V. Bader
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Advanced MEMS and NEMS Technologies
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- Additive Manufacturing and 3D Printing Technologies
Papers in ⓘ
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- Electronic Packaging and Soldering Technologies 27
- 3D IC and TSV technologies 25
- Electromagnetic Compatibility and Noise Suppression 3
- Integrated Circuits and Semiconductor Failure Analysis 2
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- Additive Manufacturing and 3D Printing Technologies 6
- Co-authors
- R. Aschenbrenner (26 shared papers)Tanja Braun (22 shared papers)H. Reichl (16 shared papers)Matthias Koch (14 shared papers)Karl‐Friedrich Becker (14 shared papers)K.-F. Becker (14 shared papers)S. Voges (12 shared papers)T. Thomas (10 shared papers)
- Journals
- Microelectronics Reliability (2 papers)Journal of Electronic Packaging (1 paper)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)IMAPSource Proceedings (3 papers)Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) (15 papers)
In The Last Decade
V. Bader
29 papers receiving 302 citations
Peers
Comparison fields: 5 of 33
- Electrical and Electronic Engineering 280
- Automotive Engineering 37
- Industrial and Manufacturing Engineering 22
- Mechanics of Materials 49
- General Materials Science 5
Countries citing papers authored by V. Bader
This map shows the geographic impact of V. Bader's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Bader with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Bader more than expected).
Fields of papers citing papers by V. Bader
This network shows the impact of papers produced by V. Bader. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Bader. The network helps show where V. Bader may publish in the future.
Co-authors
The 25 scholars most cited alongside V. Bader, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 34 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 49 | |
| 2 | 2005 | 38 | |
| 3 | 2011 | 29 | |
| 4 | 2005 | 21 | |
| 5 | 2012 | 18 | |
| 6 | 2014 | 14 | |
| 7 | 2005 | 14 | |
| 8 | 2015 | 13 | |
| 9 | 2002 | 13 | |
| 10 | 2006 | 13 | |
| 11 | 2014 | 12 | |
| 12 | 3D stacking approaches for mold embedded packages | 2011 | 10 |
| 13 | 2002 | 10 | |
| 14 | 2002 | 9 | |
| 15 | 2005 | 8 | |
| 16 | 2005 | 8 | |
| 17 | 2002 | 8 | |
| 18 | Chip size package - the option of choice for miniaturized medical devices | 1998 | 5 |
| 19 | 2016 | 5 | |
| 20 | 2014 | 5 |
About V. Bader
V. Bader is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Mechanics of Materials, Mechanical Engineering and Industrial and Manufacturing Engineering, having authored 34 papers that have together received 327 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (27 papers), 3D IC and TSV technologies (25 papers), Additive Manufacturing and 3D Printing Technologies (6 papers), Manufacturing Process and Optimization (3 papers), Electromagnetic Compatibility and Noise Suppression (3 papers), Material Properties and Processing (3 papers), Integrated Circuits and Semiconductor Failure Analysis (2 papers) and VLSI and Analog Circuit Testing (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (280 citations), Automotive Engineering (37 citations), Industrial and Manufacturing Engineering (22 citations), Mechanics of Materials (49 citations) and General Materials Science (5 citations). V. Bader has collaborated with scholars based in Germany and Taiwan. Frequent co-authors include R. Aschenbrenner, Tanja Braun, H. Reichl, Matthias Koch, Karl‐Friedrich Becker, K.-F. Becker, S. Voges, T. Thomas, R. Kahle and J. Bauer. Their work appears in journals such as Microelectronics Reliability, Journal of Electronic Packaging, IEEE Transactions on Electronics Packaging Manufacturing, IMAPSource Proceedings and Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.