Teck Guan Lim
Impact in
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Microwave Engineering and Waveguides
- Electromagnetic Compatibility and Noise Suppression
- Radio Frequency Integrated Circuit Design
- Photonic and Optical Devices
- Semiconductor Lasers and Optical Devices
- Semiconductor materials and devices
Papers in
-
- Photonic and Optical Devices 16
- Microwave Engineering and Waveguides 16
- Semiconductor Lasers and Optical Devices 14
- 3D IC and TSV technologies 13
- Radio Frequency Integrated Circuit Design 12
- Electromagnetic Compatibility and Noise Suppression 11
- Electronic Packaging and Soldering Technologies 7
- Optical Network Technologies 5
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (6 papers)IEEE Transactions on Advanced Packaging (2 papers)Journal of Lightwave Technology (1 paper)IEEE Transactions on Microwave Theory and Techniques (1 paper)2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2 papers)
In The Last Decade
Teck Guan Lim
44 papers receiving 384 citations
Peers
Comparison fields: 5 of 28
- Electrical and Electronic Engineering 390
- Aerospace Engineering 60
- Hardware and Architecture 7
- Electronic, Optical and Magnetic Materials 18
- Biomedical Engineering 42
Countries citing papers authored by Teck Guan Lim
This map shows the geographic impact of Teck Guan Lim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Teck Guan Lim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Teck Guan Lim more than expected).
Fields of papers citing papers by Teck Guan Lim
This network shows the impact of papers produced by Teck Guan Lim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Teck Guan Lim. The network helps show where Teck Guan Lim may publish in the future.
Co-authors
The 25 scholars most cited alongside Teck Guan Lim, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 0 | |
| 2 | 2024 | 1 | |
| 3 | 2024 | 3 | |
| 4 | 2024 | 0 | |
| 5 | 2024 | 1 | |
| 6 | 2024 | 2 | |
| 7 | 2022 | 1 | |
| 8 | 2018 | 1 | |
| 9 | 2017 | 2 | |
| 10 | 2011 | 1 | |
| 11 | 2011 | 66 | |
| 12 | 2010 | 58 | |
| 13 | 2010 | 1 | |
| 14 | 2010 | 6 | |
| 15 | 2010 | 8 | |
| 16 | 2010 | 12 | |
| 17 | 2009 | 8 | |
| 18 | 2009 | 10 | |
| 19 | 2008 | 7 | |
| 20 | 2008 | 3 |
About Teck Guan Lim
Teck Guan Lim is a scholar working on Electrical and Electronic Engineering, Condensed Matter Physics, Biomedical Engineering, Aerospace Engineering and Hardware and Architecture, having authored 47 papers that have together received 401 indexed citations. Recurring topics across this work include Photonic and Optical Devices (16 papers), Microwave Engineering and Waveguides (16 papers), Semiconductor Lasers and Optical Devices (14 papers), 3D IC and TSV technologies (13 papers), Radio Frequency Integrated Circuit Design (12 papers), Electromagnetic Compatibility and Noise Suppression (11 papers), Electronic Packaging and Soldering Technologies (7 papers) and Optical Network Technologies (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (390 citations), Aerospace Engineering (60 citations), Hardware and Architecture (7 citations), Electronic, Optical and Magnetic Materials (18 citations) and Biomedical Engineering (42 citations). Teck Guan Lim has collaborated with scholars based in Singapore, Japan and Taiwan. Frequent co-authors include Shan Gao, Sanming Hu, Yong‐Zhong Xiong, Soon Wee Ho, Bo Zhang, Jinglin Shi, En‐Xiao Liu, Wei-Bin Ewe, Er‐Ping Li and Xiaojun Yuan. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Advanced Packaging, Journal of Lightwave Technology, IEEE Transactions on Microwave Theory and Techniques and 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.