Chong Ser Choong
- Electrical and Electronic Engineering top 10%
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials
- Mechanical Engineering
- Industrial and Manufacturing Engineering top 10%
- Co-authors
- Chai Tai ChongVempati Srinivasa RaoDavid HoC.S. PremachandranVasarla Nagendra SekharBatara SuryaSoon Wee HoXiaowu Zhang
- Topics
- 3D IC and TSV technologies (36 papers)Electronic Packaging and Soldering Technologies (33 papers)Additive Manufacturing and 3D Printing Technologies (8 papers)
- Cited by
- Electrical and Electronic EngineeringHardware and ArchitectureIndustrial and Manufacturing Engineering
- Journals
- Microelectronics ReliabilityIEEE Transactions on Components Packaging and Manufacturing TechnologyNational University of Singapore
In The Last Decade
Chong Ser Choong
42 papers receiving 357 citations
Peers
Comparison fields: 5 of 28
- Electrical and Electronic Engineering 340
- Biomedical Engineering 64
- Electronic, Optical and Magnetic Materials 48
- Mechanical Engineering 36
- Industrial and Manufacturing Engineering 29
Countries citing papers authored by Chong Ser Choong
This map shows the geographic impact of Chong Ser Choong's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chong Ser Choong with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chong Ser Choong more than expected).
Fields of papers citing papers by Chong Ser Choong
This network shows the impact of papers produced by Chong Ser Choong. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chong Ser Choong. The network helps show where Chong Ser Choong may publish in the future.
Co-authorship network of co-authors of Chong Ser Choong
This figure shows the co-authorship network connecting the top 25 collaborators of Chong Ser Choong. A scholar is included among the top collaborators of Chong Ser Choong based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chong Ser Choong. Chong Ser Choong is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 0 | |
| 3 | 0 | |
| 4 | 0 | |
| 5 | 2 | |
| 6 | 7 | |
| 7 | 2 | |
| 8 | 6 | |
| 9 | 2 | |
| 10 | 9 | |
| 11 | 1 | |
| 12 | 2 | |
| 13 | 1 | |
| 14 | 4 | |
| 15 | 2 | |
| 16 | 24 | |
| 17 | 2 | |
| 18 | 5 | |
| 19 | 18 | |
| 20 | 10 |
About Chong Ser Choong
Chong Ser Choong is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Electronic, Optical and Magnetic Materials, having authored 47 papers that have together received 375 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (36 papers), Electronic Packaging and Soldering Technologies (33 papers) and Additive Manufacturing and 3D Printing Technologies (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (340 citations), Hardware and Architecture (28 citations) and Industrial and Manufacturing Engineering (29 citations). Chong Ser Choong has collaborated with scholars based in Singapore, China and Japan. Frequent co-authors include Chai Tai Chong, Vempati Srinivasa Rao, David Ho, C.S. Premachandran, Vasarla Nagendra Sekhar, Vempati Srinivasa Rao, Batara Surya, Soon Wee Ho, Xiaowu Zhang and R. Mohanraj. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology and National University of Singapore.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.