Ivan Ndip

1.5k total citations
141 papers, 1.1k citations indexed

About

Ivan Ndip is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering and Biomedical Engineering. According to data from OpenAlex, Ivan Ndip has authored 141 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 131 papers in Electrical and Electronic Engineering, 49 papers in Aerospace Engineering and 9 papers in Biomedical Engineering. Recurrent topics in Ivan Ndip's work include Electromagnetic Compatibility and Noise Suppression (67 papers), Microwave Engineering and Waveguides (56 papers) and 3D IC and TSV technologies (55 papers). Ivan Ndip is often cited by papers focused on Electromagnetic Compatibility and Noise Suppression (67 papers), Microwave Engineering and Waveguides (56 papers) and 3D IC and TSV technologies (55 papers). Ivan Ndip collaborates with scholars based in Germany, United States and United Kingdom. Ivan Ndip's co-authors include H. Reichl, Klaus‐Dieter Lang, Stephan Guttowski, Heino Henke, Brian Curran, Michael J. Topper, Lars Brusberg, Nils F. Nissen, H. Schröder and Francesco Fioranelli and has published in prestigious journals such as IEEE Transactions on Microwave Theory and Techniques, IEEE Transactions on Antennas and Propagation and Electronics Letters.

In The Last Decade

Ivan Ndip

127 papers receiving 1.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Ivan Ndip Germany 16 1.0k 290 151 42 40 141 1.1k
Xun Li China 16 556 0.5× 339 1.2× 61 0.4× 36 0.9× 14 0.3× 48 778
Xiaobang Shang United Kingdom 25 1.6k 1.6× 731 2.5× 161 1.1× 48 1.1× 61 1.5× 98 1.8k
DongHyun Kim United States 12 595 0.6× 162 0.6× 172 1.1× 47 1.1× 65 1.6× 97 786
Shi-Gang Zhou China 26 1.5k 1.5× 1.6k 5.4× 98 0.6× 50 1.2× 38 0.9× 132 1.8k
Hjalti H. Sigmarsson United States 18 1.1k 1.0× 610 2.1× 287 1.9× 21 0.5× 59 1.5× 103 1.2k
R.J. Wenzel United States 14 850 0.8× 416 1.4× 60 0.4× 29 0.7× 20 0.5× 42 908
Kyutae Lim United States 21 1.1k 1.1× 452 1.6× 176 1.2× 15 0.4× 6 0.1× 57 1.2k
Christopher T. Rodenbeck United States 16 589 0.6× 543 1.9× 95 0.6× 85 2.0× 9 0.2× 55 804
Cristiano Tomassoni Italy 23 1.7k 1.7× 1.2k 4.0× 139 0.9× 32 0.8× 95 2.4× 142 1.8k
Martin Schüßler Germany 17 641 0.6× 408 1.4× 267 1.8× 149 3.5× 14 0.3× 94 905

Countries citing papers authored by Ivan Ndip

Since Specialization
Citations

This map shows the geographic impact of Ivan Ndip's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ivan Ndip with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ivan Ndip more than expected).

Fields of papers citing papers by Ivan Ndip

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ivan Ndip. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ivan Ndip. The network helps show where Ivan Ndip may publish in the future.

Co-authorship network of co-authors of Ivan Ndip

This figure shows the co-authorship network connecting the top 25 collaborators of Ivan Ndip. A scholar is included among the top collaborators of Ivan Ndip based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ivan Ndip. Ivan Ndip is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Becker, Karl‐Friedrich, et al.. (2024). Packaging-Codesign for Thec Development of a High-Resolution MIMO-Radar-Module for Automated Guided Vehicles. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 183–189.
2.
Rossi, Marco, et al.. (2021). High Quality Integrated Inductor in Fan-out Wafer-Level Packaging Technology for mm-Wave Applications. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 89–92. 7 indexed citations
3.
Laurenson, David, et al.. (2021). MAC Layer Beamforming: Rate Loss due to Beam Cusping. 2021 IEEE 94th Vehicular Technology Conference (VTC2021-Fall). 1–7. 1 indexed citations
4.
Ndip, Ivan, et al.. (2019). On the Impact of Reflector Elements of Yagi-Uda Bond Wire Antennas. European Microwave Conference. 1 indexed citations
5.
Engin, A. Ege, et al.. (2018). Closed-Form Multipole Debye Model for Time-Domain Modeling of Lossy Dielectrics. IEEE Transactions on Electromagnetic Compatibility. 61(3). 966–968. 5 indexed citations
6.
Curran, Brian, et al.. (2018). K-band SATCOM Receiver Modules: System Design, Analysis and Test using the M3-Approach. 551–556. 1 indexed citations
7.
Curran, Brian, Matthias Hütter, Marta Martínez‐Vázquez, et al.. (2018). Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(7). 1231–1240. 12 indexed citations
8.
Duan, Xiaomin, et al.. (2015). Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1 indexed citations
9.
Duan, Xiaomin, David Dahl, Christian Schuster, Ivan Ndip, & Klaus‐Dieter Lang. (2015). Efficient analysis of wave propagation for Through-Silicon-Via pairs using multipole expansion method. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 59. 1–4. 1 indexed citations
10.
Curran, Brian, et al.. (2014). A Modeling Approach for Predicting the Effects of Dielectric Moisture Absorption on the Electrical Performance of Passive Structures. Journal of Microelectronics and Electronic Packaging. 11(3). 115–121. 2 indexed citations
11.
Ndip, Ivan, et al.. (2013). Modeling and minimizing the inductance of bond wire interconnects. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1–4. 15 indexed citations
12.
Ndip, Ivan, et al.. (2010). Design and characterization of a small encapsulated UHF RFID tag for wood log monitoring. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 29. 265–268. 5 indexed citations
13.
Ndip, Ivan, et al.. (2010). TSV Modeling Considering Signal Integrity Issues. IMAPSource Proceedings. 2010(1). 572–576.
14.
Brusberg, Lars, H. Schröder, Ivan Ndip, et al.. (2010). Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 269–274. 20 indexed citations
15.
Ndip, Ivan, et al.. (2009). Modeling and comparison of patch antenna configurations for 77 GHz radar applications. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 2463–2466. 2 indexed citations
16.
Ndip, Ivan, et al.. (2009). On the integration of a 2.4 GHz ISM band antenna in proximity to transmission lines. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 2353–2356. 2 indexed citations
17.
Engin, A. Ege & Ivan Ndip. (2009). Reduction of signal line to power plane coupling using controlled-return- current transmission lines. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft).
18.
Ndip, Ivan, Brian Curran, Stephan Guttowski, & H. Reichl. (2009). Modeling and quantification of conventional and coax-TSVs for RF applications. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–4. 25 indexed citations
19.
Ndip, Ivan, et al.. (2008). Modeling and analysis of return-current paths for microstrip-to-microstrip via transitions. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1321–1326. 5 indexed citations
20.
Ndip, Ivan, et al.. (2008). Design and Analysis of a Bent Antenna-coil for a HF RFID Transponder. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 75–78. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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