Matthias Hütter
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor Lasers and Optical Devices
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- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 31
- 3D IC and TSV technologies 24
- Semiconductor Lasers and Optical Devices 5
- Silicon Carbide Semiconductor Technologies 4
- Electric Vehicles and Infrastructure 3
- Co-authors
- Hermann Oppermann (22 shared papers)H. Reichl (15 shared papers)Klaus‐Dieter Lang (7 shared papers)Roland Siegwart (1 shared paper)C. David Remy (1 shared paper)R. Aschenbrenner (3 shared papers)Gordon Elger (2 shared papers)Matthias Klein (7 shared papers)
In The Last Decade
Matthias Hütter
49 papers receiving 505 citations
Peers
Comparison fields: 5 of 45
- Electrical and Electronic Engineering 406
- Mechanical Engineering 160
- Condensed Matter Physics 45
- General Materials Science 10
- Biomedical Engineering 111
Countries citing papers authored by Matthias Hütter
This map shows the geographic impact of Matthias Hütter's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Matthias Hütter with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Matthias Hütter more than expected).
Fields of papers citing papers by Matthias Hütter
This network shows the impact of papers produced by Matthias Hütter. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Matthias Hütter. The network helps show where Matthias Hütter may publish in the future.
Co-authors
The 25 scholars most cited alongside Matthias Hütter, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 52 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2010 | 74 | |
| 2 | 2002 | 55 | |
| 3 | 2016 | 30 | |
| 4 | 2004 | 29 | |
| 5 | 2015 | 28 | |
| 6 | 2007 | 22 | |
| 7 | 2006 | 21 | |
| 8 | 1999 | 19 | |
| 9 | 2006 | 18 | |
| 10 | 2002 | 18 | |
| 11 | 2018 | 12 | |
| 12 | 2018 | 11 | |
| 13 | 2017 | 11 | |
| 14 | 2016 | 11 | |
| 15 | 2014 | 11 | |
| 16 | 2000 | 11 | |
| 17 | 2017 | 11 | |
| 18 | 2009 | 10 | |
| 19 | 2000 | 10 | |
| 20 | 2008 | 9 |
About Matthias Hütter
Matthias Hütter is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Automotive Engineering, Mechanics of Materials and Condensed Matter Physics, having authored 52 papers that have together received 532 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (24 papers), Electric and Hybrid Vehicle Technologies (6 papers), GaN-based semiconductor devices and materials (6 papers), Adhesion, Friction, and Surface Interactions (6 papers), Semiconductor Lasers and Optical Devices (5 papers), Silicon Carbide Semiconductor Technologies (4 papers) and Electric Vehicles and Infrastructure (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (406 citations), Mechanical Engineering (160 citations), Condensed Matter Physics (45 citations), General Materials Science (10 citations) and Biomedical Engineering (111 citations). Matthias Hütter has collaborated with scholars based in Germany, Austria and Japan. Frequent co-authors include Hermann Oppermann, H. Reichl, Klaus‐Dieter Lang, Roland Siegwart, C. David Remy, R. Aschenbrenner, Gordon Elger, Matthias Klein, Edwin W. H. Jager and S. A. Schmitz. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Advanced Packaging, SAE technical papers on CD-ROM/SAE technical paper series and Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.