V. Bader

497 total citations
34 papers, 327 citations indexed

About

V. Bader is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Mechanics of Materials. According to data from OpenAlex, V. Bader has authored 34 papers receiving a total of 327 indexed citations (citations by other indexed papers that have themselves been cited), including 31 papers in Electrical and Electronic Engineering, 6 papers in Automotive Engineering and 4 papers in Mechanics of Materials. Recurrent topics in V. Bader's work include Electronic Packaging and Soldering Technologies (27 papers), 3D IC and TSV technologies (25 papers) and Additive Manufacturing and 3D Printing Technologies (6 papers). V. Bader is often cited by papers focused on Electronic Packaging and Soldering Technologies (27 papers), 3D IC and TSV technologies (25 papers) and Additive Manufacturing and 3D Printing Technologies (6 papers). V. Bader collaborates with scholars based in Germany and Taiwan. V. Bader's co-authors include R. Aschenbrenner, Tanja Braun, H. Reichl, Matthias Koch, Karl‐Friedrich Becker, K.-F. Becker, R. Kahle, T. Thomas, S. Voges and K.-D. Lang and has published in prestigious journals such as Microelectronics Reliability, Journal of Electronic Packaging and IEEE Transactions on Electronics Packaging Manufacturing.

In The Last Decade

V. Bader

29 papers receiving 302 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
V. Bader Germany 11 280 59 49 42 37 34 327
R. Kahle Germany 13 312 1.1× 50 0.8× 44 0.9× 63 1.5× 50 1.4× 35 372
S. Voges Germany 13 349 1.2× 53 0.9× 46 0.9× 57 1.4× 52 1.4× 36 400
Ser Choong Chong Singapore 12 446 1.6× 58 1.0× 35 0.7× 99 2.4× 60 1.6× 96 488
Vasarla Nagendra Sekhar Singapore 11 417 1.5× 51 0.9× 30 0.6× 80 1.9× 65 1.8× 64 456
Su‐Tsai Lu Taiwan 11 322 1.1× 103 1.7× 48 1.0× 51 1.2× 67 1.8× 32 369
David Tarng Taiwan 13 353 1.3× 70 1.2× 46 0.9× 62 1.5× 28 0.8× 50 407
Wei-Lan Chiu Taiwan 10 246 0.9× 52 0.9× 27 0.6× 46 1.1× 57 1.5× 43 290
Chai Tai Chong Singapore 10 422 1.5× 46 0.8× 43 0.9× 78 1.9× 46 1.2× 50 463
E Perfecto United States 10 222 0.8× 60 1.0× 18 0.4× 20 0.5× 17 0.5× 48 257
Hsiang‐Hung Chang Taiwan 11 260 0.9× 26 0.4× 17 0.3× 63 1.5× 48 1.3× 44 287

Countries citing papers authored by V. Bader

Since Specialization
Citations

This map shows the geographic impact of V. Bader's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Bader with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Bader more than expected).

Fields of papers citing papers by V. Bader

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by V. Bader. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Bader. The network helps show where V. Bader may publish in the future.

Co-authorship network of co-authors of V. Bader

This figure shows the co-authorship network connecting the top 25 collaborators of V. Bader. A scholar is included among the top collaborators of V. Bader based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with V. Bader. V. Bader is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Becker, Karl‐Friedrich, V. Bader, S. Voges, et al.. (2017). Non-Destructive Testing for System-in-Package Integrity Analysis. IMAPSource Proceedings. 2017(1). 182–187. 3 indexed citations
3.
Braun, Tanja, K.-F. Becker, V. Bader, et al.. (2016). Foldable Fan-Out Wafer Level Packaging. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 19–24. 5 indexed citations
4.
Becker, Karl‐Friedrich, Tanja Braun, V. Bader, et al.. (2016). On the Way from Fan-out Wafer to Fan-out Panel Level Packaging. IMAPSource Proceedings. 2016(S2). S1–S23. 1 indexed citations
5.
Braun, Tanja, Karl‐Friedrich Becker, V. Bader, et al.. (2015). From fan-out wafer to fan-out panel level packaging. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–4. 13 indexed citations
6.
Wunderle, Bernhard, Tanja Braun, D. May, et al.. (2015). A novel and practical method for in-situ monitoring of interface delamination by local thermal diffusivity measurement. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 6. 438–447. 4 indexed citations
7.
Braun, Tanja, K.-F. Becker, S. Voges, et al.. (2014). 24"×18" Fan-out panel level packing. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 940–946. 14 indexed citations
8.
Bauer, J., Karl‐Friedrich Becker, R. Kahle, et al.. (2013). Panel level packaging for LED lighting. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 100–103.
9.
Braun, Tanja, K.-F. Becker, S. Voges, et al.. (2011). 3D stacking approaches for mold embedded packages. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–8. 10 indexed citations
10.
Braun, Tanja, K.-F. Becker, S. Voges, et al.. (2011). Through mold vias for stacking of mold embedded packages. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 48–54. 29 indexed citations
11.
Becker, K.-F., Tanja Braun, Matthias Koch, et al.. (2011). Transfer molding technology for smart power electronics modules - materials and processes. IMAPSource Proceedings. 2011(1). 83–89. 2 indexed citations
12.
Braun, Tanja, Victoria Georgi, J. Bauer, et al.. (2010). Water diffusion in micro- and nano-particle filled encapsulants. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–7. 4 indexed citations
13.
Becker, K.-F., Tanja Braun, Alexander Neumann, et al.. (2005). Duromer MID technology for system-in-package generation. IEEE Transactions on Electronics Packaging Manufacturing. 28(4). 291–296. 8 indexed citations
14.
Becker, K.-F., Alexander Neumann, Andreas Ostmann, et al.. (2005). A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing. Journal of Electronic Packaging. 127(1). 1–6. 8 indexed citations
15.
Braun, Tanja, K.-F. Becker, Thomas Löher, et al.. (2005). High temperature potential of flip chip assemblies for automotive applications. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 3. 376–383 Vol. 1. 14 indexed citations
16.
Braun, Tanja, Karl‐Friedrich Becker, Matthias Koch, et al.. (2002). Flip chip molding - highly reliable flip chip encapsulation. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 717–725. 10 indexed citations
17.
Braun, Tanja, K.-F. Becker, Matthias Koch, et al.. (2002). Wafer level encapsulation - a transfer molding approach to system in package generation. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 235–244. 8 indexed citations
18.
Braun, Tanja, Karl‐Friedrich Becker, Matthias Koch, et al.. (2002). Flip Chip molding - Recent progress in flip chip encapsulation. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 151–159. 13 indexed citations
19.
Weiß, S., et al.. (2002). Fluxless die bonding of high power laser bars using the AuSn-metallurgy. 780–787. 9 indexed citations
20.
Topper, Michael J., et al.. (1998). Chip size package - the option of choice for miniaturized medical devices. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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