Kripesh Vaidyanathan

947 total citations
33 papers, 718 citations indexed

About

Kripesh Vaidyanathan is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Kripesh Vaidyanathan has authored 33 papers receiving a total of 718 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 6 papers in Biomedical Engineering. Recurrent topics in Kripesh Vaidyanathan's work include Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (19 papers) and Electromagnetic Compatibility and Noise Suppression (4 papers). Kripesh Vaidyanathan is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (19 papers) and Electromagnetic Compatibility and Noise Suppression (4 papers). Kripesh Vaidyanathan collaborates with scholars based in Singapore, United States and Hong Kong. Kripesh Vaidyanathan's co-authors include John H. Lau, Xiaowu Zhang, Cheryl Selvanayagam, T.C. Chai, S. Seah, S.K.W. Seah, D. Pinjala, Navas Khan, Srinivasa Rao Vempati and Qasem Ramadan and has published in prestigious journals such as Applied Physics Letters, The Journal of Physical Chemistry B and Materials Science and Engineering A.

In The Last Decade

Kripesh Vaidyanathan

33 papers receiving 678 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Kripesh Vaidyanathan Singapore 13 611 162 135 123 56 33 718
Navas Khan Singapore 15 545 0.9× 132 0.8× 137 1.0× 157 1.3× 41 0.7× 46 666
E.B. Liao Singapore 14 465 0.8× 157 1.0× 80 0.6× 47 0.4× 38 0.7× 35 530
Joeri De Vos Belgium 17 797 1.3× 176 1.1× 107 0.8× 75 0.6× 109 1.9× 98 861
A. Katsuki Japan 12 569 0.9× 223 1.4× 55 0.4× 191 1.6× 90 1.6× 69 753
Alexander B. Lostetter United States 16 949 1.6× 61 0.4× 170 1.3× 145 1.2× 26 0.5× 46 1.0k
T.C. Chai Singapore 13 821 1.3× 143 0.9× 143 1.1× 68 0.6× 96 1.7× 48 868
Cong Li China 17 834 1.4× 175 1.1× 80 0.6× 46 0.4× 65 1.2× 81 887
Viorel Drăgoi Austria 13 630 1.0× 179 1.1× 104 0.8× 52 0.4× 64 1.1× 107 707
Markus Wimplinger Austria 11 806 1.3× 270 1.7× 106 0.8× 52 0.4× 57 1.0× 75 895
L.W. Schaper United States 15 563 0.9× 117 0.7× 43 0.3× 62 0.5× 108 1.9× 64 669

Countries citing papers authored by Kripesh Vaidyanathan

Since Specialization
Citations

This map shows the geographic impact of Kripesh Vaidyanathan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kripesh Vaidyanathan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kripesh Vaidyanathan more than expected).

Fields of papers citing papers by Kripesh Vaidyanathan

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Kripesh Vaidyanathan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kripesh Vaidyanathan. The network helps show where Kripesh Vaidyanathan may publish in the future.

Co-authorship network of co-authors of Kripesh Vaidyanathan

This figure shows the co-authorship network connecting the top 25 collaborators of Kripesh Vaidyanathan. A scholar is included among the top collaborators of Kripesh Vaidyanathan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kripesh Vaidyanathan. Kripesh Vaidyanathan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Chandrappan, Jayakrishnan, et al.. (2011). Thermo-mechanical actuator-based miniature tagging module for localization in capsule endoscopy. Journal of Micromechanics and Microengineering. 21(4). 45037–45037. 5 indexed citations
2.
Ho, Soon Wee, Vasarla Nagendra Sekhar, Xiaowu Zhang, et al.. (2011). Underfill Selection, Characterization, and Reliability Study for Fine-Pitch, Large Die Cu/Low-K Flip Chip Package. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(3). 279–290. 8 indexed citations
3.
Chandrappan, Jayakrishnan, et al.. (2010). Tagging module for lesion localization in capsule endoscopy. PubMed. 49. 1890–1893. 8 indexed citations
4.
Khan, Navas, et al.. (2010). Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules. IEEE Transactions on Components and Packaging Technologies. 33(1). 184–195. 42 indexed citations
5.
Lim, Ying Ying, Srinivasa Rao Vempati, Aditya Kumar, et al.. (2010). High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP). IEEE Transactions on Advanced Packaging. 33(4). 1061–1071. 12 indexed citations
6.
Kumar, Aditya, Xiaowu Zhang, Gaurav Sharma, et al.. (2009). A novel method to predict die shift during compression molding in embedded wafer level package. 535–541. 32 indexed citations
7.
Lim, Ying Ying, Srinivasa Rao Vempati, Aditya Kumar, et al.. (2009). Demonstration of high quality and low loss millimeter wave passives on embedded wafer level packaging platform (EMWLP). 55. 508–515. 8 indexed citations
8.
Ho, Soon Wee, et al.. (2009). Underfill selection methodology for fine pitch Cu/low-k FCBGA packages. Microelectronics Reliability. 49(2). 150–162. 15 indexed citations
9.
Vempati, Srinivasa Rao, et al.. (2009). Development of 3-D silicon die stacked package using flip chip technology with micro bump interconnects. Rare & Special e-Zone (The Hong Kong University of Science and Technology). 980–987. 35 indexed citations
10.
11.
Vaidyanathan, Kripesh, Soon Wee Ho, Vasarla Nagendra Sekhar, et al.. (2008). Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150pm) Cu/Low-K Flip Chip Package. 613–619. 1 indexed citations
12.
Khan, Navas, et al.. (2008). Development of 3-D Stack Package Using Silicon Interposer for High-Power Application. IEEE Transactions on Advanced Packaging. 31(1). 44–50. 22 indexed citations
13.
Vaidyanathan, Kripesh, et al.. (2008). Patterned Metallic Nanowire Arrays Based Flip Chip Interconnects. 13. 879–884. 1 indexed citations
14.
Selvanayagam, Cheryl, John H. Lau, Xiaowu Zhang, et al.. (2008). Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps. 1073–1081. 80 indexed citations
15.
Ramadan, Qasem, et al.. (2007). Large scale microcomponents assembly using an external magnetic array. Applied Physics Letters. 90(17). 26 indexed citations
16.
Sundaram, V., Fuhan Liu, S.M. Hosseini, et al.. (2004). Ultra-high density board technology for sub-100 ?m pitch nano-wafer level packaging. 6. 125–129. 2 indexed citations
17.
Xu, Dan, E. T. Kang, K. G. Neoh, et al.. (2002). Selective Electroless Plating of Copper on (100)-Oriented Single Crystal Silicon Surface Modified by UV-Induced Coupling of 4-Vinylpyridine with the H-Terminated Silicon. The Journal of Physical Chemistry B. 106(48). 12508–12516. 21 indexed citations
18.
Papa, Francesco, et al.. (2002). Numerical calculation of developing laminar flow in rotating ducts with a 180° bend. International Journal of Numerical Methods for Heat & Fluid Flow. 12(7). 780–799. 9 indexed citations
19.
Papa, Francesco, et al.. (2000). Numerical computations of flow in rotating ducts with strong curvature. International Journal of Numerical Methods for Heat & Fluid Flow. 10(5). 541–557. 3 indexed citations
20.
Vaidyanathan, Kripesh & L. K. Doraiswamy. (1968). Controlling mechanisms in benzene oxidation. Chemical Engineering Science. 23(6). 537–550. 9 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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