Bing Dang
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Silicon Carbide Semiconductor Technologies
- Mechanical Engineering top 10%
- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
Papers in ⓘ
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- 3D IC and TSV technologies 28
- Electronic Packaging and Soldering Technologies 13
- Semiconductor materials and devices 9
- Semiconductor Lasers and Optical Devices 7
- Thin-Film Transistor Technologies 6
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- Heat Transfer and Optimization 10
- Heat Transfer and Boiling Studies 8
- Co-authors
- J.D. Meindl (11 shared papers)Muhannad S. Bakir (11 shared papers)Calvin King (4 shared papers)Deepak Sekar (4 shared papers)John Knickerbocker (19 shared papers)Cornelia Tsang (15 shared papers)Paul Andry (14 shared papers)Hiren Thacker (3 shared papers)
- Journals
- Atmosphere (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)IEEE Electron Device Letters (1 paper)IEEE Transactions on Advanced Packaging (1 paper)Journal of Meteorological Research (1 paper)
- Partner nations
- United StatesChinaGermany
In The Last Decade
Bing Dang
50 papers receiving 790 citations
Peers
Comparison fields: 5 of 62
- Electrical and Electronic Engineering 601
- Mechanical Engineering 271
- Hardware and Architecture 49
- Automotive Engineering 78
- Computational Mechanics 71
Countries citing papers authored by Bing Dang
This map shows the geographic impact of Bing Dang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bing Dang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bing Dang more than expected).
Fields of papers citing papers by Bing Dang
This network shows the impact of papers produced by Bing Dang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bing Dang. The network helps show where Bing Dang may publish in the future.
Co-authors
The 25 scholars most cited alongside Bing Dang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 54 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 101 | |
| 2 | 2008 | 95 | |
| 3 | 2008 | 78 | |
| 4 | 2012 | 52 | |
| 5 | 2008 | 48 | |
| 6 | 2010 | 36 | |
| 7 | 2002 | 34 | |
| 8 | 2005 | 29 | |
| 9 | 2016 | 28 | |
| 10 | 2015 | 27 | |
| 11 | 2015 | 21 | |
| 12 | 2011 | 19 | |
| 13 | 2007 | 17 | |
| 14 | 2008 | 17 | |
| 15 | 2016 | 17 | |
| 16 | 2010 | 17 | |
| 17 | 2015 | 14 | |
| 18 | 2013 | 12 | |
| 19 | 2008 | 12 | |
| 20 | 2020 | 12 |
About Bing Dang
Bing Dang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Atmospheric Science, Biomedical Engineering and Automotive Engineering, having authored 54 papers that have together received 831 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (28 papers), Electronic Packaging and Soldering Technologies (13 papers), Heat Transfer and Optimization (10 papers), Semiconductor materials and devices (9 papers), Heat Transfer and Boiling Studies (8 papers), Semiconductor Lasers and Optical Devices (7 papers), Thin-Film Transistor Technologies (6 papers) and Urban Heat Island Mitigation (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (601 citations), Mechanical Engineering (271 citations), Hardware and Architecture (49 citations), Automotive Engineering (78 citations) and Computational Mechanics (71 citations). Bing Dang has collaborated with scholars based in United States, China and Germany. Frequent co-authors include J.D. Meindl, Muhannad S. Bakir, Calvin King, Deepak Sekar, John Knickerbocker, Cornelia Tsang, Paul Andry, Hiren Thacker, R. Polastre and P. J. Amal Joseph. Their work appears in journals such as Atmosphere, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Electron Device Letters, IEEE Transactions on Advanced Packaging and Journal of Meteorological Research.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.