Brian Curran
Impact in
- Hardware and Architecture top 5%
- Parallel Computing and Optimization Techniques
- VLSI and Analog Circuit Testing
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- Low-power high-performance VLSI design
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- VLSI and FPGA Design Techniques
- Semiconductor materials and devices
Papers in
-
- Parallel Computing and Optimization Techniques 8
- Embedded Systems Design Techniques 6
- VLSI and Analog Circuit Testing 5
-
- Low-power high-performance VLSI design 14
- Electromagnetic Compatibility and Noise Suppression 12
- 3D IC and TSV technologies 9
- Microwave Engineering and Waveguides 8
- Co-authors
- Ivan NdipH. ReichlStephan GuttowskiY.H. ChanB.D. McCredieEric FluhrKlaus‐Dieter LangG. A. Northrop
- Journals
- IBM Journal of Research and Development (8 papers)IEEE Transactions on Microwave Theory and Techniques (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)IEEE Transactions on Computers (1 paper)IEEE Micro (1 paper)
- Partner nations
- GermanyUnited StatesBelgium
In The Last Decade
Brian Curran
36 papers receiving 425 citations
Peers
Comparison fields: 5 of 47
- Hardware and Architecture 185
- Electrical and Electronic Engineering 358
- Computer Networks and Communications 83
- Computational Theory and Mathematics 29
- Aerospace Engineering 42
Countries citing papers authored by Brian Curran
This map shows the geographic impact of Brian Curran's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Brian Curran with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Brian Curran more than expected).
Fields of papers citing papers by Brian Curran
This network shows the impact of papers produced by Brian Curran. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Brian Curran. The network helps show where Brian Curran may publish in the future.
Co-authors
The 25 scholars most cited alongside Brian Curran, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 1 | |
| 2 | 2018 | 12 | |
| 3 | 2015 | 16 | |
| 4 | 2015 | 17 | |
| 5 | 2014 | 2 | |
| 6 | 2011 | 0 | |
| 7 | 2011 | 10 | |
| 8 | 2010 | 0 | |
| 9 | 2010 | 6 | |
| 10 | Modeling and quantification of conventional and coax-TSVs for RF applications | 2009 | 25 |
| 11 | 2009 | 12 | |
| 12 | 2009 | 15 | |
| 13 | 2009 | 5 | |
| 14 | Highly Integrated Multi-Harmonic Tuner for Broadband High Power Source-/Load-Pull System | 2008 | 0 |
| 15 | 2007 | 11 | |
| 16 | 2006 | 16 | |
| 17 | 2002 | 1 | |
| 18 | 2002 | 3 | |
| 19 | 1997 | 2 | |
| 20 | 1997 | 42 |
About Brian Curran
Brian Curran is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering, Aerospace Engineering, Computer Networks and Communications and Computational Theory and Mathematics, having authored 39 papers that have together received 449 indexed citations. Recurring topics across this work include Low-power high-performance VLSI design (14 papers), Electromagnetic Compatibility and Noise Suppression (12 papers), 3D IC and TSV technologies (9 papers), Parallel Computing and Optimization Techniques (8 papers), Microwave Engineering and Waveguides (8 papers), Embedded Systems Design Techniques (6 papers), VLSI and Analog Circuit Testing (5 papers) and Interconnection Networks and Systems (5 papers). The work is most often cited by research in Hardware and Architecture (185 citations), Electrical and Electronic Engineering (358 citations), Computer Networks and Communications (83 citations), Computational Theory and Mathematics (29 citations) and Aerospace Engineering (42 citations). Brian Curran has collaborated with scholars based in Germany, United States and Belgium. Frequent co-authors include Ivan Ndip, H. Reichl, Stephan Guttowski, Y.H. Chan, B.D. McCredie, Eric Fluhr, Klaus‐Dieter Lang, G. A. Northrop, L. Sigal and Seán Carey. Their work appears in journals such as IBM Journal of Research and Development, IEEE Transactions on Microwave Theory and Techniques, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Computers and IEEE Micro.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.