Ivan Ndip
-
- Electromagnetic Compatibility and Noise Suppression 67
- Microwave Engineering and Waveguides 56
- 3D IC and TSV technologies 55
- Electronic Packaging and Soldering Technologies 34
- Millimeter-Wave Propagation and Modeling 14
- Microwave and Dielectric Measurement Techniques 10
- Aerospace Engineering top 5%
- Antenna Design and Analysis 33
- Advanced Antenna and Metasurface Technologies 27
- Co-authors
- H. ReichlKlaus‐Dieter LangStephan GuttowskiHeino HenkeBrian CurranMichael J. TopperLars BrusbergNils F. Nissen
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (8 papers)IEEE Transactions on Electromagnetic Compatibility (5 papers)IEEE Transactions on Antennas and Propagation (2 papers)
- Partner nations
- GermanyUnited StatesUnited Kingdom
In The Last Decade
Ivan Ndip
127 papers receiving 1.1k citations
Peers
Comparison fields: 5 of 43
- Electrical and Electronic Engineering 1.0k
- Aerospace Engineering 290
- Biomedical Engineering 151
- Automotive Engineering 40
- Media Technology 25
Countries citing papers authored by Ivan Ndip
This map shows the geographic impact of Ivan Ndip's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ivan Ndip with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ivan Ndip more than expected).
Fields of papers citing papers by Ivan Ndip
This network shows the impact of papers produced by Ivan Ndip. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ivan Ndip. The network helps show where Ivan Ndip may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Ivan Ndip, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 0 | |
| 2 | 2024 | 1 | |
| 3 | 2023 | 0 | |
| 4 | 2023 | 1 | |
| 5 | 2022 | 1 | |
| 6 | On the Impact of Reflector Elements of Yagi-Uda Bond Wire Antennas | 2019 | 1 |
| 7 | 2018 | 1 | |
| 8 | 2018 | 12 | |
| 9 | Comparison of passivation materials for high frequency 3D packaging application up to 110 GHz | 2015 | 1 |
| 10 | 2013 | 15 | |
| 11 | 2013 | 64 | |
| 12 | 2011 | 1 | |
| 13 | 2010 | 107 | |
| 14 | 2010 | 20 | |
| 15 | Reduction of signal line to power plane coupling using controlled-return- current transmission lines | 2009 | 0 |
| 16 | Modeling and quantification of conventional and coax-TSVs for RF applications | 2009 | 25 |
| 17 | On the integration of a 2.4 GHz ISM band antenna in proximity to transmission lines | 2009 | 2 |
| 18 | Modeling and comparison of patch antenna configurations for 77 GHz radar applications | 2009 | 2 |
| 19 | 2009 | 12 | |
| 20 | 2008 | 5 |
About Ivan Ndip
Ivan Ndip is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering and Electronic, Optical and Magnetic Materials, having authored 141 papers that have together received 1.1k indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (67 papers), Microwave Engineering and Waveguides (56 papers), 3D IC and TSV technologies (55 papers), Electronic Packaging and Soldering Technologies (34 papers), Antenna Design and Analysis (33 papers), Advanced Antenna and Metasurface Technologies (27 papers), Millimeter-Wave Propagation and Modeling (14 papers) and Microwave and Dielectric Measurement Techniques (10 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.0k citations), Aerospace Engineering (290 citations) and Biomedical Engineering (151 citations). Ivan Ndip has collaborated with scholars based in Germany, United States and United Kingdom. Frequent co-authors include H. Reichl, Klaus‐Dieter Lang, Stephan Guttowski, Heino Henke, Brian Curran, Michael J. Topper, Lars Brusberg, Nils F. Nissen, H. Schröder and Sana Salous. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Antennas and Propagation, IEEE Transactions on Microwave Theory and Techniques and IET Microwaves Antennas & Propagation.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.