T.C. Chai
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- Electronic Packaging and Soldering Technologies 39
- 3D IC and TSV technologies 34
- Integrated Circuits and Semiconductor Failure Analysis 6
- Electromagnetic Compatibility and Noise Suppression 5
- Automotive Engineering top 5%
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- Copper Interconnects and Reliability 6
- Mechanics of Materials top 10%
- Material Properties and Processing 6
- Metal and Thin Film Mechanics 3
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- Advanced Surface Polishing Techniques 4
- Co-authors
- Xiaowu ZhangJohn H. LauCheryl SelvanayagamKripesh VaidyanathanS. SeahV. KripeshE.B. LiaoNavas Khan
- Cited by
- Electrical and Electronic EngineeringAutomotive EngineeringElectronic, Optical and Magnetic Materials
- Journals
- Microelectronics Reliability (2 papers)Journal of Electronic Materials (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)
- Partner nations
- SingaporeChinaUnited States
In The Last Decade
T.C. Chai
42 papers receiving 821 citations
Peers
Comparison fields: 5 of 34
- Electrical and Electronic Engineering 821
- Automotive Engineering 143
- Electronic, Optical and Magnetic Materials 96
- Mechanics of Materials 94
- Biomedical Engineering 143
Countries citing papers authored by T.C. Chai
This map shows the geographic impact of T.C. Chai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.C. Chai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.C. Chai more than expected).
Fields of papers citing papers by T.C. Chai
This network shows the impact of papers produced by T.C. Chai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.C. Chai. The network helps show where T.C. Chai may publish in the future.
Co-authorship network
The 25 scholars most cited alongside T.C. Chai, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2025 | 1 | |
| 3 | 2025 | 0 | |
| 4 | 2023 | 8 | |
| 5 | 2013 | 4 | |
| 6 | 2012 | 3 | |
| 7 | 2011 | 4 | |
| 8 | 2010 | 57 | |
| 9 | 2009 | 90 | |
| 10 | 2008 | 11 | |
| 11 | 2008 | 2 | |
| 12 | 2008 | 7 | |
| 13 | 2008 | 80 | |
| 14 | 2008 | 8 | |
| 15 | 2007 | 5 | |
| 16 | 2004 | 29 | |
| 17 | 2004 | 1 | |
| 18 | 2002 | 0 | |
| 19 | 2002 | 5 | |
| 20 | 2002 | 17 |
About T.C. Chai
T.C. Chai is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Electronic, Optical and Magnetic Materials, Mechanical Engineering and Ceramics and Composites, having authored 48 papers that have together received 868 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (34 papers), Material Properties and Processing (6 papers), Copper Interconnects and Reliability (6 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers), Electromagnetic Compatibility and Noise Suppression (5 papers), Advanced Surface Polishing Techniques (4 papers) and Metal and Thin Film Mechanics (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (821 citations), Automotive Engineering (143 citations), Electronic, Optical and Magnetic Materials (96 citations), Mechanics of Materials (94 citations) and Biomedical Engineering (143 citations). T.C. Chai has collaborated with scholars based in Singapore, China and United States. Frequent co-authors include Xiaowu Zhang, John H. Lau, Cheryl Selvanayagam, Kripesh Vaidyanathan, S. Seah, V. Kripesh, E.B. Liao, Navas Khan, Fa Xing and S.K.W. Seah. Their work appears in journals such as Microelectronics Reliability, Journal of Electronic Materials, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Components and Packaging Technologies and Materials Horizons.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.