Matthias Hütter

706 total citations
53 papers, 527 citations indexed

About

Matthias Hütter is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, Matthias Hütter has authored 53 papers receiving a total of 527 indexed citations (citations by other indexed papers that have themselves been cited), including 49 papers in Electrical and Electronic Engineering, 14 papers in Mechanical Engineering and 8 papers in Automotive Engineering. Recurrent topics in Matthias Hütter's work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (24 papers) and Electric and Hybrid Vehicle Technologies (6 papers). Matthias Hütter is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (24 papers) and Electric and Hybrid Vehicle Technologies (6 papers). Matthias Hütter collaborates with scholars based in Germany, Austria and Japan. Matthias Hütter's co-authors include Hermann Oppermann, H. Reichl, Klaus‐Dieter Lang, Roland Siegwart, C. David Remy, R. Aschenbrenner, Gordon Elger, Matthias Klein, Edwin W. H. Jager and S. A. Schmitz and has published in prestigious journals such as Journal of Applied Physics, Sensors and Scripta Materialia.

In The Last Decade

Matthias Hütter

49 papers receiving 499 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Matthias Hütter Germany 12 404 156 110 58 45 53 527
Chingfu Tsou Taiwan 11 299 0.7× 89 0.6× 229 2.1× 68 1.2× 81 1.8× 60 467
Manabu Ataka Japan 9 153 0.4× 116 0.7× 112 1.0× 94 1.6× 28 0.6× 33 319
A. Geisberger United States 8 268 0.7× 106 0.7× 185 1.7× 160 2.8× 19 0.4× 17 440
Reza Saeidpourazar United States 10 141 0.3× 59 0.4× 169 1.5× 101 1.7× 20 0.4× 20 344
Xuhan Dai China 12 438 1.1× 346 2.2× 212 1.9× 72 1.2× 17 0.4× 47 533
Jeong Ho You United States 13 223 0.6× 276 1.8× 297 2.7× 65 1.1× 74 1.6× 28 581
Xiaolin Zhao China 16 406 1.0× 240 1.5× 173 1.6× 190 3.3× 16 0.4× 58 607
O. Cugat France 11 215 0.5× 194 1.2× 229 2.1× 148 2.6× 86 1.9× 21 547
Feng Wen China 14 257 0.6× 95 0.6× 127 1.2× 76 1.3× 37 0.8× 37 485

Countries citing papers authored by Matthias Hütter

Since Specialization
Citations

This map shows the geographic impact of Matthias Hütter's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Matthias Hütter with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Matthias Hütter more than expected).

Fields of papers citing papers by Matthias Hütter

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Matthias Hütter. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Matthias Hütter. The network helps show where Matthias Hütter may publish in the future.

Co-authorship network of co-authors of Matthias Hütter

This figure shows the co-authorship network connecting the top 25 collaborators of Matthias Hütter. A scholar is included among the top collaborators of Matthias Hütter based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Matthias Hütter. Matthias Hütter is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wenzel, Wolfgang, et al.. (2024). Thermal Management System for Battery Electric Heavy-Duty Trucks. SAE technical papers on CD-ROM/SAE technical paper series. 1.
2.
Hütter, Matthias, et al.. (2018). Ag sintering – An alternative large area joining technology. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–8. 3 indexed citations
3.
Curran, Brian, Matthias Hütter, Marta Martínez‐Vázquez, et al.. (2018). Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(7). 1231–1240. 12 indexed citations
4.
Schrank, Franz, et al.. (2017). Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation. Microelectronics Reliability. 76-77. 601–605. 7 indexed citations
5.
Hütter, Matthias, et al.. (2016). Solder Process for Fluxless Solder Paste Applications. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 447–454. 11 indexed citations
6.
Walter, H., et al.. (2016). Combination of Experimental and Simulation Methods for Analysis of Sintered Ag Joints for High Temperature Applications. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1335–1341. 29 indexed citations
7.
Hütter, Matthias, et al.. (2016). Traktionsbatterie als Wärmespeicher im Kältemittelkreis eines Elektrofahrzeugs. ATZ - Automobiltechnische Zeitschrift. 119(1). 26–31. 2 indexed citations
8.
Hütter, Matthias, et al.. (2015). Indirekte Kälteanlage mit Wärmepumpenfunktion für Hybrid- und E-Fahrzeuge. 1–12. 1 indexed citations
9.
Hütter, Matthias, et al.. (2014). Microstructural and mechanical analyses of Ag sintered joints. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–8. 6 indexed citations
10.
Sousa, Maria F.B., H. Walter, Matthias Hütter, et al.. (2014). Thermo-mechanical simulation of sintered Ag die attach for high temperature applications. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2014(HITEC). 378–384.
11.
Hütter, Matthias, et al.. (2014). A lead free joining technology for high temperature interconnects using Transient Liquid Phase Soldering (TLPS). Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1321–1327. 11 indexed citations
12.
Hütter, Matthias, et al.. (2012). Challenges in LED packaging and green lighting. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–8. 1 indexed citations
13.
Schneider‐Ramelow, Martin, Matthias Hütter, Hermann Oppermann, et al.. (2011). Technologies and Trends to Improve Power Electronic Packaging. IMAPSource Proceedings. 2011(1). 430–437. 8 indexed citations
14.
Oppermann, Hermann, et al.. (2007). Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow. Scripta Materialia. 58(7). 606–609. 8 indexed citations
15.
Hütter, Matthias, et al.. (2006). Precise flip chip assembly using electroplated AuSn20 and SnAg3.5 solder. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 8 pp.–8 pp.. 18 indexed citations
16.
Oppermann, Hermann, et al.. (2005). Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5716. 19–19. 5 indexed citations
17.
Schmückle, F.J., Matthias Hütter, Matthias Klein, et al.. (2005). W-band flip-chip VCO in thin-film environment. IEEE MTT-S International Microwave Symposium Digest, 2005.. 1007–1010. 5 indexed citations
18.
Hütter, Matthias, et al.. (2005). High precision passive alignment flip chip assembly using self-alignment and micromechanical stops. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 385–389. 2 indexed citations
19.
Oppermann, Hermann, et al.. (2005). Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps. MRS Proceedings. 863. 2 indexed citations
20.
Klein, Matthias, et al.. (2002). Behaviour of platinum as UBM in flip chip solder joints. 18. 40–45. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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