Rao Tummala

15.0k citations

568 papers · 11.2k indexed · 6 hit papers · h-index 40

Impact in

Electrical and Electronic Engineering top 0.2%
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Microwave Engineering and Waveguides
- Semiconductor materials and devices
- Microwave Dielectric Ceramics Synthesis
Ceramics and Composites top 1%

Papers in

Electrical and Electronic Engineering 481
- 3D IC and TSV technologies 322
- Electronic Packaging and Soldering Technologies 236
- Electromagnetic Compatibility and Noise Suppression 101
- Semiconductor Lasers and Optical Devices 60
- Microwave Engineering and Waveguides 58
- Semiconductor materials and devices 50
Electronic, Optical and Magnetic Materials 81
- Copper Interconnects and Reliability 60

Co-authors: Eugene J. Rymaszewski Venky Sundaram P. Markondeya Raj Madhavan Swaminathan Tobias Schoenherr Vanessa Smet Swapan Kumar Bhattacharya Fuhan Liu
Journals: IEEE Transactions on Components Packaging and Manufacturing Technology (52 papers)IEEE Transactions on Advanced Packaging (17 papers)Journal of Materials Science Materials in Electronics (16 papers)Journal of Electronic Materials (10 papers)IEEE Transactions on Components and Packaging Technologies (8 papers)
Partner nations: United States Japan South Korea

In The Last Decade

Rao Tummala

546 papers receiving 10.5k citations

Hit Papers

6 papers align trajectories log scale

A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues 2019 · 308 citations

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if any of the following hold:

it has ≥500 total citations;
it reaches ≥1.5× the top-1% citation threshold for papers in the same subfield and year (the threshold is the minimum needed to enter the top 1%, not the average within it);
it reaches the top citation threshold in at least one of its specific research topics.

2019 IEEE Journal of Emerging and Selected Topics in Power Electronics
2011 Supply Chain Management An International Journal
2001 CERN Document Server (European Organization for Nuclear Research)
1997 Microelectronics Packaging Handbook
1991 Journal of the American Ceramic Society
1989 Journal of Electronic Packaging

Peers

Countries citing papers authored by Rao Tummala

Since Specialization

Citations

This map shows the geographic impact of Rao Tummala's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Rao Tummala with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Rao Tummala more than expected).

Fields of papers citing papers by Rao Tummala

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Rao Tummala. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Rao Tummala. The network helps show where Rao Tummala may publish in the future.

Co-authors

The 25 scholars most cited alongside Rao Tummala, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Rao Tummala Line = papers co-authored together Rao Tummala links everyone, so they are left out of the graph.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

#	Work
1	Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications IEEE Transactions on Components Packaging and Manufacturing Technology ·Shreya Dwarakanath, Pragna Bhaskar, Kimiyuki Kanno, Pratik Nimbalkar, Mohanalingam Kathaperumal, P. Markondeya Raj, Madhavan Swaminathan, Rao Tummala	2024	0
2	A Critical Review of Lithography Methodologies and Impacts of Topography on 2.5-D/3-D Interposers IEEE Transactions on Components Packaging and Manufacturing Technology ·Fuhan Liu, Pratik Nimbalkar, Nahid Aslani-Amoli, Mohanalingam Kathaperumal, Rao Tummala, Madhavan Swaminathan	2023	11
3	Effect of Titanium-Polymer Interactions on Adhesion of Polymer-Copper Redistribution Layers in Advanced Packaging IEEE Transactions on Device and Materials Reliability ·Pratik Nimbalkar, Christopher Blancher, Mohanalingam Kathaperumal, Madhavan Swaminathan, Rao Tummala	2022	8
4	Cointegration of Single-Mode Waveguides and Embedded Electrical Interconnects for High-Bandwidth Communications IEEE Transactions on Components Packaging and Manufacturing Technology ·Rui Zhang, Fuhan Liu, Mohanalingam Kathaperumal, Madhavan Swaminathan, Rao Tummala	2020	8
5	Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration Journal of Electronic Materials ·Yiteng Wang, Atom O. Watanabe, Nobuo Ogura, P. Markondeya Raj, Rao Tummala	2020	14
6	Evaluation of Fine-Pitch Routing Capabilities of Advanced Dielectric Materials for High Speed Panel-RDL in 2.5D Interposer and Fan-Out Packages Shreya Dwarakanath, P. Markondeya Raj, Amit Agarwal, Daichi Okamoto, Atsushi Kubo, Fuhan Liu, Mohan Kathaperumal, Rao Tummala	2019	16
7	Microvia Formation in 5- $\mu \text{m}$ -Thick Dry-Film Dielectric by Ozone Etch Processes IEEE Transactions on Components Packaging and Manufacturing Technology ·Yuya Suzuki, E.S. Snyder, Chengxiang Ji, Steve Walther, Atul Gupta, Christiane Gottschalk, Venky Sundaram, Rao Tummala	2017	1
8	Embedded Trench Redistribution Layers at 2– $5~\mu \text{m}$ Width and Space by Excimer Laser Ablation and Surface Planer Processes for 20– $40~\mu \text{m}$ I/O Pitch Interposers IEEE Transactions on Components Packaging and Manufacturing Technology ·Yuya Suzuki, Habib Hichri, Frank Wei, Venky Sundaram, Rao Tummala	2017	4
9	Design and Demonstration of a 2.5-D Glass Interposer BGA Package for High Bandwidth and Low Cost IEEE Transactions on Components Packaging and Manufacturing Technology ·Brett Sawyer, Yuya Suzuki, Ryuta Furuya, Chandrasekharan Nair, Ting‐Chia Huang, Vanessa Smet, Kadappan Panayappan, Venky Sundaram, Rao Tummala	2017	34
10	Multilayered Ferromagnetic Polymer Composite Structures for High-Density Power Inductors IEEE Transactions on Magnetics ·Dibyajat Mishra, P. Markondeya Raj, Joel Tishler, Teng Sun, Erik Shipton, Rao Tummala	2016	3
11	Industry consortium for new era of automotive electronics with entire system-on-package vision at Georgia Tech European Microelectronics and Packaging Conference ·Rao Tummala, Klaus-Juergen Wolter, Venky Sundaram, Vanessa Smet, P. Markondeya Raj	2015	0
12	Signal and power integrity analysis in 2.5D integrated circuits (ICs) with glass, silicon and organic interposer Youngwoo Kim, Jonghyun Cho, Kiyeong Kim, Venky Sundaram, Rao Tummala, Joungho Kim	2015	21
13	Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV) Vivek Sridharan, Sung-Hwan Min, Venky Sundaram, Vijay Sukumaran, Seunghyun Hwang, Hunter Chan, Fuhan Liu, Christian Nopper, Rao Tummala	2010	34
14	Through-package-via formation and metallization of glass interposers Vijay Sukumaran, Qiao Chen, Fuhan Liu, Nitesh Kumbhat, Tapobrata Bandyopadhyay, Hunter Chan, Sung-Hwan Min, Christian Nopper, Venky Sundaram, Rao Tummala	2010	101
15	Reliable Design of Electroplated Copper Through Silicon Vias Xi Liu, Qiao Chen, Venkatesh Sundaram, Sriram Muthukumar, Rao Tummala, Suresh K. Sitaraman	2010	13
16	Design, Modeling and Characterization of Embedded Capacitors for Decoupling Applications P. Muthana, E. Engin, P. Raj, Madhavan Swaminathan, Rao Tummala, V. Sundaram, Daniel I. Amey, K.H. Dietz, Sounak Banerji	2008	2
17	Vertically Aligned Zn₂SiO₄ Nanotube/ZnO Nanowire Heterojunction Arrays Small ·Jun Zhou, Liu Jin, Xudong Wang, Jinhui Song, Rao Tummala, Ning Xu, Zhong Lin Wang	2007	75
18	Cost-Effective RF Front-End Module Using High Q Passive Components on Liquid Crystal Polymer Substrates and Micro-BGA IEICE Transactions on Electronics ·Kenneth Y. T. Lim, J. Laskar, G. Edward White, Rao Tummala, S. Pinel, Mekita F. Davis, V. Sundaram	2003	3
19	Ultra-fine photoresist image formation for next generation high-density PWB substrate Fuhan Liu, Venky Sundaram, G. Edward White, Rao Tummala	2000	5
20	Electronic Packaging Research and Education: A Model for the 21st Century Johns Hopkins APL technical digest ·Rao Tummala	1999	2

About Rao Tummala

Rao Tummala is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering, Automotive Engineering and Architecture, having authored 568 papers that have together received 11.2k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (322 papers), Electronic Packaging and Soldering Technologies (236 papers), Electromagnetic Compatibility and Noise Suppression (101 papers), Semiconductor Lasers and Optical Devices (60 papers), Copper Interconnects and Reliability (60 papers), Microwave Engineering and Waveguides (58 papers), Nanofabrication and Lithography Techniques (53 papers) and Semiconductor materials and devices (50 papers). The work is most often cited by research in Electrical and Electronic Engineering (8.4k citations), Ceramics and Composites (614 citations), Electronic, Optical and Magnetic Materials (1.0k citations), Biomedical Engineering (2.3k citations) and Materials Chemistry (2.3k citations). Rao Tummala has collaborated with scholars based in United States, Japan and South Korea. Frequent co-authors include Eugene J. Rymaszewski, Venky Sundaram, P. Markondeya Raj, Madhavan Swaminathan, Tobias Schoenherr, Vanessa Smet, Swapan Kumar Bhattacharya, Fuhan Liu, Tapobrata Bandyopadhyay and Vijay Sukumaran. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Advanced Packaging, Journal of Materials Science Materials in Electronics, Journal of Electronic Materials and IEEE Transactions on Components and Packaging Technologies.

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