Bing Dang

1.1k total citations
54 papers, 831 citations indexed

About

Bing Dang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Atmospheric Science. According to data from OpenAlex, Bing Dang has authored 54 papers receiving a total of 831 indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 6 papers in Atmospheric Science. Recurrent topics in Bing Dang's work include 3D IC and TSV technologies (28 papers), Electronic Packaging and Soldering Technologies (13 papers) and Heat Transfer and Optimization (10 papers). Bing Dang is often cited by papers focused on 3D IC and TSV technologies (28 papers), Electronic Packaging and Soldering Technologies (13 papers) and Heat Transfer and Optimization (10 papers). Bing Dang collaborates with scholars based in United States, China and Germany. Bing Dang's co-authors include Muhannad S. Bakir, J.D. Meindl, Deepak Sekar, Calvin King, John Knickerbocker, Cornelia Tsang, Hiren Thacker, Paul Andry, R. Polastre and P. J. Amal Joseph and has published in prestigious journals such as SHILAP Revista de lepidopterología, IEEE Journal of Solid-State Circuits and IEEE Transactions on Electron Devices.

In The Last Decade

Bing Dang

50 papers receiving 790 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Bing Dang United States 16 601 271 120 78 71 54 831
Libo Qian China 17 649 1.1× 337 1.2× 236 2.0× 40 0.5× 39 0.5× 101 863
Dao-Long Chen Taiwan 11 249 0.4× 72 0.3× 87 0.7× 14 0.2× 16 0.2× 53 490
J. Willemin France 12 421 0.7× 442 1.6× 333 2.8× 16 0.2× 42 0.6× 24 643
Jian Luo China 13 168 0.3× 76 0.3× 240 2.0× 28 0.4× 74 1.0× 80 547
Kyungjun Lee South Korea 14 137 0.2× 172 0.6× 117 1.0× 63 0.8× 64 0.9× 50 575
Jichun Zhang China 14 213 0.4× 102 0.4× 142 1.2× 11 0.1× 9 0.1× 43 682
Wensheng Wang China 13 423 0.7× 33 0.1× 56 0.5× 19 0.2× 61 0.9× 72 610

Countries citing papers authored by Bing Dang

Since Specialization
Citations

This map shows the geographic impact of Bing Dang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bing Dang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bing Dang more than expected).

Fields of papers citing papers by Bing Dang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Bing Dang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bing Dang. The network helps show where Bing Dang may publish in the future.

Co-authorship network of co-authors of Bing Dang

This figure shows the co-authorship network connecting the top 25 collaborators of Bing Dang. A scholar is included among the top collaborators of Bing Dang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Bing Dang. Bing Dang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Siu, Vince S., Minhua Lu, Kuan Yu Hsieh, et al.. (2024). Development of a Quantitative Digital Urinalysis Tool for Detection of Nitrite, Protein, Creatinine, and pH. Biosensors. 14(2). 70–70. 5 indexed citations
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Ouyang, Yuhui, et al.. (2023). Pollen grading prediction scale for patients with Artemisia pollen allergy in China: A 3‐day moving predictive model. Clinical and Translational Allergy. 13(7). e12280–e12280. 3 indexed citations
6.
Li, Qifeng, Bing Dang, Dandan Li, & Xiaoying Hu. (2023). Strength Deterioration of Earthen Sites Loess Solidified by Calcined Ginger Nuts under Dry–Wet and Freeze–Thaw Cycles. Atmosphere. 14(5). 868–868. 5 indexed citations
7.
Dang, Bing, et al.. (2022). Assessment of Urban Climate Environment and Configuration of Ventilation Corridor: A Refined Study in Xi’an. Journal of Meteorological Research. 36(6). 914–930. 8 indexed citations
8.
Li, Qifeng, Bing Dang, Chuipeng Kong, et al.. (2021). Research on properties of solidified loess with calcined ginger nuts in rammed earth for sapping area of earthen sites. SHILAP Revista de lepidopterología. 269. 1005–1005. 1 indexed citations
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Dang, Bing, et al.. (2021). Development of a Smart Sleep Mask with Multiple Sensors. 2021 43rd Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC). 2021. 7058–7062. 6 indexed citations
10.
Li, Ang, Thomas Wagner, Yang Wang, et al.. (2020). The quantification of NO x and SO 2 point source emission flux errors of mobile differential optical absorption spectroscopy on the basis of the Gaussian dispersion model: a simulation study. Atmospheric measurement techniques. 13(11). 6025–6051. 2 indexed citations
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Chen, Qianwen, E. G. Colgan, Bing Dang, et al.. (2018). High-Speed Precision Handling Technology of Micro-Chip for Fan-Out Wafer Level Packaging (FOWLP) Application. 1981–1986. 1 indexed citations
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Parida, Pritish R., Arvind Sridhar, Mark Schultz, et al.. (2017). Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices. 130–138. 10 indexed citations
14.
Dang, Bing, Bucknell C. Webb, Cornelia Tsang, Paul Andry, & John Knickerbocker. (2014). Factors in the selection of temporary wafer handlers for 3D/2.5D integration. 576–581. 10 indexed citations
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Gu, Xiaoxiong, Bing Dang, Cornelia Tsang, et al.. (2011). High-density silicon carrier transmission line design for chip-to-chip interconnects. 27–30. 19 indexed citations
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Dang, Bing, Paul Andry, Cornelia Tsang, et al.. (2010). CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration. 1393–1398. 36 indexed citations
17.
Dang, Bing, S. L. Wright, Paul Andry, et al.. (2009). 3D chip stack with integrated decoupling capacitors. 1–5. 11 indexed citations
18.
Bakir, Muhannad S., Calvin King, Deepak Sekar, et al.. (2008). 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation. 663–670. 78 indexed citations
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Dang, Bing, et al.. (2002). Wetting characteristics of Pb-free solder alloys and PWB finishes. IEEE Transactions on Electronics Packaging Manufacturing. 25(3). 168–184. 34 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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