T.C. Chai

1.1k total citations
48 papers, 868 citations indexed

About

T.C. Chai is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, T.C. Chai has authored 48 papers receiving a total of 868 indexed citations (citations by other indexed papers that have themselves been cited), including 44 papers in Electrical and Electronic Engineering, 12 papers in Mechanics of Materials and 9 papers in Mechanical Engineering. Recurrent topics in T.C. Chai's work include Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (34 papers) and Material Properties and Processing (6 papers). T.C. Chai is often cited by papers focused on Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (34 papers) and Material Properties and Processing (6 papers). T.C. Chai collaborates with scholars based in Singapore, China and United States. T.C. Chai's co-authors include Xiaowu Zhang, John H. Lau, Cheryl Selvanayagam, Kripesh Vaidyanathan, S. Seah, V. Kripesh, E.B. Liao, Navas Khan, Fa Xing and S.K.W. Seah and has published in prestigious journals such as Advanced Functional Materials, The Journal of Physical Chemistry Letters and International Journal of Fatigue.

In The Last Decade

T.C. Chai

42 papers receiving 821 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
T.C. Chai Singapore 13 821 143 143 96 94 48 868
Cheryl Selvanayagam Singapore 14 733 0.9× 114 0.8× 135 0.9× 49 0.5× 73 0.8× 39 790
Tengfei Jiang United States 14 583 0.7× 76 0.5× 132 0.9× 98 1.0× 67 0.7× 45 723
Joeri De Vos Belgium 17 797 1.0× 107 0.7× 176 1.2× 109 1.1× 40 0.4× 98 861
Chukwudi Okoro United States 18 942 1.1× 131 0.9× 212 1.5× 210 2.2× 61 0.6× 55 1.0k
Alain Phommahaxay Belgium 18 988 1.2× 199 1.4× 309 2.2× 146 1.5× 65 0.7× 93 1.1k
Kripesh Vaidyanathan Singapore 13 611 0.7× 135 0.9× 162 1.1× 56 0.6× 27 0.3× 33 718
Sarah Eunkyung Kim South Korea 16 645 0.8× 116 0.8× 110 0.8× 186 1.9× 47 0.5× 84 769
Navas Khan Singapore 15 545 0.7× 137 1.0× 132 0.9× 41 0.4× 22 0.2× 46 666
L.W. Schaper United States 15 563 0.7× 43 0.3× 117 0.8× 108 1.1× 58 0.6× 64 669
Maaike M. Visser Taklo Norway 14 526 0.6× 45 0.3× 150 1.0× 47 0.5× 37 0.4× 54 603

Countries citing papers authored by T.C. Chai

Since Specialization
Citations

This map shows the geographic impact of T.C. Chai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.C. Chai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.C. Chai more than expected).

Fields of papers citing papers by T.C. Chai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T.C. Chai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.C. Chai. The network helps show where T.C. Chai may publish in the future.

Co-authorship network of co-authors of T.C. Chai

This figure shows the co-authorship network connecting the top 25 collaborators of T.C. Chai. A scholar is included among the top collaborators of T.C. Chai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T.C. Chai. T.C. Chai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Chai, T.C., et al.. (2025). An engineering-applicable stress-life model for dovetail joints incorporating leading-edge stress gradient and micro-slip effects. International Journal of Fatigue. 203. 109271–109271.
2.
Zhan, Renming, Shiyu Liu, Hongyu Luo, et al.. (2025). Fast phase transformation of micrometer-scale single-crystal TiNb2O7 anode for Ah-level fast-charging laminated pouch cell. Journal of Energy Chemistry. 108. 685–693. 1 indexed citations
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Zhan, Renming, Shiyu Liu, Wenyu Wang, et al.. (2023). Micrometer-scale single crystalline particles of niobium titanium oxide enabling an Ah-level pouch cell with superior fast-charging capability. Materials Horizons. 10(11). 5246–5255. 8 indexed citations
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Biswas, Kalyan, Shiguo Liu, Xiaowu Zhang, & T.C. Chai. (2012). Development of numerical modeling approach on substrate warpage prediction. 462–466. 3 indexed citations
7.
Xing, Fa, et al.. (2011). Design and reliability analysis of pyramidal shape 3-layer stacked TSV die package. 129. 1428–1435. 4 indexed citations
8.
Tan, Cher Ming, et al.. (2010). Electromigration performance of Through Silicon Via (TSV) – A modeling approach. Microelectronics Reliability. 50(9-11). 1336–1340. 57 indexed citations
9.
Zhang, Xiaowu, T.C. Chai, John H. Lau, et al.. (2009). Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 305–312. 90 indexed citations
10.
Chai, T.C., Xiaowu Zhang, H.Y. Li, et al.. (2008). Impact of packaging design on reliability of large die Cu/low-κ (BD) interconnect. 27. 38–45. 11 indexed citations
11.
Chai, T.C., et al.. (2008). Angled high strain rate shear testing for SnAgCu solder balls. 623–628. 2 indexed citations
12.
Sekhar, Vasarla Nagendra, Luming Shen, Aditya Kumar, et al.. (2008). Effect of wafer back grinding on the mechanical behavior of multilayered low-k for 3D-stack packaging applications. 37. 1517–1524. 7 indexed citations
13.
Selvanayagam, Cheryl, John H. Lau, Xiaowu Zhang, et al.. (2008). Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps. 1073–1081. 80 indexed citations
14.
Sekhar, Vasarla Nagendra, T.C. Chai, S. Balakumar, et al.. (2008). Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications. Journal of Materials Science Materials in Electronics. 20(1). 74–86. 8 indexed citations
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Deng, Chun, Simon S. Ang, T.C. Chai, & A.A.O. Tay. (2004). A time-domain-reflectometry characterization technique for packaging substrates. 361–365. 1 indexed citations
18.
Premachandran, C.S., et al.. (2002). Investigation for lateral diecrack on SIP power device. 219–223.
19.
Chai, T.C., et al.. (2002). The role of surface morphology on interfacial adhesion in IC packaging. 201–207. 5 indexed citations
20.
Cui, C.Q., et al.. (2002). Surface treatment of copper for the adhesion improvement to epoxy mold compounds. 1162–1166. 17 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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