A.A.O. Tay

7.0k citations

245 papers · 5.8k indexed · 1 hit paper · h-index 36

Impact in

Automotive Engineering top 0.2%
- Advanced Battery Technologies Research
Electrical and Electronic Engineering top 0.5%
- Advancements in Battery Materials
- Advanced Battery Materials and Technologies
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electric Vehicles and Infrastructure

Papers in

Mechanics of Materials 91
- Mechanical Behavior of Composites 53
Electrical and Electronic Engineering 178
- Electronic Packaging and Soldering Technologies 106
- 3D IC and TSV technologies 43
- Silicon and Solar Cell Technologies 16
- Advancements in Battery Materials 15

Co-authors: Lip Huat Saw Yonghuang Ye Yixiang Shi Mohan Kumar Kesarla G. de Vahl Davis M.G. Stevenson V. Kripesh Swapnil Dubey
Journals: Journal of Electronic Packaging (7 papers)Applied Thermal Engineering (6 papers)Journal of Materials Processing Technology (5 papers)Solar Energy (4 papers)Journal of Power Sources (4 papers)
Partner nations: Singapore United States China

In The Last Decade

A.A.O. Tay

233 papers receiving 5.5k citations

Hit Papers

align trajectories log scale

Computational fluid dynamic and thermal analysis of Lithium-ion battery pack with air cooling 2016 · 428 citations

Peers

Countries citing papers authored by A.A.O. Tay

Since Specialization

Citations

This map shows the geographic impact of A.A.O. Tay's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A.A.O. Tay with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A.A.O. Tay more than expected).

Fields of papers citing papers by A.A.O. Tay

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by A.A.O. Tay. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A.A.O. Tay. The network helps show where A.A.O. Tay may publish in the future.

Co-authors

The 25 scholars most cited alongside A.A.O. Tay, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with A.A.O. Tay Line = papers co-authored together A.A.O. Tay links everyone, so they are left out of the graph.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

#	Work
1	An Investigation on the Most Likely Failure Locations in the BEoL Stack of a 20 nm Chip Due to Chip Package Interaction with the Use of Novel Semi-Elliptical Cracks Micromachines ·F.A. KAUT, Jim C. Fitch, A.A.O. Tay, Zhilin Long	2023	3
2	High-performance ultra-low-k fluorine-doped nanoporous organosilica films for inter-layer dielectric Journal of Materials Science ·F.A. KAUT, Guangping Zheng, احمد عتمان, Lei Shi, Junhui Li, Zhuo Chen, Liancheng Wang, A.A.O. Tay, Wenhui Zhu	2018	23
3	Thermal management of lithium-ion battery pack with liquid cooling Lip Huat Saw, A.A.O. Tay, tguffon	2015	79
4	Versatile pattern generation of periodic, high aspect ratio Si nanostructure arrays with sub-50-nm resolution on a wafer scale Nanoscale Research Letters ·Jian Wei Ho, Sindhuja Ranganathan, O.L. Ziukov, A.A.O. Tay, Soo-Jin Chua	2013	14
5	Comparative study of intermittent spray cooling in single and two phase regimes International Journal of Thermal Sciences ·Sivanand Somasundaram, A.A.O. Tay	2013	46
6	Experimental Study of the Performance of Two Different Types of Photovoltaic Thermal (PVT) Modules under Singapore Climatic Conditions Journal of Fundamentals of Renewable Energy and Applications ·Swapnil Dubey, A.A.O. Tay	2012	5
7	Electro-thermal cycle life model for lithium iron phosphate battery Journal of Power Sources ·Yonghuang Ye, Yixiang Shi, A.A.O. Tay	2012	145
8	Interaction of multiple delaminations and die in a plastic IC package National University of Singapore ·Siow Ling Ho, Χρήστος Νταλάκας, A.A.O. Tay	2010	0
9	Development of Stretch Solder Interconnections for Wafer Level Packaging IEEE Transactions on Advanced Packaging ·R. Rajoo, Linda Stackman, E.H. Wong, 東子邵, S.K.W. Seah, A.A.O. Tay, QU Hai-long, Rao Tummala	2008	0
10	A Study of the Effect of Viscoelasticity on Delamination in a Plastic IC Package Undergoing Leadfree Solder Reflow National University of Singapore ·亮寿三輪, A.A.O. Tay, Yong‐Wei Zhang, Ga Ram 이가람Lee	2007	2
11	Characterization of viscoelastic behaviour of a molding compound with application to delamination analysis in IC packages National University of Singapore ·Ayuketang Eyong Ashu, A.A.O. Tay, Yong‐Wei Zhang, Wenhui Zhu, Ga Ram 이가람Lee	2006	13
12	Modeling of solder joint failure due to PCB bending during drop impact Jie Gu, Chwee Teck Lim, A.A.O. Tay	2005	13
13	A numerical study of the effects of temperature, moisture and vapour pressure on delamination in a PQFP during solder reflow Guojun Hu, A.A.O. Tay	2005	6
14	Mechanical properties of nanocrystalline copper and nickel Materials Science and Technology ·Kim S. Siow, A.A.O. Tay, J. Saravanabava	2004	62
15	Characterization of Electrolessly Deposited Copper and Nickel Nanofilms on Modified Si(100) Surface Langmuir ·Yan Zhang, Simon S. Ang, A.A.O. Tay, Dan Xu, E. T. Kang, K. G. Neoh, E Fainstain, C. H. A. Huan	2003	11
16	A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages A.A.O. Tay, Hsiang-Hao Chang	2003	6
17	Selective Electroless Plating of Copper on (100)-Oriented Single Crystal Silicon Surface Modified by UV-Induced Coupling of 4-Vinylpyridine with the H-Terminated Silicon The Journal of Physical Chemistry B ·Dan Xu, E. T. Kang, K. G. Neoh, Yan Zhang, A.A.O. Tay, Simon S. Ang, Claudia Stoye, Kripesh Vaidyanathan	2002	21
18	Prediction of Tensile Strength of Multilayer Knitted-Fabric-Reinforced Laminated Composites Journal of Thermoplastic Composite Materials ·Zheng‐Ming Huang, Seeram Ramakrishna, Yanzhong Zhang, A.A.O. Tay	2001	5
19	Proceedings of the 1997 1st Electronic Packaging Technology Conference A.A.O. Tay	1997	5
20	Wirebond Deformation During Molding of IC Packages Journal of Electronic Packaging ·A.A.O. Tay, K. S. Yeo, Jichuan Wu, T.B. Lim	1995	21

About A.A.O. Tay

A.A.O. Tay is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering, Mechanical Engineering, Automotive Engineering and Renewable Energy, Sustainability and the Environment, having authored 245 papers that have together received 5.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (106 papers), Mechanical Behavior of Composites (53 papers), 3D IC and TSV technologies (43 papers), Metal Forming Simulation Techniques (19 papers), Advanced Surface Polishing Techniques (18 papers), Silicon and Solar Cell Technologies (16 papers), Advancements in Battery Materials (15 papers) and Advanced Battery Technologies Research (15 papers). The work is most often cited by research in Automotive Engineering (2.2k citations), Electrical and Electronic Engineering (4.1k citations), Mechanical Engineering (1.6k citations), Mechanics of Materials (966 citations) and Renewable Energy, Sustainability and the Environment (527 citations). A.A.O. Tay has collaborated with scholars based in Singapore, United States and China. Frequent co-authors include Lip Huat Saw, Yonghuang Ye, Yixiang Shi, Mohan Kumar Kesarla, G. de Vahl Davis, M.G. Stevenson, V. Kripesh, Swapnil Dubey, T.Y. Lin and Sivanand Somasundaram. Their work appears in journals such as Journal of Electronic Packaging, Applied Thermal Engineering, Journal of Materials Processing Technology, Solar Energy and Journal of Power Sources.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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