Qijun Lu

509 citations

28 papers · 374 indexed · h-index 12

Impact in

Electrical and Electronic Engineering top 10%
- 3D IC and TSV technologies
- Microwave Engineering and Waveguides
- Radio Frequency Integrated Circuit Design
- Electromagnetic Compatibility and Noise Suppression
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Photonic and Optical Devices
Aerospace Engineering
- Advanced Antenna and Metasurface Technologies

Papers in

Electrical and Electronic Engineering 27
- 3D IC and TSV technologies 19
- Electromagnetic Compatibility and Noise Suppression 15
- Microwave Engineering and Waveguides 11
- Radio Frequency Integrated Circuit Design 9
- Electronic Packaging and Soldering Technologies 8
- Photonic and Optical Devices 3
Aerospace Engineering 3

Co-authors: Yintang Yang Zhangming Zhu Xiaoxian LiuYang LiuXiangkun Yin Ruixue Ding Yuejin Li Fengjuan Wang
Journals: IEEE Transactions on Components Packaging and Manufacturing Technology (4 papers)IEEE Microwave and Wireless Components Letters (4 papers)IEEE Transactions on Microwave Theory and Techniques (2 papers)IEEE Transactions on Electromagnetic Compatibility (1 paper)International Journal of RF and Microwave Computer-Aided Engineering (1 paper)
Partner nations: China United Kingdom

In The Last Decade

Qijun Lu

24 papers receiving 369 citations

Peers

Countries citing papers authored by Qijun Lu

Since Specialization

Citations

This map shows the geographic impact of Qijun Lu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Qijun Lu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Qijun Lu more than expected).

Fields of papers citing papers by Qijun Lu

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Qijun Lu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Qijun Lu. The network helps show where Qijun Lu may publish in the future.

Co-authors

The 16 scholars most cited alongside Qijun Lu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Qijun Lu Line = papers co-authored together Qijun Lu links everyone, so they are left out of the graph.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

#	Work
1	Parasitic-induced multi-zero generation and port-fusion compact filter based on 3-D through-silicon via technology Microelectronics Journal ·Xiangkun Yin, Xiangyu Ma, Suzane Rodrigues da Silva, Libo Qian, Tao Zhang, Qijun Lu, Zhangming Zhu	2025	0
2	A Substrate Integrated Waveguide Filter Based on Quartz Glass Substrate with Wide Stop Band 2022 International Conference on Microwave and Millimeter Wave Technology (ICMMT) ·Cristian Pacheco Huaiquifil, Xiaoxian Liu, Zhangming Zhu, Yang Liu, Tao Zhang, Qijun Lu	2022	0
3	A T-Model With Parameter Extraction Method for Modeling 3-D Spiral Inductor IEEE Microwave and Wireless Components Letters ·Yang Liu, Xiaoxian Liu, Qijun Lu, Tao Zhang, Xiangkun Yin	2021	5
4	A Miniatured Passive Low-Pass Filter With Ultrawide Stopband Based on 3-D Integration Technology IEEE Microwave and Wireless Components Letters ·Xiangkun Yin, Fengjuan Wang, Qijun Lu, Xiaoxian Liu, Yang Liu, Yintang Yang	2021	19
5	Compact Bandpass Filter and Diplexer With Wide-Stopband Suppression Based on Balanced Substrate-Integrated Waveguide IEEE Transactions on Microwave Theory and Techniques ·Xiaoxian Liu, Zhangming Zhu, Yang Liu, Qijun Lu, Xiangkun Yin, Yintang Yang	2020	52
6	Balanced SIW BPF based on Through-Glass Vias Xiaoxian Liu, Zhangming Zhu, Yintang Yang, Qijun Lu, Xiangkun Yin, Yang Liu	2020	0
7	Physics based scalable inductance model for three-dimensional solenoid inductors Microelectronics Journal ·Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang	2020	3
8	Wideband Electromagnetic Distribution Characterization and Dielectric Analysis of Shielded-Pair Through-Silicon Via Using Recursive Approximation Algorithm IEEE Transactions on Components Packaging and Manufacturing Technology ·Alvaro La Parra-Perez, Zhangming Zhu, Yang Liu, Qijun Lu, Yintang Yang	2019	1
9	Wideband Fourth-Harmonic Mixer Operated at 325–500 GHz IEEE Microwave and Wireless Components Letters ·H. J. Derr, Qijun Lu, Dinghong Jia, Yintang Yang, Zhangming Zhu	2018	19
10	Ultra-Compact TSV-Based L-C Low-Pass Filter With Stopband Up to 40 GHz for Microwave Application IEEE Transactions on Microwave Theory and Techniques ·Xiangkun Yin, Zhangming Zhu, Yang Liu, Qijun Lu, Xiaoxian Liu, Yintang Yang	2018	55
11	Wideband Substrate Integrated Waveguide Bandpass Filter Based on 3-D ICs IEEE Transactions on Components Packaging and Manufacturing Technology ·Xiaoxian Liu, Zhangming Zhu, Yang Liu, Qijun Lu, Xiangkun Yin, Yintang Yang	2018	32
12	Wideband Electromagnetic Model and Analysis of Shielded-Pair Through-Silicon Vias IEEE Transactions on Components Packaging and Manufacturing Technology ·Alvaro La Parra-Perez, Zhangming Zhu, Qijun Lu, Xiaoxian Liu, Yintang Yang	2018	13
13	Closed-form internal impedance model and characterization of mixed carbon nanotube bundles for three-dimensional integrated circuits* Chinese Physics B ·Qijun Lu, Zhangming Zhu, Yintang Yang, Ruixue Ding, Yuejin Li	2018	1
14	Electromagnetic modeling and analysis of the tapered differential through glass vias Microelectronics Journal ·Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Lixin Guo, Yintang Yang	2018	10
15	A compact passive resonator based on through-silicon via technology for microwave applications Xiangkun Yin, Zhangming Zhu, Yintang Yang, Qijun Lu, Xiaoxian Liu, Yang Liu	2018	1
16	High-Frequency Electrical Model of Through-Silicon Vias for 3-D Integrated Circuits Considering Eddy Current and Proximity Effects IEEE Transactions on Components Packaging and Manufacturing Technology ·Qijun Lu, Zhangming Zhu, Yintang Yang, Ruixue Ding, Yuejin Li	2017	19
17	Wideband Electromagnetic Modeling of Coaxial-Annular Through-Silicon Vias IEEE Transactions on Electromagnetic Compatibility ·Qijun Lu, Zhangming Zhu, Yang Liu, Xiaoxian Liu, Xiangkun Yin	2017	17
18	Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias IEEE Transactions on Nanotechnology ·Qijun Lu, Zhangming Zhu, Yintang Yang, Ruixue Ding, Yuejin Li	2017	17
19	Electrical Modeling and Characterization of Shield Differential Through-Silicon Vias IEEE Transactions on Electron Devices ·Qijun Lu, Tunehiro Aki, Yintang Yang, Ruixue Ding	2015	50
20	Accurate Formulas for the Capacitance of Tapered-Through Silicon Vias in 3-D ICs IEEE Microwave and Wireless Components Letters ·Qijun Lu, Zhangming Zhu, Yintang Yang, Ruixue Ding	2014	17

About Qijun Lu

Qijun Lu is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Condensed Matter Physics, Materials Chemistry and Astronomy and Astrophysics, having authored 28 papers that have together received 374 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (19 papers), Electromagnetic Compatibility and Noise Suppression (15 papers), Microwave Engineering and Waveguides (11 papers), Radio Frequency Integrated Circuit Design (9 papers), Electronic Packaging and Soldering Technologies (8 papers), Graphene research and applications (3 papers), Photonic and Optical Devices (3 papers) and Carbon Nanotubes in Composites (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (360 citations), Aerospace Engineering (58 citations), Automotive Engineering (16 citations), Atomic and Molecular Physics, and Optics (41 citations) and Astronomy and Astrophysics (12 citations). Qijun Lu has collaborated with scholars based in China and United Kingdom. Frequent co-authors include Yintang Yang, Zhangming Zhu, Xiaoxian Liu, Yang Liu, Xiangkun Yin, Ruixue Ding, Yintang Yang, Yuejin Li, Fengjuan Wang and Dinghong Jia. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Microwave and Wireless Components Letters, IEEE Transactions on Microwave Theory and Techniques, IEEE Transactions on Electromagnetic Compatibility and International Journal of RF and Microwave Computer-Aided Engineering.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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