Xuejun Fan

7.3k total citations
326 papers, 5.4k citations indexed

About

Xuejun Fan is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Xuejun Fan has authored 326 papers receiving a total of 5.4k indexed citations (citations by other indexed papers that have themselves been cited), including 187 papers in Electrical and Electronic Engineering, 77 papers in Mechanics of Materials and 75 papers in Mechanical Engineering. Recurrent topics in Xuejun Fan's work include Electronic Packaging and Soldering Technologies (122 papers), 3D IC and TSV technologies (56 papers) and GaN-based semiconductor devices and materials (54 papers). Xuejun Fan is often cited by papers focused on Electronic Packaging and Soldering Technologies (122 papers), 3D IC and TSV technologies (56 papers) and GaN-based semiconductor devices and materials (54 papers). Xuejun Fan collaborates with scholars based in United States, China and Netherlands. Xuejun Fan's co-authors include Guoqi Zhang, Jiajie Fan, W.D. van Driel, Qiang Han, Cheng Qian, G. Q. Zhang, Huaiyu Ye, Xianping Chen, Tian‐Ling Ren and Yu Gong and has published in prestigious journals such as Journal of Applied Physics, Advanced Functional Materials and Acta Materialia.

In The Last Decade

Xuejun Fan

306 papers receiving 5.3k citations

Peers

Countries citing papers authored by Xuejun Fan

Since Specialization

Citations

This map shows the geographic impact of Xuejun Fan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xuejun Fan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xuejun Fan more than expected).

Fields of papers citing papers by Xuejun Fan

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Xuejun Fan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xuejun Fan. The network helps show where Xuejun Fan may publish in the future.

Co-authorship network of co-authors of Xuejun Fan

This figure shows the co-authorship network connecting the top 25 collaborators of Xuejun Fan. A scholar is included among the top collaborators of Xuejun Fan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Xuejun Fan. Xuejun Fan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Synergistic enhancement of breakdown and dielectric properties in dielectric energy storage polymer via incorporating TiO2-loaded Al2O3 nanotube featuring “cable-tie-like” composite structure 2025 ·Chemical Engineering Journal ·(unknown), (unknown), Xuejun Fan, (unknown), Hongzhi Cui, Hongqiang Wang, Zhicheng Shi	0
2	Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation 2025 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·Xueliang Wang, (unknown), T. Luo, (unknown), (unknown), Zhen Cui, Xuejun Fan, Guoqi Zhang, Jiajie Fan	1
3	Interface strength and crack propagation mechanisms in sintered copper nanoparticles 2025 ·Acta Materialia ·(unknown), (unknown), Olof Bäcke, Magnus Hörnqvist Colliander, René H. Poelma, Jiajie Fan, W.D. van Driel, Xuejun Fan, Guoqi Zhang	1
4	Peridynamic modeling of void nucleation and growth in metal lines due to electromigration in a finite element framework 2023 ·Computer Methods in Applied Mechanics and Engineering ·Yanan Zhang, (unknown), Xuejun Fan, Erdogan Madenci	3
5	High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling 2023 ·Journal of Materials Research and Technology ·Dong Hu, Cheng Qian, Xu Liu, (unknown), (unknown), Xuejun Fan, Guoqi Zhang, Jiajie Fan	17
6	Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study 2021 ·Corrosion Science ·Dong Hu, (unknown), Zhen Cui, Sten Vollebregt, Xuejun Fan, Guoqi Zhang, Jiajie Fan	8
7	Prognostics of radiation power degradation lifetime for ultraviolet light-emitting diodes using stochastic data-driven models 2021 ·Energy and AI ·Jiajie Fan, Jing Zhou, (unknown), (unknown), Min Li, Xuejun Fan, Guoqi Zhang	5
8	Deep machine learning of the spectral power distribution of the LED system with multiple degradation mechanisms 2020 ·Journal of Mechanics ·(unknown), Jiajie Fan, Xuejun Fan	19
9	Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes 2020 ·Laser & Photonics Review ·(unknown), Jiajie Fan, K.C. Yung, (unknown), W.D. van Driel, Xuejun Fan, Guoqi Zhang	55
10	Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model 2020 ·Optics Express ·Jiajie Fan, Wei Chen, (unknown), Xuejun Fan, Guoqi Zhang	12
11	Lifetime Prediction of Ultraviolet Light-Emitting Diodes Using a Long Short-Term Memory Recurrent Neural Network 2020 ·IEEE Electron Device Letters ·Jing Zhou, (unknown), (unknown), Jiajie Fan, Xuejun Fan, Guoqi Zhang	26
12	Machine-Learning Assisted Prediction of Spectral Power Distribution for Full-Spectrum White Light-Emitting Diode 2019 ·IEEE photonics journal ·Jiajie Fan, Yutong Li, (unknown), Cheng Qian, Xuejun Fan, Guoqi Zhang	26
13	High Moisture Accelerated Mechanical Behavior Degradation of Phosphor/Silicone Composites Used in White Light-Emitting Diodes 2019 ·Polymers ·Jiajie Fan, Zhen Wang, (unknown), (unknown), Xuejun Fan, Guoqi Zhang	18
14	Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method 2019 ·IEEE Access ·Wei Chen, Jiajie Fan, Cheng Qian, (unknown), Xuejun Fan, (unknown)	20
15	A Reliability Prediction Methodology for LED Arrays 2019 ·IEEE Access ·Bo Sun, Jiajie Fan, Xuejun Fan, Guoqi Zhang, (unknown)	5
16	Effects of Sintering Pressure on the Densification and Mechanical Properties of Nanosilver Double-Side Sintered Power Module 2018 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·Hao Zhang, Yang Liu, Ling‐en Wang, (unknown), Jiajie Fan, (unknown), Xuejun Fan, Guoqi Zhang	26
17	Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages 2018 ·IEEE Transactions on Components Packaging and Manufacturing Technology ·(unknown), Jiajie Fan, Cheng Qian, Hao Zhang, Xuejun Fan, Weiling Guo, Guoqi Zhang	46
18	A design and qualification of LED flip Chip-on-Board module with tunable color temperatures 2018 ·Microelectronics Reliability ·Jiajie Fan, Jianwu Cao, (unknown), Cheng Qian, Xuejun Fan, Guoqi Zhang	6
19	Development and Fidelity Evaluation of a Skeletal Ethylene Mechanism under Scramjet-Relevant Conditions 2017 ·Energy & Fuels ·Kun Wu, Wei Yao, Xuejun Fan	21
20	Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method 2017 ·Materials ·Cheng Qian, Jiajie Fan, (unknown), (unknown), Yi Ren, Xuejun Fan, Guoqi Zhang	12

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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