E. Zakel

692 citations

51 papers · 468 indexed · h-index 14

Impact in

General Materials Science top 5%
Electrical and Electronic Engineering top 10%
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor Lasers and Optical Devices
- Electrodeposition and Electroless Coatings

Papers in

Electrical and Electronic Engineering 46
- Electronic Packaging and Soldering Technologies 42
- 3D IC and TSV technologies 34
- Semiconductor Lasers and Optical Devices 5
- Silicon and Solar Cell Technologies 3
- Electrodeposition and Electroless Coatings 3
Mechanics of Materials 14
- Adhesion, Friction, and Surface Interactions 12

Co-authors: H. Reichl Andreas Ostmann R. Aschenbrenner S. Weiß B. Peplinski Erik Jung Christine Kallmayer Hermann Oppermann
Journals: IEEE Transactions on Components Packaging and Manufacturing Technology Part B (3 papers)Soldering and Surface Mount Technology (3 papers)ECS Transactions (1 paper)Materials science forum (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part A (1 paper)
Partner nations: Germany

In The Last Decade

E. Zakel

47 papers receiving 390 citations

Peers

Countries citing papers authored by E. Zakel

Since Specialization

Citations

This map shows the geographic impact of E. Zakel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Zakel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Zakel more than expected).

Fields of papers citing papers by E. Zakel

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by E. Zakel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Zakel. The network helps show where E. Zakel may publish in the future.

Co-authorship network

The 19 scholars most cited alongside E. Zakel, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with E. Zakel Line = papers co-authored together E. Zakel links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Micro ball bumping packaging for wafer level & 3-d solder sphere transfer and solder jetting Zoulikha Mabdoua Toutaoui, Richard Croome, Matthew Bartnik, E. Zakel	2012	1
2	Electroless Nickel/Gold Under-Bump-Metallization Cost Comparisons ECS Transactions ·Andrew Strandjord, П.В. Максимчик, E. Zakel, Zoulikha Mabdoua Toutaoui, Richard Croome	2009	1
3	A bumping process for 12" wafers Zoulikha Mabdoua Toutaoui, Richard Croome, E. Zakel, Maria Cláudia Reis	2003	6
4	Placement and reflow of solder balls for FC, BGA, wafer-level-CSP, optoelectronic components and MEMS by using a new solder jetting method IMAPSource Proceedings ·Zoulikha Mabdoua Toutaoui, Shilo Osae, E. Zakel, Matthew Bartnik, Richard Croome	2002	8
5	Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology Ants Kutti, A. Muto, Aaron David Dugatkin, Erik Jung, Andreas Ostmann, E. Zakel, H. Reichl	2002	24
6	Low cost flip chip bumping Zoulikha Mabdoua Toutaoui, Richard Croome, E. Zakel	2002	10
7	A roadmap to low cost bumping for DCA, COF, CSP and BGA [flip chip] E. Zakel, Richard Croome	2002	1
8	A roadmap to low cost flip chip and CSP using electroless Ni/Au Zoulikha Mabdoua Toutaoui, E. Zakel, Richard Croome	2002	19
9	Investigations of laser soldered TAB inner lead contacts E. Zakel, Matthew Bartnik, H. Reichl	2002	2
10	Reliability of thermally aged Au and Sn plated copper leads for TAB inner lead bonding E. Zakel, Marvin P. Thompson, H. Reichl	2002	6
11	A new approach to chip size package using meniscus soldering and FPC-bonding Christine Kallmayer, Erik Jung, Marco J Götte, Shu-Chi Chou, Matthew Bartnik, E. Zakel, H. Reichl	2002	3
12	A Low Cost Bumping Process for 300 mm Wafers Zoulikha Mabdoua Toutaoui, Richard Croome, E. Zakel, Maria Cláudia Reis	1999	1
13	Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·R. Aschenbrenner, Andreas Ostmann, Shanie Fussman, E. Zakel, H. Reichl	1997	44
14	Design and technology for fluxless die bonding of high power laser bars using Au(80)Sn(20)-solder S. Weiß, Takahiko Terada, Yogesh Dinkar Gosavi, E. Zakel, B. Michel, H. Reichl	1997	1
15	Mounting of high power laser diodes on diamond heatsinks IEEE Transactions on Components Packaging and Manufacturing Technology Part A ·S. Weiß, E. Zakel, H. Reichl	1996	26
16	Reliability investigations of fluxless flip-chip interconnections on green tape ceramic substrates Ants Kutti, E. Zakel, Mariana Pereira de Souza, H. Reichl	1995	22
17	Fluxless flip chip assembly on rigid and flexible polymer substrates using the Au-Sn metallurgy E. Zakel, Leonardo Barros Oliveira, Ants Kutti, Monika Rašnerová, B. M�ther, H. Reichl	1994	10
18	Reliability and Au-concentration in OLB solder fillets of TAB-devices having a 75 /spl mu/m pitch E. Zakel, Jacques Villain, H. Reichl	1994	2
19	Reliability investigations of different tape metallizations for TAB-outer lead bonding IEEE Transactions on Components Packaging and Manufacturing Technology Part B ·E. Zakel, Matthew Bartnik, Maciej Sokołowski-Zgid, H. Reichl	1994	7
20	Investigations of laser soldered TAB inner lead contacts IEEE Transactions on Components Hybrids and Manufacturing Technology ·E. Zakel, Matthew Bartnik, H. Reichl	1991	7

About E. Zakel

E. Zakel is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Automotive Engineering and General Materials Science, having authored 51 papers that have together received 468 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (34 papers), Adhesion, Friction, and Surface Interactions (12 papers), Semiconductor materials and interfaces (5 papers), Advanced Welding Techniques Analysis (5 papers), Semiconductor Lasers and Optical Devices (5 papers), Silicon and Solar Cell Technologies (3 papers) and Electrodeposition and Electroless Coatings (3 papers). The work is most often cited by research in General Materials Science (24 citations), Electrical and Electronic Engineering (424 citations), Mechanics of Materials (83 citations), Mechanical Engineering (125 citations) and Automotive Engineering (18 citations). E. Zakel has collaborated with scholars based in Germany. Frequent co-authors include H. Reichl, Andreas Ostmann, R. Aschenbrenner, S. Weiß, B. Peplinski, Erik Jung, Christine Kallmayer, Hermann Oppermann, Walter Schmidt and H. Meyer. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Soldering and Surface Mount Technology, ECS Transactions, Materials science forum and IEEE Transactions on Components Packaging and Manufacturing Technology Part A.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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