K.C. Toh
Impact in
- Computational Mechanics top 2%
- Fluid Dynamics and Heat Transfer
- Mechanical Engineering top 2%
- Heat Transfer and Optimization
- Heat Transfer and Boiling Studies
- Heat Transfer Mechanisms
Papers in
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- Heat Transfer and Optimization 36
- Heat Transfer and Boiling Studies 21
- Heat Transfer Mechanisms 14
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- Fluid Dynamics and Heat Transfer 14
- Fluid Dynamics and Thin Films 8
- Lattice Boltzmann Simulation Studies 8
- Co-authors
- Teck Neng Wong (27 shared papers)John C. Chai (13 shared papers)D. Pinjala (19 shared papers)John T. M. Kennis (7 shared papers)Ivo H. M. van Stokkum (6 shared papers)Hengyun Zhang (10 shared papers)Keith Moffat (5 shared papers)Emina A. Stojković (5 shared papers)
- Journals
- International Journal of Heat and Mass Transfer (5 papers)Applied Thermal Engineering (5 papers)IEEE Transactions on Components and Packaging Technologies (4 papers)Heat and Mass Transfer (3 papers)Numerical Heat Transfer Part B Fundamentals (3 papers)
- Partner nations
- SingaporeUnited StatesNetherlands
In The Last Decade
K.C. Toh
73 papers receiving 2.0k citations
Peers
Comparison fields: 5 of 81
- Computational Mechanics 582
- Mechanical Engineering 1.0k
- Cellular and Molecular Neuroscience 299
- Plant Science 351
- Surfaces, Coatings and Films 62
Countries citing papers authored by K.C. Toh
This map shows the geographic impact of K.C. Toh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by K.C. Toh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites K.C. Toh more than expected).
Fields of papers citing papers by K.C. Toh
This network shows the impact of papers produced by K.C. Toh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by K.C. Toh. The network helps show where K.C. Toh may publish in the future.
Co-authors
The 25 scholars most cited alongside K.C. Toh, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 77 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 220 | |
| 2 | 2004 | 147 | |
| 3 | 2010 | 124 | |
| 4 | 2007 | 105 | |
| 5 | 2013 | 97 | |
| 6 | 2010 | 76 | |
| 7 | 2013 | 76 | |
| 8 | 2016 | 76 | |
| 9 | 2021 | 73 | |
| 10 | 2002 | 64 | |
| 11 | 2008 | 60 | |
| 12 | 2011 | 60 | |
| 13 | 2014 | 56 | |
| 14 | 2003 | 48 | |
| 15 | 2010 | 43 | |
| 16 | 2014 | 42 | |
| 17 | 2010 | 42 | |
| 18 | 2006 | 42 | |
| 19 | 2005 | 40 | |
| 20 | 2009 | 35 |
About K.C. Toh
K.C. Toh is a scholar working on Mechanical Engineering, Computational Mechanics, Electrical and Electronic Engineering, Biomedical Engineering and Cellular and Molecular Neuroscience, having authored 77 papers that have together received 2.1k indexed citations. Recurring topics across this work include Heat Transfer and Optimization (36 papers), Heat Transfer and Boiling Studies (21 papers), Heat Transfer Mechanisms (14 papers), Fluid Dynamics and Heat Transfer (14 papers), 3D IC and TSV technologies (12 papers), Electronic Packaging and Soldering Technologies (12 papers), Fluid Dynamics and Thin Films (8 papers) and Lattice Boltzmann Simulation Studies (8 papers). The work is most often cited by research in Computational Mechanics (582 citations), Mechanical Engineering (1.0k citations), Cellular and Molecular Neuroscience (299 citations), Plant Science (351 citations) and Surfaces, Coatings and Films (62 citations). K.C. Toh has collaborated with scholars based in Singapore, United States and Netherlands. Frequent co-authors include Teck Neng Wong, John C. Chai, D. Pinjala, John T. M. Kennis, Ivo H. M. van Stokkum, Hengyun Zhang, Keith Moffat, Emina A. Stojković, Fei Duan and K.F. Choo. Their work appears in journals such as International Journal of Heat and Mass Transfer, Applied Thermal Engineering, IEEE Transactions on Components and Packaging Technologies, Heat and Mass Transfer and Numerical Heat Transfer Part B Fundamentals.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.