E. Suhir
About
In The Last Decade
E. Suhir
295 papers receiving 4.3k citations
Hit Papers
Peers
Comparison fields: 5 of 108
- Electrical and Electronic Engineering 3.0k
- Mechanics of Materials 1.5k
- Mechanical Engineering 820
- Materials Chemistry 672
- Biomedical Engineering 650
Countries citing papers authored by E. Suhir
This map shows the geographic impact of E. Suhir's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Suhir with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Suhir more than expected).
Fields of papers citing papers by E. Suhir
This network shows the impact of papers produced by E. Suhir. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Suhir. The network helps show where E. Suhir may publish in the future.
Co-authorship network of co-authors of E. Suhir
This figure shows the co-authorship network connecting the top 25 collaborators of E. Suhir. A scholar is included among the top collaborators of E. Suhir based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with E. Suhir. E. Suhir is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 2 | |
| 4 | 3 | |
| 5 | 2 | |
| 6 | 1 | |
| 7 | 3 | |
| 8 | 7 | |
| 9 | 11 | |
| 10 | 3 | |
| 11 | 8 | |
| 12 | Minimizing thermally induced interfacial shearing stress in a thermoelectric module | 1 |
| 13 | 24 | |
| 14 | 6 | |
| 15 | Thermal stress modeling in microelectronics and photonic structures, and the application of the probablistic approach : Review and extension | 13 |
| 16 | Proceedings of the 1998 Workshop on Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices, presented at Hotel Concorde Saint-Lazare, November 29-December 2, 1998, Paris, France | 2 |
| 17 | Advances in electronic packaging, 1997 : proceedings of the Pacific Rim/ASME International Intersociety Electronic & Photonic Packaging Conference, INTERpack '97 : presented at the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, June 15-19, 1997, Kohala Coast, Hawaii | 10 |
| 18 | Structural analysis in microelectronics and fiber optics 1994 : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 | 1 |
| 19 | Structural analysis in microelectronics and fiber optics : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 | 4 |
| 20 | Basic principles of engineering elasticity and fundamentals of structural analysis | 5 |
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.