 3 indexed citations

Jeurgens, Lars P. H., Jolanta Janczak‐Rusch, Y. Zhou, et al.. (2015). PREFACE. MATERIALS TRANSACTIONS. 56(7). 973–973. 1 indexed citations

Hook, Michael David, Di Xu, & M. Mayer. (2014). Electromigration testing of wire bonds. 1–6. 2 indexed citations

Xu, Di, et al.. (2014). More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode. Microelectronics Reliability. 55(1). 201–206. 16 indexed citations

Zhou, Y., Akio Hirose, M. Mayer, et al.. (2013). PREFACE. MATERIALS TRANSACTIONS. 54(6). 859–859. 1 indexed citations

Cimpoeşu, Nicanor, et al.. (2010). Effect of stress on damping capacity of a shape memory alloy CuZnAl. Journal of Optoelectronics and Advanced Materials. 12(2). 386–391. 12 indexed citations

Huang, Yan, A. Shah, M. Mayer, Y. Zhou, & John Persic. (2010). Effect of ultrasonic capillary dynamics on the mechanics of thermosonic ball bonding. IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control. 57(1). 241–252. 3 indexed citations

10.

Jun, Jiheon, et al.. (2010). A New Non-PRM Bumping Process by Electroplating on Si Die for Three Dimensional Packaging. MATERIALS TRANSACTIONS. 51(10). 1887–1892. 11 indexed citations

11.

Lum, I., C.J. Hang, M. Mayer, & Y. Zhou. (2009). In Situ Studies of the Effect of Ultrasound During Deformation on Residual Hardness of a Metal. Journal of Electronic Materials. 38(5). 647–654. 13 indexed citations

12.

Shah, A., et al.. (2009). Low-Stress Thermosonic Copper Ball Bonding. IEEE Transactions on Electronics Packaging Manufacturing. 32(3). 176–184. 35 indexed citations

13.

Mayer, M., et al.. (2008). Ultrasonic Bonding: Understanding How Process Parameters Determine the Strength of Au-Al Bonds. 5 indexed citations

14.

Lee, Jaesik, M. Mayer, Y. Zhou, & John Persic. (2008). Microelectronic Wire Bonding with Insulated Au Wire: Effects of Process Parameters on Insulation Removal and Crescent Bonding. MATERIALS TRANSACTIONS. 49(10). 2347–2353. 12 indexed citations

15.

Hang, C.J., Chunqing Wang, Yanhong Tian, M. Mayer, & Y. Zhou. (2008). Microstructural study of copper free air balls in thermosonic wire bonding. Microelectronic Engineering. 85(8). 1815–1819. 34 indexed citations

16.

Lee, Jaesik, et al.. (2005). Flip Chip Bump Formation of Sn–1.8Bi–0.8Cu–0.6In Solder by Stencil Printing. MATERIALS TRANSACTIONS. 46(11). 2359–2365. 1 indexed citations

17.

Mayer, M., et al.. (2004). Packaging test chip for flip-chip and wire bonding process characterization. 1. 440–443. 11 indexed citations

18.

Mayer, M., et al.. (2004). Ball bond process optimization using in situ ball shear force. 781–784. 1 indexed citations

19.

Mayer, M., et al.. (1998). In-situ Measurement of Stress and Temperature under Bonding Pads During Wire Bonding Using Integrated Microsensors. 8 indexed citations

20.

Mayer, M., et al.. (1977). A Unique Cotton Sliver Drafting System. Journal of Engineering for Industry. 99(1). 61–64.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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