Claudius Feger

620 total citations
23 papers, 491 citations indexed

About

Claudius Feger is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Polymers and Plastics. According to data from OpenAlex, Claudius Feger has authored 23 papers receiving a total of 491 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electrical and Electronic Engineering, 9 papers in Materials Chemistry and 8 papers in Polymers and Plastics. Recurrent topics in Claudius Feger's work include Electronic Packaging and Soldering Technologies (13 papers), Synthesis and properties of polymers (7 papers) and 3D IC and TSV technologies (7 papers). Claudius Feger is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), Synthesis and properties of polymers (7 papers) and 3D IC and TSV technologies (7 papers). Claudius Feger collaborates with scholars based in United States, Japan and Germany. Claudius Feger's co-authors include H. Franke, Rainer Reuter, Michael Gaynes, James E. McGrath, Jae-Woong Nah, Hiroshi Suzuki, N. LaBianca, Toshihiko Matsumoto, Kazushige Toriyama and Mark Francis and has published in prestigious journals such as Nano Letters, Journal of Polymer Science Part A Polymer Chemistry and Polymer Engineering and Science.

In The Last Decade

Claudius Feger

22 papers receiving 461 citations

Peers

Claudius Feger
Pengchang Ma China
Daniel Lu China
Hongbing Wu China
Hirofumi Fujioka Japan
Ian M. McAninch United States
Ji Ho Shin South Korea
Guoyuan Li China
Yuhong Chen China
Rohini Gupta United States
Lei Zhai China
Pengchang Ma China
Claudius Feger
Citations per year, relative to Claudius Feger Claudius Feger (= 1×) peers Pengchang Ma

Countries citing papers authored by Claudius Feger

Since Specialization
Citations

This map shows the geographic impact of Claudius Feger's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Claudius Feger with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Claudius Feger more than expected).

Fields of papers citing papers by Claudius Feger

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Claudius Feger. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Claudius Feger. The network helps show where Claudius Feger may publish in the future.

Co-authorship network of co-authors of Claudius Feger

This figure shows the co-authorship network connecting the top 25 collaborators of Claudius Feger. A scholar is included among the top collaborators of Claudius Feger based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Claudius Feger. Claudius Feger is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Feger, Claudius & H. Franke. (2018). Polyimides in High-Performance Electronics Packaging and Optoelectronic Applications. 759–814. 3 indexed citations
2.
Engel, Michael, Rodrigo Neumann Barros Ferreira, Ronaldo Giro, et al.. (2017). A Platform for Analysis of Nanoscale Liquids with an Array of Sensor Devices Based on Two-Dimensional Material. Nano Letters. 17(5). 2741–2746. 9 indexed citations
3.
Nah, Jae-Woong, Michael Gaynes, E Perfecto, & Claudius Feger. (2012). Wafer level underfill for area array Cu pillar flip chip packaging of ultra low-k chips on organic substrates. 1233–1238. 9 indexed citations
4.
Feger, Claudius, et al.. (2011). Using Single-Wall Carbon Nanotubes and Raman Spectroscopy to Measure Local Stresses in First-Level Flip-Chip Organic Packages. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(10). 1601–1607. 5 indexed citations
5.
6.
Suzuki, Hiroshi, et al.. (2011). High performance wafer level underfill material with high filler loading. 370–374. 11 indexed citations
7.
Nah, Jae-Woong, et al.. (2010). Mask and mask-less injection molded solder (IMS) technology for fine pitch substrate bumping. IMAPSource Proceedings. 2010(1). 348–354. 6 indexed citations
8.
Feger, Claudius, et al.. (2010). Thermal fracture toughness measurement for underfill during temperature change. Microelectronics Reliability. 51(3). 685–691. 7 indexed citations
9.
Feger, Claudius, et al.. (2010). Underfill acceleration factor based on thermal fatigue crack growth rate. 29. 490–495. 4 indexed citations
10.
Feger, Claudius, N. LaBianca, Michael Gaynes, et al.. (2009). The over-bump applied resin wafer-level underfill process: Process, material and reliability. 9. 1502–1505. 29 indexed citations
11.
Orii, Yasumitsu, et al.. (2009). Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps. 3. 948–953. 39 indexed citations
12.
Feger, Claudius, et al.. (2009). Crack growth rate of thermally induced underfill fatigue. 72. 1240–1244. 2 indexed citations
13.
Feger, Claudius, et al.. (2008). Underfill fracture toughness as a function of cooling rate. 913–917. 4 indexed citations
14.
Matsumoto, Toshihiko & Claudius Feger. (1998). Optical Properties of Polyalicyclic Polyimides.. Journal of Photopolymer Science and Technology. 11(2). 231–236. 14 indexed citations
15.
Feger, Claudius, et al.. (1993). Advances in polyimide science and technology : proceedings of the Fourth International Conference on Polyimides, October 30-November 1, 1991, Ellenville, New York. 4 indexed citations
16.
Feger, Claudius, et al.. (1993). Ultraprecision machining of polymers. Precision Engineering. 15(4). 221–237. 68 indexed citations
17.
Feger, Claudius, et al.. (1989). Polyimides : materials, chemistry, and characterization : proceedings of the Third International Conference on Polyimides, Ellenville, New York, November 2-4, 1988. Elsevier eBooks. 35 indexed citations
18.
Feger, Claudius. (1989). Curing of polyimides. Polymer Engineering and Science. 29(5). 347–351. 37 indexed citations
19.
Reuter, Rainer, H. Franke, & Claudius Feger. (1988). Evaluating polyimides as lightguide materials. Applied Optics. 27(21). 4565–4565. 77 indexed citations
20.
Feger, Claudius, et al.. (1987). Curing studies of a polyimide precursor. II. Polyamic acid. Journal of Polymer Science Part A Polymer Chemistry. 25(9). 2479–2491. 96 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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